1 / 18

A Partnership Foundry Business Model

A Partnership Foundry Business Model. Dr. Jackson Hu Chief Executive Officer Oct. 16, 2003 Beijing, China. Foundry Business Overview. Three good quarters. Is this a persist recovery? Strong cell phone and DVD demand Oversupply for matured process technologies

gavrilla
Télécharger la présentation

A Partnership Foundry Business Model

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. A Partnership Foundry Business Model Dr. Jackson Hu Chief Executive Officer Oct. 16, 2003 Beijing, China

  2. Foundry Business Overview • Three good quarters. Is this a persist recovery? • Strong cell phone and DVD demand • Oversupply for matured process technologies • 20% CAGR for foundry business in next five years • Wireless and digital entertainment products will drive the next round of silicon demand • The challenge for foundry industry is how to make profit!

  3. What It Takes to Do Foundry Business Today? Knowledge : --. Understand customers' applications --. Understand customers' system requirements Process Technology : --. Meet customers’ existing product performance requirements --. Meet customers’ product roadmap Design Support : --. IP/Library requirements --. Process related IP ready ahead of time Operation : --. New product / project success --. On time delivery --. Yield improvement

  4. Trade-offs Facing SoC Designs • Architecture partition between hardware and software • General purpose RISC/DSP vs. hardwired • System partition between digital & analog, on-chip or off-chip • Power consumption considerations • Cost implications • Overall system performance

  5. GPS Receiver RFBits Baseband Processor LNA Cellular Receiver Audio Codec Audio out RFAnalog Baseband RL m Controller Flash Memory RF Codec DSP RL SRAM/ DRAM Memory PA RFAnalog Baseband Audio Codec Audio in To Codec,RF Keyboard, Display & Pwr Mgmt Cellular Transmitter Bluetooth Radio RFBits Baseband Processor RFBits A Generic 3G Cell-Phone Design

  6. Impact of New EDA tool CapabilitiesCadence X Architecture • Courtesy Cadence

  7. IP is Most Critical for Fabless Customers • Availability • Standard cell library, IO, memory blocks are basic requirements. • Analog IP and high-complexity functional IPs are needed for SoC designs. • Portability & Re-usability • Cost • Methodology (Design Flows and Tools) • IPR

  8. IP Needed for 3G Cell Phone 3D Graphics FM, MP3, DAB GPS, EOTD MPEG4, JPEG GSM-GPRS-EDGE- WCDMA/CDMA2000 /STD-SCDMA (RISC, DSP, Protocol Stack, System BIST) Speech to Text, Voice Recognition WiFi, Bluetooth

  9. UMC and the Partnership Foundry Business Model

  10. UMC Foundry Revenue Trend US$ billion 3.32 UMCJ (exchange rate 116) UMC (exchange rate 35) 2.16 1.99 1.77

  11. Balanced Application Mix (Year 2002) Other2% Memory 6% Communication32% Computer28% Consumer32%

  12. UMC’s Current Fabs Diversified manufacturing in Japan, Singapore & Taiwan Fab 6A Fab 8E UMCJ Fab 8AB Fab 8F UMCi Fab 8C & D Fab 12A

  13. Partnership Foundry • Customer is our Way, our Truth, and our Life. • Focused cooperation and quality support • Win with UMC.

  14. Partner Collaborative Win-Win Effort Process Engineer Designer, Application Product Planner IPs Customer Engineer and Sales -Market & Applications- -Roadmap, Plan Ahead- -Best Fit Technology- -Best Fit IPs- Outsource Director The Partnership Model

  15. Partner Success Example Revenue $ million Source: Company information

  16. 1T-SRAM13, eFuse13, eDRAM1 ADC/DACAFE eDRAM1, ADC/DAC3 1T-SRAM13, eDRAM4, eFlash1, ADC/DAC3 IP by Application Memory MM CPU/DSP Peripheral Application Specific SSTL3, LVDS4 S-ATA4, USB13 PCI-Exp4 Serdes4 1G PHY/MAC2 ARM13, MIPS13, MPU/DSP13, Teak Communication Bluetooth4QPSK Bluetooth4 MPEG2/44 1394,DMA IrDA Com-puting ARM13, MIPS13, MPU/DSP13 PCI-X/Exp4, USB13, 1G PHY/MAC2 Smartcard MPEG2/44 AC3/4,QPSK QAM, TMDS IrDA HSTL4, USB13DVI4, LVDS4 RSDS4 UART4, SPI44 ARM13, MIPS13, MPU/DSP13,Teaklite3 Consumer 1: 0.13um 2: 0.15um 3: 0.18um 4: planned All trademarks owned by each individual vendor

  17. UMC Logic Technology Roadmap 2006 2007 2000 2001 2002 2003 2004 2005 0.13um Cu 0.15um Al,Cu 90nm Cu 65nm Cu LOGIC 0.13um 90nm 65nm ITRS Box center marks the start of pilot production.

  18. Win-Win Partnership

More Related