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We offer design services for those customers who either have too much on their plate, would rather have the design laid out properly or have no access to doing the design themselves. We can also do design modifications to existing gerber files. Our team can turn around designs in 2-7 days depending on the complexity and need for speed. Whether you have a basic schematic and print or a sketch on paper we can execute full gerbers that are yours to keep.<br>
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DESIGN • We offer design services for those customers who either have too much on their plate, would rather have the design laid out properly or have no access to doing the design themselves. We can also do design modifications to existing gerber files. Our team can turn around designs in 2-7 days depending on the complexity and need for speed. Whether you have a basic schematic and print or a sketch on paper we can execute full gerbers that are yours to keep.
FABRICATION Flex Interconnect can offer you rapid prototyping builds through volume production. We can support flex builds as fast as 3 days and rigid-flex as fast as 7 days. At Flex Interconnect we believe in reviewing your files and making suggestions BEFORE we manufacture your design. All files are gone over with a fine-tooth comb and collaborations with our customers is how we maintain our reputation of being a true partner as an extension of your company’s offerings.
ASSEMBLY Assembly Solutions include not only part population, but also testing and conformal coating. We offer both quick turn assembly onshore as well as low cost volume assembly offshore. Our technicians are certified to J-Std soldering.
APPLICATIONS MANUFACTURING We offer the most comprehensive applications engineering support utilizing our combined 75 years of experience and knowledge of flex circuit technology. Our services include material selection, signal integrity analysis, design guidelines and recommendations for termination and cost reduction. We also offer free educational seminars on various topics of interest as well as free failure analysis. We have a very thorough free DFM program for our customers. This includes analysis of the design, bend area considerations, strain relief considerations, impedance calculations, recommendations for material stack up taking into account several application requirements such as bend radius and environmental conditions.
RESEARCH & DEVELOPMENT We have strong partnership with Dupont, Tatsuta and Insulectro, that has allowed us to work with the latest materials and technology. We have been the first ones in the world to produce some of the latest technology. Stretchable Flex Circuit Zeta-Lock Pre pregbased thinnest rigid-flex HDI flex using Ormet paste technology Embedded capacitor in flex Reinforced flex with Dupont LG film LED applications using Coolam laminate Adhesivelesscoverlay based rigid-flex Dupont MT and MT+ coverlay for high thermal conductivity Dupont ultrathin adhesives and coverlays
COST REDUCTION In general, designing your board around our “standard specs” (Difference between Standard and Advanced) will yield you less expensive pricing. We have very qualified Solutions Providers that can review your design and make cost savings suggestions. Volume Discounts Multi Year Contract
FAILURE ANALYSIS Design Analysis X-Sectioning Dage X-Ray Tool
THANK YOU! http://www.flexinterconnect.com/
