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Economical Picosecond Laser Processing

Economical Picosecond Laser Processing. Teem Photonics. Agenda. Teem Photonics Passively Q-Switched picolasers MicroChip MicroChip UV PowerChip Fibre amplified, PQS picolasers PicoSpark PicoFlash Two-Photon Absorption microlithography µFab3D. Near Grenoble, hotbed of French technology.

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Economical Picosecond Laser Processing

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  1. Economical PicosecondLaser Processing Teem Photonics

  2. Agenda • Teem Photonics • Passively Q-Switched picolasers • MicroChip • MicroChip UV • PowerChip • Fibre amplified, PQS picolasers • PicoSpark • PicoFlash • Two-Photon Absorption microlithography • µFab3D

  3. Near Grenoble, hotbed of French technology www.teemphotonics.com

  4. Corporate background • Founded November 1998 (Spin-off Schneider Electric/GeeO) • HQ in Meylan near Grenoble • Transformed business model from telecom to commercial lasers • Pioneered integrated optical EDWATM • Acquired MIT-based picolaser line in 2005 • Successfully integrated acquisition > 6000 picolasers shipped • 40 people • Cleanroom production facility • Worldwide presence, over 15 distributors

  5. Secured Intellectual Property Teem Photonics owns or controls the intellectual property relevant to all its products: • Passively Q-Switched picosecond microlaser: • Exclusive IP rights • High power fiber technology: • License agreement with IMRA • Two Photon 3D microfabrication: • Exclusive License with Université Joseph Fourier Grenoble

  6. Agenda Teem Photonics Picolasers MicroChip and Powerchip range Lifetime and Reliability Picospark fibre amplified picolasers Value Proposition and overview Examples Two-Photon Absorption microlithography µFab3D

  7. Picolaser: the simplest ultrafast laserbased on a unique monolithic approach Laser Material Saturable Absorber Pump diode Mirrors Picolaser • A picolaser turns the continuous power of a semiconductor laser diode into a stream of high peak power picosecond pulses • Pulse width and energy quantified by microcavity design • Compact • Cost effective • Scalable • Reliable

  8. Product Overview

  9. IR and Green MicroChip Range for high repetition rate and compact size applications • MNE 1535nm, MNP 1064nm, MNG 532nm: • Ultra compact, 68.3x40.9x29mm, 250g • Option, multimode fibering • SNP 1064nm, SNG 532nm: • Sealed • Compact, 115x29x35.5mm, 270g • SNP II 1064nm, SNG II 532nm: • Sealed • Compact, 142x37x35mm, 270g • Options • MM, SM fibering • external trigger • photodiode output

  10. MNE 1535nm, MNP 1064nm, MNG 532nm:Ultra compact size 68.3x40.9x29mm

  11. SNP 1064nm, SNG 532nm:Compact and sealed

  12. SNP II 1064nm, SNG II 532nm:Up to 40kHz, over 200mW average power

  13. SFx II and STx II at 1064nm and 532nm:External trigger for control flexibility

  14. Product Overview

  15. MicroChip UV Product Range • SNV 355nm, SNU 266nm: • Sealed • Compact, 180x55x35mm, 270g • Options • external trigger • photodiode output • SNV II 355, SNU II 266nm: • Sealed • Compact • 180x60x35.5nm • 200x60x35.5nm, 300g • Options: • external trigger • photodiode output

  16. SNV 355nm, SNU 266nm:Demonstrated long lifetime

  17. SNV II 355, SNU II 266nm: Up to 40kHz, over 2µJ per pulse

  18. SFx II and STx II at 355nm and 266nm:External trigger for control flexibility

  19. MicroChip Range Offers Multiple Options • Fixed Frequency SFx series (with MLC-03A-xP0 controller) • Run at fixed frequencies, not just in free-running mode (multiple frequencies possible, up to 4kHz) • Operate as low as 10Hz • Period between pulses stable within a few pulses • Triggered STx series (also with -xP0 controller) • Change period from 500µs to 100ms, pulse to pulse • Controlled with external signal generator • Variable average power SNx series (with –xR2 controller) • Modify average power full to 25% of free-running value • Controlled by RS232 (≤100ms delay) or analog input • Synchronization option (add “-xSx” to laser P/N suffix) • Photodiode output included, for pulse monitoring

  20. Picolasers reliability • PQS microchip lasers are inherently reliable • Theory: microchip structure reduces mechanical parts versus conventional AQS lasers • Practice: used 24/7 in industrial settings from machine shops in tropics and dusty oil fields • Rigorous engineering has enhanced overall quality • Design enhancements for longer lifetimes • Upgraded integration approaches for increased laser stability • Improved cleanliness and handling

  21. Infrared engine proves > 35,000 hours lifetime • SNPII – 20 kHz Test started end 2006 and continuing • OEM Field data on previous generation shows over 5 years lifetime Time (hours)

  22. Stable average power in harsh condition 120% 100% 80% Average power 60% 40% 20% 0% 0 2000 4000 6000 8000 10000 Time (hours) • Picolaser 35°C/90%RH lifetime test to 8,000 hours:

  23. SNU 266nm reliability:Long life combined with high beam quality • Measuring energy AND beam quality: • Energy at distant aperture must exceed a specified threshold as average power and minimum light scattering are maintained over time. • Teem’s long-life 266 nm process maintains beam quality & extend lifetime • Mean-Time-To-Failure estimated at 2,000,000 hours at 95% C.I. • No random failures on 80 lasers in field for over 4 years

  24. 266nm data recorder to 25,000 hours

  25. 266nm repetition rate stability over lifetime

  26. Product Overview

  27. PowerChip Product Range:Short Pulse Duration with High Pulse Energy • PNP-M, PNG-M, PNV-M: • Integrated power supply • Sealed • Small, 311x100x149 mm, 5kg • external trigger • photodiode output • PNP-B, PNG-B, PNV-B: • Compact laser head • Sealed • Small, 250x65x42 mm, 2kg • external trigger • photodiode output

  28. 275kW of peak power at 1064nm

  29. 150kW at 532nm with 300 ps pulse

  30. 50µJ per pulse at 355nm

  31. Characteristics of PowerChip series Beam quality and stability High energy pulses 120µJ, 800ps at 1064nm 50µJ, 500ps at 355nm High peak power 275kW at 1064nm (400ps) 100kW at 355nm (400ps) 80µJ 1kHz beam at 1064nm

  32. PowerChip lasers reliability at 355nm • Lifetime results: • greater than 18 Gigashots • MTTF estimation based on real field failure rate • No random failures on 118 lasers over three years • using 95% confidence level with a time censored approach MTTF ~ 17,000,000 hours

  33. Agenda Teem Photonics Picolasers MicroChip and Powerchip range Lifetime and Reliability Picospark fibre amplified picolasers Value Proposition and overview Practical examples Two-Photon Absorption microlithography µFab3D

  34. Product Overview

  35. PicoSpark™ and PicoFlash™ • Hundreds of Picosecond Pulses • Hundreds of KiloWatt Peak Power • Hundreds of GigaWatts/cm² Peak Irradiance • 1064nm, 532nm and 355nm • Hundred kilohertz repetition rate

  36. Market positioning High Cost of ownership Low Better High Thermal Damage Low PicoSpark™ PicoFlash™ Fiber lasers Bulk DPSS lasers Femtosecond lasers Excimer lasers

  37. Technical positioning Fiber lasers Bulk DPSS lasers Low peak power Poor conversion efficiency Complex pulse generation Femtosecond lasers long cavities prevent pulses shorter than tens of nanoseconds. Large Heat Affected Zone Negligible Heat Affected Zone PicoSpark™ PicoFlash™ High peak power Efficient harmonic conversion Reduced Heat Affected Zone Price range of AQS & Fiber laser No HAZ Poor beam quality Excimer lasers Picospark™ UV IR Femto Pico Nano

  38. Near Femtosecond Laser Performance Nanosecond Laser Economics An amplified picolaser, has two sections: • Seed picolaser master oscillator, controlling the frequency • Fibre amplifier, controlling the energy per pulse • boosting the average power up to 10 W range • Achieving and peak power up to 300 kW!

  39. PicoSpark Characteristics

  40. PicoFlash Characteristics

  41. Pulse duration and energy maintained with rep. rate

  42. High irradiance : breakdown in air • Related applications implied in transparent material processing such as glass, plastics, biology

  43. Micromachining of hard materials: metals • Picospark offers low HAZ for a higher throuput than fs lasers at a fraction of the price: Tungsten 80 µm deep 40 µm wide Stainless steel 250 µm deep 80 µm wide

  44. High peak power processing and marking • Picospark micromachining of Alumina • Glass marking at 532nm and Al marking at 1064nm

  45. Glass Marking with 532nm PicoSpark Engraving on a standard microscope slide Musée des manufactures de dentelles: http://www.ville-retournac.fr/musee/anglais/index.html

  46. 10x Magnification, line width 10µm

  47. 50x Magnification, line width 10µm

  48. 100x Magnification, line width 10µm

  49. p-silicon scribing, PowerChip 355nm, 25µJ 22µm 200µm Z Y 95µm Δy=11.5µm Δz = 4.5µm Δy=19µm Δz = 3.8µm 200µm

  50. Sapphire scribing & cutting, PicoSpark 532nm 80µm

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