1 / 14

B-Stage Process For Leadless Leadframe Package (LLP)

B-Stage Process For Leadless Leadframe Package (LLP). ELGIN F BRAVO December 1, 2000 Advisors Dr. Richard Chung Randall Walberg SJSU National Semiconductor. LLP. MDIP. Leadless Leadframe Package. Project Objective.

anais
Télécharger la présentation

B-Stage Process For Leadless Leadframe Package (LLP)

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. B-Stage Process For Leadless Leadframe Package (LLP) ELGIN F BRAVO December 1, 2000 Advisors Dr. Richard Chung Randall Walberg SJSU National Semiconductor

  2. LLP MDIP Leadless Leadframe Package

  3. Project Objective • To reduce current LLP size from 3.0mm x 3.0mm to 2.0mm x 2.0mm in order to stay completive in the small appliance market.

  4. 0.5 mm 0.3 mm Proposed Solution

  5. Epoxy Bleeding 0.3mm

  6. Proposed Solution To Epoxy Bleeding Stencil coat back of wafers with a thin layer of B-stage epoxy.

  7. Properties Of B-stage Epoxy • Stencil or screen printable. • B-stageable or semicures at low temp (~100C), which removes tackiness. • Shelf life of 6 months @ 25C after semicuring. • Becomes tacky again at a 150C. • Completely cures or C-stageable at 180C.

  8. Objectives Of 1st Experiment • Determine if a 0.5mm layer of epoxy can be successfully applied onto wafer. • Determine if backcoated die can be successfully die attach onto leadframe. • Determine epoxy bond strength by conducting die shear test .

  9. Stencil Coating Of Wafers

  10. Results From B-Stage Process B-Stage process Regular process

  11. Shear (B-Stage epoxy) Shear (Standard epoxy) F F Die Shear

  12. Future Experiments • Wirebonding process • Board level reliability • Electrical testing • Moisture sensitivity level • Thermal cycling

  13. Conclusion • Backcoated die with B-Stage epoxy was successfully die attached. • Die shear test will be done by end of December. • Wirebonding is scheduled to begin in early January. • Board level reliability tests will start in early April.

  14. Thank You

More Related