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Pin assignment on hybrid

Hybrid design status. Pin assignment on hybrid. Vienna proposed pin assignment. APV hybrid by Princeton. Niigata. Tajima. Electrical circuit is same as Vienna’s. Tsuboyama. SVD2 grounding scheme. The Hybrid. Old: hybrid implemented in AlN for heat sink purposes => expensive

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Pin assignment on hybrid

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  1. Hybrid design status Pin assignment on hybrid Vienna proposed pin assignment

  2. APV hybrid by Princeton Niigata Tajima Electrical circuit is same as Vienna’s

  3. Tsuboyama SVD2 grounding scheme

  4. The Hybrid Old: hybrid implemented in AlN for heat sink purposes => expensive => very fragile, many broken boards during production New: implemented in FR4 => need to redesign the heat sink scheme Cu on backside 250 through holesfilled with Cuto sink heat intoback plane Version A. (version b. for SVD2.1) Common GND

  5. We need to dissipate about 2 W per hybrid. The heat sink scheme Old:AlN boards, Cu heat spreader New:FR4 boards with Cu backplane, 250 through holes under VA1TA FEE chips, TPG (thermal pyrolytic graphite) heat spreader, Cu washers

  6. TPG Cu: 390 W/mK AlN: 280 W/mK TPG: ~1350-1700 W/mK TPG is less briddle than we feared, all machining done by GE Advanced Ceramics TPG

  7. Beamline test • October • In front of ZDLM=>Too high background? • The next maintenance • Dec 14. 10 days beam run. • Long shutdown until February • Check occ. reduction with another method • Check with strong b source?

  8. Assembly • Princeton/Melbourne • Mechanical sample DSSD:OK • FLEX:OK • Hybrid =>Outer shape dimension fixed:Dummy • Bridge. Not yet. • Send those for test assembly work • Jig design • Check procedure

  9. 2DSSD(long half ladder) test in Vienna Subject: Re: [svd_ml:1271] Re: SVD meeting agenda for Dec 7 From: Markus Friedl <friedl@hephy.oeaw.ac.at> To: Takeo Kawasaki <kawasaki@hep.sc.niigata-u.ac.jp>, toru.tsuboyama@kek.jp cc: Christian Irmler <irmler@hephy.oeaw.ac.at>, Manfred Pernicka <pernicka@hephy.oeaw.ac.at> Date: Wed, 6 Dec 2006 23:47:44 +0100 (MET) kawasaki-san, tsuboyama-san, concerning the item "Two DSSDs test", the status in vienna is that we have finished the design of the jig needed to assemble such a 2-DSSD module today and i will give it to the workshop tomorrow morning. the concept for other mechanical parts (like frame, cover etc) is done and drawings are being prepared by irmler-kun. i am sure this module will be finished by mid-january (institute is closed between 22 dec and 1 jan due to x-mas vacation), maybe even earlier.

  10. Hybrid bias scheme considering the biasing scheme of SVD2.5/3, i realized that it is impossible to have the local GND connection of the (floating) supply voltages at the front-end hybrid only and measure detector bias currents (on the repeater). so either (1) we keep this biasing concept (commong grounding point as close as possible to the sensor -> minimizing (common mode) noise) and forget about monitoring individual bias currents or (2) we connect local GND at the MAMBO/REBO and then bias monitoring is possible (=same as SVD2). i assume you prefer (2). please let me know your opinion.

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