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Metal Soldering Connectors

Metal Soldering Connectors. Developed for NA62 project. Kovar connectors 6mm diameter with a small pin to enter in the hole. 3 µm. Soldering Test with 10x10mm chips. Temperature Profile. Vacuum oven (10 -6 – 10 -7 ). 200°C for 2min. 100°C/h. 50°C/h. 160-165°C for 1h.

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Metal Soldering Connectors

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  1. MetalSolderingConnectors Developed for NA62 project Kovarconnectors 6mm diameterwith a small pin to enter in the hole 3µm

  2. Soldering Test with 10x10mm chips

  3. Temperature Profile Vacuum oven (10-6 – 10-7) 200°C for 2min 100°C/h 50°C/h 160-165°C for 1h 100°C/h

  4. 6 mm Pressure test Common development with LHCbVeLo Upgrade Solder joint withstands 700 bar ! Si thickness = 500 um Exposed Si surface is 2mm hole Limitation of the test set-up read-out at 600 bars Limitation of the pump 700 bars No failure of the soder joint preliminary prototypes size reduction and different geometries under study Silicon thickness 525 µm Inner diameter 1.6 mm

  5. SMD lab 3µm Vapor phase oven: Liquid (fluides liquides perfluorocarbonés inertes) in vapour-phase form is used to transfer the heat to the components and solder. 230°C

  6. Metal on Pyrex:

  7. Comparison 20 nmTi 50 nm Ni 200 nm Au SMD lab Oven chez Tino

  8. Future soldering TEST for NA62

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