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Quality System

Quality System. Q4, 2017. ChipMOS Quality Policy. ChipMOS IS DEVOTED TO THE FOLLOWING CUSTOMER FOCAL POINTS WITH THE CONSCIOUSNESS OF CONTINUAL IMPROVEMENT AND AGGRESSIVELY FIT CUSTOMER EXPECTATION TO SATISFY CUSTOMER. 南茂秉持著持續改善的精神，致力於以下顧客關注事項，積極實現客戶期望，以達客戶滿意。.

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Quality System

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  1. Quality System Q4, 2017

  2. ChipMOS Quality Policy ChipMOS IS DEVOTED TO THE FOLLOWING CUSTOMER FOCAL POINTS WITH THE CONSCIOUSNESS OF CONTINUAL IMPROVEMENT AND AGGRESSIVELY FIT CUSTOMER EXPECTATION TO SATISFY CUSTOMER. 南茂秉持著持續改善的精神，致力於以下顧客關注事項，積極實現客戶期望，以達客戶滿意。 ON TIME DELIVERY OF PRODUCTS WHICH MEET OR EXCEED CUSTOMERS’ QUALITY AND RELIABILITY REQUIREMENTS AT A COMPETITIVE COST. 產 品 品 質: 符 合 客 戶 需 求 產 品 成 本: 具 市 場 競 爭 力 產 品 交 期: 準 時 服 務 客 戶 QUALITY COST DELIVERY

  3. Milestones of ChipMOS Quality System CSQ : Chinese Society for Quality Plan CNLA : Chinese National Laboratory Accreditation (ISO 17025) ISO9001 TS16949 ISO14001 Certified OHSAS 18001 Certified IATF 16949 Certified QC080000 Certified ISO17025 Certification - Chemical Analysis ISO17025 Certification - Electricity - Temp. - Electrical Test Quality Award (CSQ) SONY GP (Tier 2) Certified Company wide EICC Compliance ISO 27001 Certified ChipMOS 1997 ~ 2002 2003~2007 2008~2012 2013~2017 ISO9002/ISO14001/QS 9000 Certified Hsinchu ISO 9001 ISO /TS16949 Certified ISO14001:2004 Certified ANS/ESD S20.20 ISO9002/ISO14001/QS 9000 Certified SONY GP (Tier 1) Certified ISO14064 Greenhouse Gas Tainan EICC VAP ISO16949/ISO14001/ OHSAS18001 Certified (Logic Test/Memory Test) ISO9001/ISO14001 Certified (Bumping) Chupei/ HuKou S3

  4. Proven ChipMOS Quality ISO/TS 16949:2009 ISO9001:2015 ISO 27001:2013 QC-080000:2012 Waiting for IATF 16949 Certification GHG VerificatonStatement ISO/IEC 17025 ISO 14001:2004 OHSAS 18001:2007 S4

  5. ChipMOS Quality Management System ChipMOS develops process-oriented QMS to identify and meet customer’s requirements and expectations in an effective and efficient manner to achieve competitive advantage. CUSTOMER REQUIREMENT & EXPECTATION CUSTOMER SATISFACTION Continuous improvement of the quality management system Corrective & Prevention, Continual Improvement System P A Human Resource System • Training • Qualification • Empowerment & Motivation Management/ Strategy Planning Process • Adv. Tech development • Business plan • Strategy planning • Management review • Organization planning Monitor, Measurement, & Analysis System • Data analysis • Process performance • Internal Audit • Supplier performance • Inspection • Customer satisfaction Investigation D C Output Input Production Process • Purchasing • Warehouse Mgt • Production • Measurement & Prod EQ Mgt • Nonconformance Prod Mgt • Stock, Shipping Customer Requirement Process • Market Investigation • Identification of customer needs • Customer order, contract review • Customer Service (Satisfaction Complaint) APQP Process • APQP • Process Planning Production Planning Process • MRP/CRP/CPS • Resource plan • Material purchasing plan Product S5

  6. Continuous Improvement (System) • Annual goal setting • Management Commitment on continuous improvement Management Committee Quality Goal Product Control • Calculate with cost category prevention cost, appraisal cost, internal failure cost, external failure cost • Analysis with cost Index Quality Cost Management Review Dept. Manager Dept. Manager • PIT team up with major process issue • QC story implementation • QC tools application • PIT conference award Process Improvement Team Cross Function Engineers & Staffs Engineers & Staffs • Quality awareness promotion • ID conference award • Benefit prize for reward IDEA BOX Company Wide Shop-floors

  7. Failure Mode • Influence to Product • Possible Cause • Detection Method • Product Characteristics • Process Parameters Control Method PROCESS CAPABILITY 100% • Data Sheet • Check Sheet • SPC Applications • Responsibility • Corrective Action • OCAP (Out of Control Action Plan) MONTH 40 60 20 Cpk >= 1.67 50 30 20 1.33 <= Cpk <1.67 0 0 10 Cpk < 1.33 NO Target :Cpk >= 2.0 (based on customer requirement) YES • Small Quality Variation • Mean Value to Target Continuous Improvement (Product)

  8. Supplier Quality Assurance Request New Suppliers Qualification Phase I Evaluation Phase II Qualification Phase III SPC SPC Suppliers Capability Maintenance Suppliers Capability Improvement Phase I STC STS IQC Ranking Auditing Win/Win Phase II

  9. Supplier Quality Assurance ChipMOS Supplier 1. Annual audit 2. Ranking (Quarterly) 3. QNR / PNR 4. Spec. / Drawing 5. New supplier qualification 1. Quality meeting 2. Abnormality handling 3. RMA handling 4. Review customer feedback 1. C of C 2. Monthly report 3. Cpk data 4. Improvement report 5. Regular supplier meeting (Quality & Technology ) Continuous improvement 1. 8D System 2. QIP 3. SPC

  10. IQC gate 1. Wafer inspection . Optical inspection . Wafer ID 2. Material inspection . Optical inspection . Dimension Assembly Quality Control Flow Materials Suppliers Wafer in Wafer - mount & dicing Die & Wire Bonding Molding Marking Plating Trim & Form Visual & Outgoing Control Wafer sorting Flow Testing IPQC Gate - Optical inspection - Adhesion . die shear test - Bondability . wire pull test . Ball shear test IPQC Monitor - Optical inspection - Mark adhesion IPQC Monitor - Optical inspection - Dimension . Outline . Coplanarity IPQC Gate - Optical inspection - Purity IPQC Monitor - Optical inspection - Moldability (x-ray) . Wire sweep . Void - Parameter check . Temperature IPQC Monitor - Optical inspection - Plating thickness - Solderability . Sn content . Soldering test - Contamination • FQC/OQC Gate • - Optical inspection • . Marking • . Lead • . Package • Packing check • Document check Control Item

  11. Incoming control FT Quality Control Flow IQC gate 1. PKG inspection . Lead . Package body . Marking 2. Consumable material inspection . Appearance . COA Customers • PKG : • Elec. testing • & burn in • ( & marking ) • PKG : • V/M inspection • (lead & mark • Scanning) Packing Outgoing Control Shipping • Assembly • Subcontractors • In-house Flow Vendors FQC gate - PKG Optical inspection . Lead . Package . Marking PQC gate - Visual inspection . Packing material . Label content . Packing method - Packing . QC seals QC Control Item OQC gate - Document check

  12. Incoming control WS Quality Control Flow IQC gate - Wafer inspection . Appearance . Wafer ID - Consumable material inspection . Appearance . COA • Wafer : • CP testing • & • laser repair • Wafer : • V/M inspection • (probing mark • & Ink) Packing Outgoing Control Customers Shipping Flow Vendors OQCgate - Label content - Documents check - Packing check FQC gate - Wafer inspection . Appearance . Document check QC Control Item

  13. Incoming control WB Quality Control Flow IQC gate - Wafer inspection . Appearance . Wafer ID - Chemical, Reticle, Target . Appearance . COA • Wafer : • Bumping • Wafer : • V/M inspection • (AOI) Packing Outgoing Control Customers Shipping Flow Vendors FQC gate - Wafer inspection . Appearance . Document check OQC gate - Label content - Documents check QC Control Item

  14. LCDD Quality Control Flow (TCP/COF) IQC gate Materials Suppliers 1. Wafer inspection . Optical inspection . Wafer ID 2. Material inspection . Optical inspection . Dimension Wafer in ILB Potting Marking Testing Visual & Outgoing Control Wafer - mount & dicing Flow Wafer sorting Shipping • FQC/OQC Gate • Optical inspection • Packing check • Document check • IPQC Monitor • Dimension • IPQC Gate • Optical inspection • Document check Control Item IPQC Monitor - Bondability . Total height . Bend height (TCP) . Edge gap (COF)

  15. LCDD Quality Control Flow (COG) IQC gate Materials Suppliers 1. Wafer inspection . Optical inspection . Wafer ID 2. Material inspection . Optical inspection . Dimension Wafer in AOI P/P Visual & Outgoing Control Wafer - mount & dicing Wafer sorting Flow Shipping • IPQC Gate • Optical inspection • Document check QC Control Item • FQC/OQC Gate • Optical inspection • Packing check • Document check

  16. Preconditioning Reliability Stress Reliability Stress Environment Mechanical Environment Mechanical FT or O/S Judgement FT Judgement Reliability Test (Procedure) LCDD (TCP/COF) APG (TSOP/BGA/QFP/QFN) Samples In Samples In Report Issued Report Issued

  17. Reliability Test (Capability) TH TST HT-SLT PCT TCT THB LT-SLT HAST Reflowing All testing conditions follow and meet JEDEC, MIL and JEITA International Standards

  18. Failure Analysis (Package Level)

  19. Fix problem or Meet requirement at once by effective action. Effective Action In-time, On-time to implement customer’s requirement / specification. Timely Implementation 24 hrs, 365 days, non-stop operation to carry on customer’s requirement. Aggressive Operation From customer’s view point to consider customer’s requirement. Full-Scale Consideration Not only a subcontractor, but customer’s virtual fab. & trustable partner. Real Information Total Customer Satisfaction

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