High Frequency Devices (FIT Products)

1. High Frequency Devices(FIT Products) Module Business Unit Module Device Company Matsushita Electronic Components Co., Ltd.

2. Core Technology Goal FIT Printing RF Simulation • High-Q • Narrow Tolerance Multi-Layer in the Rigid Core Rigid Core • Low Loss • High Attenuation • Narrow Tolerance Multi-Layer • Narrow Tolerance

4. The Construction of Transfer Printed Devices for Mobile Communications CONFIDENTIAL Conventional Devices (Low Temperature Co-fired Ceramic) Transfer Printed Devices (Film Intaglio Transfer) Item Printed insulating layer and Printed Green capacitor Printed sheet Alumina inductance Surface side substrate (multi layer) Comparison of structure " FIT ” Printed printed capacitor inductance Back side (multi layer) Printed resistor ● Screen print: 75 μ m ● Transfer printing: 20μm ● Multi-layer lamination: to 10 layers ● 3 Layers= Low profile (Max. 0.53mm) Features ● Large size tolerance ● Excellent heat radiation. (8 times LTCC) ● Capacitor tolerance is 5 to 10% ● Q value of inductance is 60 at 1Ghz

5. Comparison of Screen & Film Intaglio Transfer Printing CONFIDENTIAL 20μ 20μ 20μ Film Intaglio Transfer Printing Technology 75μ 75μ 5μ Screen Printing Technology

6. 100 50 Q of Transfer Printed L 30 20 L )Q nH 10 L( 5 Q of Conventional Printed L 3 Photo:10nH Transfer Printed L 2 1 1 3 10 30 100 300 1000 Frequency(MHz) Q of L = 10nH ( 2012size ) Superior Q-factor of Film Intaglio Transfer printed inductance CONFIDENTIAL 20 m μ 5 m 75 m μ μ 20 m μ The Figure of the Transfer Conventional Printed L Printed Inductor Section

7. - Features • Super-miniature and multi-functional devices are • accomplished by Film Intaglio Transfer printing that • allows a width of 20 micron between wires and leads. • Excellent high frequency characteristics are obtained by • the Low impedance characteristics of the fine printed • substrates and advanced micro-wave simulations. • The thickness of 0.6mm is accomplished by multi- • functional-substrate with printed L,C,R. • Applications WLAN,Portable Phones, Base Stations for Mobile • communications.

8. 2.0 1.0 1.6 1.6 1.6 1.6 0.5 0.6t max 0.6t max 0.6t max 1.25 1.6 0.8 0.8 0.8 3.2 3.2 1.6 1.6 1.6 1.6 0.8 2.0 2.0 1.6 1.6 1.25 1.25 for Triple/Quad Band for Dual Band 0.8 0.8 2.0 1.25 2.0 1.0 3.2 1.25 0.5 1.6 Road Map of HF Devices 2002 2003 2004 2005 Down Sizing Balun Coupler Divider Thin Type for Module Splitter Including All Passive (L, C, R) Components Integration Dual Band Coupler Coupler with Filter Divider with Filter Diplexer GSM/DCS, AMPS/PCS & PDC800/1.5 Multi-Layer in the Rigid Core Multi-Function Ceramic Device Filter Notch Filter Low Pass Filter High Pass Filter Band Pass Filter Frequency & Applications … 2GHz 2 - 5GHz 5 - 10 GHz 10 GHz … GSM, DCS, PCS, PDC, CDMA W-CDMA, Bluetooth, Cordless Phone MMAC, W-LAN, ITS

9. for W-CDMA

10. for CDMA 800

11. for PDC 800

12. for PDC 1500

13. for GSM

14. for DCS

15. for Dual/Triple/Quad Band

16. for CELL

17. for PCS (PHS, DECT)

18. for W-LAN (Bluetooth, Cordless)