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sLHC Strip Tracker Module Envelopes

sLHC Strip Tracker Module Envelopes. (Tim) WP4 Meeting Glasgow, 13 th June 2011. Overview. Development of engineering d esign for s tave layout requires knowledge of likely stave core thickness. Components Core Dimensions outer dimensions, bus-tape to bus-tape Core Envelope

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sLHC Strip Tracker Module Envelopes

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  1. sLHC Strip Tracker Module Envelopes (Tim) WP4 Meeting Glasgow, 13th June 2011

  2. Overview • Development of engineering design for stave layout requires knowledge of likely stave core thickness. • Components • Core Dimensions • outer dimensions, bus-tape to bus-tape • Core Envelope • Twists, bows local ‘roughness’, thermo-mechanical deformations • Module-to-tape adhesive • Module Envelope • Module Envelope • Use experience from ABCN25’s with likely extrapolation to ‘final’ ABCN13 modules

  3. ABCN25 Module Z Heights • SmartScope survey of one hybrid glued to a sensor • Mount wire-bonding jig on SmartCcope and measure z-height • Locate module and establish vacuum • Measure z-heights of:- • Silicon wafer • Hybrid • ASICs • Wirebonds • Capacitors

  4. Results • Wirebonds • Intended difference in loop-height is 0.2mm • 4-row wirebonding establishes on LHCbVeLo Beetle ASICs – 0.2mm bond height difference maintained. • Expect 4-row ABCN13 wirebonding to be similargiving wirebond height of 0.8mm above ASICs • Total height = 1.30 + 0.80 = 2.21mm • Capacitors • Measured height = 2.17 above local hybrid height of 0.65mm • Hybrid unsupported so measured height affected • Corrected height = 2.17 + 0.8 - 0.65 = 2.32mm

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