DRIE for TSVs
          DRIE for TSVs. Group 2 Sasha Hoshian, Mikko Kataja, Ville Liimatainen, Mohammadreza Soleymaniha. From RIE to DRIE. High aspect ratio structures needed (e.g TSVs, MEMS...) Normal RIE too slow Increase power and pressure Etching becomes more isotropic Damage to sidewalls  DRIE.
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