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TETRAHEDRAL AMORPHOUS CARBON FILMS: DEPOSITION METHODS, PROPERTIES AND APPLICATIONS

Koszalin University of Technology. Institute of Mechatronics , Nanotechnology and Vacuum Technique. TETRAHEDRAL AMORPHOUS CARBON FILMS: DEPOSITION METHODS, PROPERTIES AND APPLICATIONS Jan Walkowicz.

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TETRAHEDRAL AMORPHOUS CARBON FILMS: DEPOSITION METHODS, PROPERTIES AND APPLICATIONS

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  1. Koszalin University of Technology Institute of Mechatronics, Nanotechnology and Vacuum Technique TETRAHEDRAL AMORPHOUS CARBON FILMS: DEPOSITION METHODS, PROPERTIES AND APPLICATIONS Jan Walkowicz Vacuum and Plasma Surface EngineeringVaPSE 2009, October 22 - 26, 2009Hejnice, Czech Republic

  2. Scope of the presentation Introduction: - types of diamond like carbon (DLC), - tetrahedral amorphous carbon (ta-C). Deposition methods and properties of ta-C films: - deposition mechanisms, - deposition methods, - correlation between growth conditions and properties. Application of ta-C films: - data storage devices, - medical implants, - antiwear applications. Summary.

  3. Introduction

  4. Introduction

  5. Introduction • hydrogen-free amorphous carbon (a-C); • hydrogenated amorphous carbon (a-C:H); • tetrahedral hydrogen-free amorphous carbon (ta-C); • tetrahedral hydrogenated amorphous carbon (ta-C:H);

  6. Introduction • The Association of German Engineers, Report VDI 2840, 2006:classification and nomenclature for diamond-like-carbon (DLC) and diamond films

  7. Introduction Elastic properties of amorphous carbon and diamond [J. Robertson] Comparison of major properties of amorphous carbon and reference materials [J. Robertson]

  8. Deposition methods and properties of ta-C films Subplantation model [J. Robertson] penetration direct knock-on (atomicpeening) relaxation • ion energy • substrate temperature

  9. Deposition methods and properties of ta-C films [J. Robertson] • the energy and velocity distribution of thespecies; • the purity of the beam and nature of the species that bombard the target; • the ambient pressure during deposition.

  10. Deposition methods and properties of ta-C films Plasma deposition Ion deposition Ion assisted sputtering Sputtering Cathodic Vacuum Arc Laser ablation

  11. Deposition methods and properties of ta-C films Cathodic Vacuum Arc Ion deposition Laser ablation • Mass-Selected Ion Beam Deposition (MSIBD) • Pulsed laser deposition (PLD) • Filtered Cathodic Vacuum Arc (FCVA) • Filtered Pulsed Arc Discharge (FPAD) • Pulsed DC-Arc-Process (PDCAP)

  12. Deposition methods and properties of ta-C films [M. Chhowalla] Ion energy range 30-400eV Max. sp3 content 90% Max. hardness70 Gpa Max. modulus 700 GPa Max. stress 10 GPa FCVA 6 GPa 10 GPa 10 GPa 30 eV 400 eV 25 nm 100 nm

  13. Deposition methods and properties of ta-C films [M. Chhowalla] FCVA 75% 35% 50C 250C 110C 180C

  14. Deposition methods and properties of ta-C films [M. Chhowalla] FCVA FCVA 75% FPAD ~250C 35% 50C 250C

  15. Deposition methods and properties of ta-C films [N.A. Marks et al.] [B. Zheng et al.] 40 eV 80 eV 120 eV 1 eV 1 eV 70 eV • monoenergetic beams with energies of 1-100 eV, • 1 eV: a low-density film (mostly sp2 bonded atoms), • 70 eV: the majority of the bulk atoms are sp3 bonded, the density is noticeably higher, • transition from sp2-rich to sp3-rich material occurs between 7 and 30 eV, • the main growth mechanism of ta-C is atomic peening (subplantation is not the primary mechanism).

  16. Deposition methods and properties of ta-C films

  17. Deposition methods and properties of ta-C films • Substrate temperature and ion energy effect on the microstructure of carbon films produced using FCVA method[D.W.M. Lau et al.] • average ion energy: 10 eV – 820 eV, • DC BIAS voltage: from -25 V to -800 V, • substrate temperature: from room temperature to 640C, • deposition rate: 0.15 – 0.4 nm/s

  18. Deposition methods and properties of ta-C films [D. Lau et al.] ta-C vertically oriented sp2 sheets(< 10 Ω/nm) sp3

  19. Deposition methods and properties of ta-C films [D. Lau et al.] 240C

  20. Deposition methods and properties of ta-C films [D. Lau et al.] 440C

  21. Deposition methods and properties of ta-C films [D. Lau et al.] 640C

  22. Deposition methods and properties of ta-C films [D. Lau et al.] • Temperatureinducedoriented growth of sp2-rich material • ion energy 40 eV ta-Condiamondsubstrate 120atomsdeposited 200atomsdeposited 500atomsdeposited [M. B. Taylor et al.]

  23. Deposition methods and properties of ta-C films [D. Lau et al.] ta-C low stress ta-C a-C

  24. Application of ta-C films DLC coatings for magnetic storage

  25. Application of ta-C films Damping of surface fluctuations through impact-induced downhill currents MD simulation of the impact of 4000 atoms 0.12 [C. Casiraghi et al.]

  26. Application of ta-C films DLC coatings as biocompatible materials • Blood interfacing implants: • minimal macrophage attachment, • maximal albumin/fibrinogen adsorption ratio. • Load bearing implants: • elimination of wear debris, • good biomechanical performance.

  27. Application of ta-C films [W. J. Ma et al.] Macrophage morphology a-C:H (CH4) Ta-C a-C:H (C2H2) Albumin and fibrinogen adsorption Albumin/fibrinogen adsorption ratio

  28. Application of ta-C films Wear debris Load bearing implant(hip joint) High energy FPAD (6 kV/13 kA/15 μs/600 eV) • acetabular caps and femoral heads made of AISI 316L, • mechanically polished (roughness of 5-10nm), • 40-100μm of ta-C (AD) deposited by FPAD, • 15 million cycles on hip joint simulator according to ISO9225 [E. Alakoski et al.]

  29. Application of ta-C films DLC coatings for antiwear applications • Cutting and forming tools, automotive parts: • good hardness and adhesion, • good wear and corrosion resistance, • good high temperature toughness

  30. Application of ta-C films Pulsed Arc Discharge on Carbon Target,50 Adc / 1600 A, 300 µsec

  31. Application of ta-C films [W. Grimm] [A. Czyżniewski] Particle rich region Particle free region Running in process 0,5  0,15 ta-C  SHC Pulsed Arc Discharge on Carbon Target,50 Adc / 1600 A, 300 µsec

  32. Application of ta-C films • Properties of SHC (ta-C) coatings [W. Grimm] • Coating thickness < 2.0 µm • Hydrogen content without H2 • Hardness: • Nano-Intender, L=10 mN > 4000 HV0.001 ...5000 HV0.001 • E-modulus > 450 GPa • Adhesion on HSS, VHM HF1 (VDI3824) • Structure ta-C • sp3-content > 70%  • Wear coefficient: • - calo, dry, WC-ball < 10-16 m3/Nm • with diamond emulsion < 10-15 m3/Nm • oscillating steel ball, dry < 10-16 m3/Nm  • Friction coefficient < 0.15

  33. Application of ta-C films [W. Grimm] Tools for punching Motor components Drills

  34. Application of ta-C films ta-C coatings for hardmetal woodcutting tools [M. Hakovirta] Cr/ta-Cmulti Cr/ta-Cmono Developmental Project No. UDA-POIG.01.03.01-32-052/08-00: „Hybrid technologies for woodworking tools modification”within the Operational Programme Innovative Economy POIG 2007-2013

  35. Application of ta-C films [M. Hakovirta] Cr/ta-Cmulti Cr/ta-Cmono Developmental Project No. UDA-POIG.01.03.01-32-052/08-00: „Hybrid technologies for woodworking tools modification”within the Operational Programme Innovative Economy POIG 2007-2013

  36. Application of ta-C films TiN/TiAlN 3,5 μm Cr/ta-Cmulti Cr/ta-Cmono Developmental Project No. UDA-POIG.01.03.01-32-052/08-00: „Hybrid technologies for woodworking tools modification”within the Operational Programme Innovative Economy POIG 2007-2013

  37. Summary 1. The specific properties that distinguish the ta-C films from other DLC coatings are:- the highest content of sp3 bonding,- the highest hardness and Young modulus,- the highest level of intrinsic stress,- the highest thermal stability 2. For deposition of ta-C films the stream of energetic carbon ions is necessary. 3. The main mechanisms of ta-C growth are subplantation and atomic peening. 4. The critical parameters in ta-C films deposition is ion energy and substrate temperature. 5. Depending on deposition method ta-C films can possess properties required in electronic, biomedical and anti-wear applications.   

  38. References S. Aisenberg and R. Chabot, Journal of Applied Physics 42 (1971) 2953-2958. J. Robertson, Materials Science and Engineering R 37 (2002) 129-281. The Association of German Engineers, Report VDI 2840, 2006. Y. Lifshitz, Diamond and Related Materials 5 (1996) 388-400. M. Kamiya et al., Vacuum 83 (2009) 510–514. D. W. M. Lau et al., Journal of Applied Physics 105 (2009) 084302-1-6. D. W. M. Lau et al., Carbon 47 (2009) 3263–3270. V-M. Tiainen, Diamond & Related Materials 17 (2008) 2071–2074. M. B. Taylor et al., J. Phys.: Condens. Matter 21 (2009) 225003 (9pp). B. Zheng et al., Carbon 43 (2005) 1976–1983. M. Hakovirta et al., Diamond and Related Materials 4 (1995) 1335-1339. M. Chhowalla, Diamond and Related Materials 10 (2001) 1011-1016. J. Zhu et al., Vacuum 72 (2004) 285–290. V. N. Inkin et al., Diamond and Related Materials 10 (2001) 1003-1108. A. C. Ferrari et al., Diamond and Related Materials 11 (2002) 994-999. E. Alakoski et al., Diamond and Related Materials 12 (2003) 2115-2118. E. Alakoski et al., Diamond and Related Materials 15 (2006) 34-37. J. Filik, Spectroscopy Europe 17 (2005) 10-17. A. C. Ferrari and J. Robertson, Physical Review B 61 (2000) 14 095-14 107. A. C. Ferrari, Diamond and Related Materials 11 (2002) 1053-1061. C. Casiraghi et al., Materials Today 10 (2007) 44-53. C. Casiraghi et al., Diamond and Related Materials 14 (2005) 913-920. A. C. Ferrari, Surface and Coatings Technology 180 –181 (2004) 190–206. J. Robertson, Tribology International 36 (2003) 405–415. A. Grill, Diamond and Related Materials 12 (2003) 166–170. Q. Zhao et al. Journal of Colloid and Interface Science 280 (2004) 174-183. W. J. Ma et al. Biomaterials 28 (2007) 1620-1628. E. Alakoski et al., The Open Orthopaedics Journal, 2008, 2, 43-50. M. Hakovirta, Diamond and Related Materials 8 (1999) 1225–1228. M. G. Faga and L. Settineri, Surface and Coatings Technology 201 (2006) 3002–3007. Acknowledgements: Publication part-financed by the European Union within the European Regional Development Fund

  39. Thank you for your attention!

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