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Flex status

Flex status. 12/18/2001 K.Ueno Wire-bonding problem in the latest flex. Past samples and wire bonding. Fixes and improvements. Schedule & conclusion. Wire-bonding problem. The latest flex is hard to wire-bond. The latest flex improved a lot in terms of yield and circuit pattern.

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Flex status

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  1. Flex status 12/18/2001 K.Ueno • Wire-bonding problem in the latest flex. • Past samples and wire bonding. • Fixes and improvements. • Schedule & conclusion.

  2. Wire-bonding problem. • The latest flex is hard to wire-bond. • The latest flex improved a lot in terms of yield and circuit pattern. • In November, Keycom changed gold-plating method from electro-plating to chemical-plating.

  3. Past samples and wire-bonding • In general, Keycom samples were good In terms of wire-bonding. • The first sample was good in April, 2000, both for chemical-/electro-plating gold. • Samples of Aug.( chemical plating) and Oct.( electro plating) were OK this year.

  4. Fixes and improvements • Three samples of different gold-plating were made on Dec. 15. • One sample showed good wire-bonding on Dec. 16. • Keycom will study more on wire-bonding and different gold-plating on today and tomorrow.

  5. Schedule and Conclusion • As soon as an optimum gold-plating method is found, final flexes will be made quickly. • A large no. of flexes have been etched already. • As seen in the previous slide, they can make a flex and its gold-plating rather quickly and in a weekend.

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