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HK & LVPS for EUSO –TA / -Balloon G. Medina-Tanco , L. Santiago, H. Silva Lopez,

HK & LVPS for EUSO –TA / -Balloon G. Medina-Tanco , L. Santiago, H. Silva Lopez, F. Trillaud, C. Lopez, J. Rojas, A. De la Cruz, S. Guerrero, G. Leon. CPU. RS422. RS422-RS232 converter. SIREN. CCB. CLKB. SPI. GPS. PDMB. HOUSE KEEPING. HVPS. High Level Command &

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HK & LVPS for EUSO –TA / -Balloon G. Medina-Tanco , L. Santiago, H. Silva Lopez,

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  1. HK & LVPS for EUSO –TA / -Balloon G. Medina-Tanco, L. Santiago, H. Silva Lopez, F. Trillaud, C. Lopez, J. Rojas, A. De la Cruz, S. Guerrero, G. Leon

  2. CPU RS422 RS422-RS232 converter SIREN CCB CLKB SPI GPS PDMB HOUSE KEEPING HVPS High Level Command & Monitoring Signals 4 LVPS [4 Mon, 3 HL_Cmd] SIREN [1 Open Drain output] Analog to Digital Conversion LENSES HK connections

  3. CPU RS422 RS422-RS232 converter SIREN CCB CLKB SPI GPS PDMB HOUSE KEEPING HVPS High Level Command & Monitoring Signals 4 LVPS [4 Mon, 3 HL_Cmd] SIREN [1 Open Drain output] Analog to Digital Conversion LENSES HK connections Of course not needed in TA, but still available comm-channel if comm with TA or independent remote access is required Who turn HK on now? Anyway same protocol must be kept for HK On/Off.

  4. HK Interfaces

  5. HK module Individual boards’ functionality: PCB 05: LENSES, LVPS-PDM, LVPS-HK: (DC25-DB25). PCB 04: LVPS1-DP, LVPS2-DP: (DC37-DB25). PCB 03: SIREN-HK, CPU-HK, PDM-HK (DE9-DE9-DA15). PCB 02: CCB-HK, CLKB-HK: (DB25-DB25). PCB 01: POWER-HK, GPS-HK, HVPS-HK: (DE9-DA15-DA15).

  6. HK module Back-lid (profile from Giuseppe’s module/CAD) produced @ CCADET-UNAM HK LVPS

  7. HK production status Two HK’s were produced Currently 3 students from UNAM are at Naples for HK+LVPS integration with DP Duration of mision 3 weeks Module casing: delay of 3 days at production  will arrive next week by DHL

  8. HK module boards & Arduino

  9. HK module boards & Arduino

  10. HK Software

  11. HK Software • Software related to DP interfaces will be advanced during DP integration. • HVPS we have a channel open & should not be a problem. • PDMB there is nothing defined yet.

  12. LVPS LVPS System: 4 boards implemented in 4 separate modules in DP rack Individual boards’ functionality: LVPS-PDM: PDMB [ON/OFF: HK] LVPS1-DP: CCB, CLK, GPS [ON/OFF: HK] LVPS2-DP: CPU (& DS) [ON/OFF: HK] LVPS-HK: HK [ON/OFF: SIREN] CURRENT Boards: input 28V NOT 110V But 110 V are AC not DC, yes? So, No-break/batteries in between ? WHO do this?

  13. LVP consumption LVPS-PDM Current TA board does not work with PDM if those values for PDM are final But still the margin of tolerance must be confirmed because it is too low: < 2%

  14. CONNECTORS ON LVPS_PDM FRONT PANEL 128.4 101.7 24.33 53.04 0.36 DB25 (HK_BOARD) 12.55 50.5 19.3 26.2 0.36 DE9 (PWR_PDMB) DE9 (BATTERY) 12.55 10 4.65 6.9 0.36 30.81 92.4 10.39 Dimensiones en mm Área efectiva enmarcada por línea azul

  15. CONNECTORS ON LVPS2_DP FRONT PANEL 128.4 101.7 24.33 0.36 DB25 (HK_BOARD) 12.55 19.3 50.5 26.2 0.36 DA15 (PWR_CPU) DE9 (BATTERY) 12.55 10 6.9 4.65 39.14 6.22 6.22 92.4 Dimensiones en mm Área efectiva enmarcada por línea azul

  16. CONNECTORS ON LVPS_HK FRONT PANEL 128.4 101.7 10.87 10.87 0.36 DA15 (HK_ON/OFF) DE9 (BATTERY) 50.5 19.3 10 26.2 0.36 DE9 (HK_MON) DE9 (PWR_HKB) 10 6.9 4.65 92.4 10.39 Dimensiones en mm Área efectiva enmarcada por línea azul

  17. CONNECTORS ON LVPS1_DP FRONT PANEL En esta opción se le agregaron lo de 3 divisiones = 5.08x3 = 15.24 128.4 101.7 69.32 16.19 16.19 0.94 DC37 (HK_BOARD) 12.55 0.94 65.74 DE9 (CCB) DE9 (BATTERY) 34.54 12.55 41.44 10 0.94 DE9 (CLKB) DE9 (GPSR) 12.55 6.9 4.65 0.94 30.81 30.81 92.4 Dimensiones en mm Área efectiva enmarcada por línea azul

  18. CONNECTORS ON LVPS_HK FRONT PANEL Agregar una subdivisión mas a los otros 3 submódulos sería otra opción = 50.5+5.08= 55.58 128.4 101.7 39.14 10.87 10.87 2.06 DA15 (HK_ON/OFF) DE9 (BATTERY) 12.55 55.58 24.38 10 31.28 2.06 DE9 (HK_MON) DE9 (PWR_HKB) 12.55 10 6.9 4.65 2.06 30.81 92.4 10.39 Dimensiones en mm Área efectiva enmarcada por línea azul

  19. LVPS production status 1 LVPS set was produced

  20. LVPS-PDM

  21. PDM – Low Voltage Power Supply Board Battery connector DC-DC of FPGA-PDM Power connector (to load) Latching Relay of EC-ASIC DC-DC of EC-ASIC HK connector Latching Relay of PDM Monitoring circuit (4 Operational amplifier built-in chip) DC-DC to power monitoring circuit

  22. HK – Low Voltage Power Supply Board Battery connector Dual output DC-DC for ±12V-HK Latching Relay of 12V-HK Power connector (to load) Latching Relay of 3.3-HK DC-DC for 3.3V-HK HK connector SIREN connector for Commands Monitoring circuit (4 Operational amplifier built-in chip) DC-DC to power monitoring circuit

  23. DP – Low Voltage Power Supply Board #1 Battery connector DC-DC for CCB Latching Relay of CCB Power connectors (to load) DC-DC for CLKB To CCB Latching Relay of CLKB DC-DC for GPSR To CLKB DC-DC to power monitoring circuit Latching Relay of GPSR To GPSR Monitoring circuit (6 Operational amplifier TWO chips) HK connector

  24. DP – Low Voltage Power Supply Board #2 Battery connector DC-DC for CPU Latching Relay of DST Power connector (to load) DC-DC for DTS DC-DC to power monitoring circuit Monitoring circuit (4 Operational amplifier built-in chip) HK connector Latching Relay of CPU

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