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Heterogeneous integration

Heterogeneous integration. Presenter : Chia-Min Lin (9535811). Outline. Motivation Introduction Design concept / Fabrication process Results Conclusion Reference. Motivation. Y. – C. Tung et al., J. MEMS, 2005. Introduction. Pick/place method Connector/socket technique.

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Heterogeneous integration

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  1. Heterogeneous integration Presenter : Chia-Min Lin (9535811)

  2. Outline • Motivation • Introduction • Design concept / Fabrication process • Results • Conclusion • Reference

  3. Motivation Y. –C. Tung et al., J. MEMS, 2005

  4. Introduction Pick/place method Connector/socket technique SAM technique to assemble the LED X. Xiong et al., J. MEMS, 2003 K. Tsui et al., JMM, 2004

  5. Introduction Self-assembly, transfer, integration Low melting point solder T. Kraus et al., Adv. Mater., 2005 H. O. Jacobs et al., Science, 2002

  6. Design concept / Fabrication process Liftoff technique H. Onoe et al., MEMS’07, 2007 Stamp transfer technique

  7. Aligning and loading mechanism

  8. Results – Liftoff technique

  9. Results – Stamp transfer technique

  10. Yield and position accuracy

  11. 2D and 3D stacking of structures

  12. Bridge structure

  13. Si transfer to glass M. A. Meitl et al., Nature materials, 2006

  14. Conclusion

  15. Thanks for your attention !

  16. Reference • Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama, ”3D integration of heterogeneous MEMS structures by stamping transfer,” 20th IEEE MEMS Conference, Kobe, Japan, 2007, pp175-178. • Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama, ”Three-dimensional integration of heterogeneous silicon micro structures by liftoff and stamping transfer,” J. of Micromech. and Microeng., 17, pp1818-1827, 2007. • Kenneth Tsui, Aaron A Geisberger, Matt Ellis ,and George D Skidmore, “Micromachined end-effector and techniques for directed MEMS assembly,” J. of Micromech. and Microeng., 14, pp542-549, 2004. • Xiaorong Xiong, Yael Hanein, Jiandong Fang, Yanbing Wang, Weihua Wang, Daniel T. Schwartz, and Karl F. Böhringer, ” Controlled Multibatch Self-Assembly of Microdevices,” J. of Microelectromech. Syst., 12, pp117-127, 2003.

  17. Reference • Yi-Chung Tung, and Katsuo Kurabayashi, “A single-layer PDMS-on-silicon hybrid microactuator with multi-axis out-of-plane motion capabilities-part II: fabrication and characterization,” J. of Microelectromech. Syst., 14, pp558-566, 2005. • Heiko O. Jacobs, Andrea R. Tao, Alexander Schwartz, David H. Gracias, and George M. Whitesides, ” Fabrication of a Cylindrical Display by Patterned Assembly,” Science, 296, pp323-325, 2002. • Tobias Kraus, Laurent Malaquin, Emmanuel Delamarche, Heinz Schmid, Nicholas D. Spencer, and Heiko Wolf, “Closing the Gap Between Self-Assembly and Microsystems Using Self-Assembly, Transfer, and Integration of Particles,” Adv. Mater., 17, pp2438-2442, 2005.’ • Matthew A. Meitl, Zheng-Tao Zhu, Vipan Kumar, Keon Jae Lee, Xue Feng, Yonggang Y. Huang, Ilesanmi Adesida, Ralph G. Nuzzo, and John A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Materials, 5, pp33-38, 2006.

  18. Design concept F1~0 F2=kPDMS x APDMS k:coefficient of bonding energy F3=ksubstrate x Asubstrate A:contact area

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