1 / 16

Diamond Pixel Modules for the High Luminosity ATLAS Inner Detector Upgrade

Diamond Pixel Modules for the High Luminosity ATLAS Inner Detector Upgrade. ATLAS Tracker Upgrade Workshop Valencia 12-14 December 2007. Marko Mikuž University of Ljubljana & J. Stefan Institute. Diamond as sensor material. Polycrystalline Chemical Vapour Deposition (pCVD)

izzy
Télécharger la présentation

Diamond Pixel Modules for the High Luminosity ATLAS Inner Detector Upgrade

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Diamond Pixel Modules for the High Luminosity ATLAS Inner Detector Upgrade ATLAS Tracker Upgrade Workshop Valencia 12-14 December 2007 Marko Mikuž University of Ljubljana & J. Stefan Institute

  2. Diamond as sensor material

  3. Polycrystalline Chemical Vapour Deposition (pCVD) Grown in μ-wave reactors on non-diamond substrate Exist in Φ = 12 cm wafers, >2 mm thick Small grains merging with growth Grind off substrate side to improve quality → ~500 μm detectors Base-line diamond material for pixel sensor Diamond sensor types - pCVD Surface view of growth side All photographs courtesy of Element Six Side view Test dots on 1 cm grid

  4. Single Crystal Chemical Vapour Deposition (scCVD) Grown on diamond substrate RD-42 has research contract with E6 to develop this material Exist in ~ 1 cm2 pieces, max 1.4 cm x 1.4 cm, thickness > 1 mm A true single crystal Not in time for B-layer replacement Fall-forward for B-layer upgrade (single chips, wafers ?) After heavy irradiations expect similar properties to pCVD Diamond sensor types - scCVD

  5. Signal from pCVD diamonds • No processing: put electrodes on, apply electric field • Trapping on grain boundaries and in bulk • much like in heavily irradiated silicon • Parameterized with Charge Collection Distance, defined by • CCD = average distance e-h pairs move apart • Coincides with mean free path in infinite (t ≫ CCD) detector  mean not most probable CCD measured on recent 1.4 mm thick pCVD wafer

  6. Charge collected in pCVD diamonds • Electrodes stripped off and reapplied at will • Test dot → strip → pixel on same diamond • 90Sr source data well separated from pedestal • <Qcol> = 11300 e • <QMP> ~ 9000 e • 99% of events above 4000 e • FWHM/MP ~ 1 (~ 0.5 for Si) • Consequence of large non-homogeneity of pCVD material Qcol measured @ 0.8 V/μm

  7. Charge collected in scCVD diamonds • CCD = thickness at E > 0.1 V/μm • Collect all created charge • “CCD” hardly makes sense • FWHM/MP ~ 1/3 • scCVD material homogenous • Can measure diamond bulk properties with TCT ~ same CCD as pCVD scCVD measured in Ljubljana e-injection with α-particles Current Transient time

  8. Radiation Damage - Basics • Charge trapping the only relevant radiation damage effect • NIEL scaling questionable a priori • Egap in diamond 5 times larger than in Si • Many processes freeze out • Typical emission times order of months • Like Si at 300/5 = 60 K – Boltzmann factor • Lazarus effect ? • Time dependent behaviour • A rich source of effects and (experimental) surprises !

  9. Radiation Damage - Diamond Data • Done in context of RD-42 • 50 mm strip detectors (pixels !) read out by VA chip – S/N the measured parameter – calibrate noise to get charge • Two 500 mm thick detectors, CCD0 ~150 mm • Irradiated to 1.0 and 2.2x1015 p/cm2 at PS • Fully evaluated in test beam • S/N loss 57 → 49 → 47 (mean); 41 → 35 → 35 (MP) • Resolution improvement 11.5 → 9.1 → 7.4 mm • FWHM narrows:54 → 41 → 36 ( FWHM/m 0.95→0.84→0.77) • Two 500 mm thick detectors, CCD0 190 & 215 mm • Irradiated to 6 and 18x1015 p/cm2 • Source evaluation of S/N relative to before irradiation • Highest fluence point evaluated also at 2 V/ mm (1000 V) • 25 % of original signal retained → 33% at 2 V/ mm • Test beam data taken, not fully analyzed yet • Radiation homogenizes diamond – bulk damage starts to dominate 1 V/ mm 2 V/ mm

  10. Radiation damage parameterization and NIEL • In Si most damage scales with NIEL • NIELin C at high E an order of magnitude smaller than in Si • NIEL scaling not established for diamonds W. de Boer et al. arXiv:0705.0171v1 • For mean free path in infinite detector expect • With CCD0 initial trapping on grain boundaries, k a damage constant • Diamond with larger CCD0degrades faster • … but still performs better at any fluence • Fresh data of irradiations available – analysis still preliminary • scCVD with PS 24 GeV protons up to 2x1015 p/cm2 ; k~10-18μm-1cm-2, ~same as old pCVD proton data • pCVD with reactor neutrons up to 8x1015 neq/cm2; k~5x10-18μm-1cm-2 • pCVD with PSI 200 MeV pions up to 6x1014π/cm2 ; k consistent with ~2x10-18μm-1cm-2 • Looks roughly consistent with NIEL, neutron damage appears high – but no NIEL available for 1 MeV n on C ! • Analysis ongoing, khave large uncertainties, too early to draw hard sLHC implications

  11. Module after bump bonding Complete module under test Diamond Pixel Modules • 3 modules built with ATLAS pixel chips @ OSU, IZM and Bonn • 1 full (16 chip) pCVD module • Test beam at DESY and CERN • Irradiated to 5x1014 p/cm2 • SPS test beam in August & October • 1 single-chip scCVD module • CERN SPS test beam • Irradiated to 5x1014 p/cm2 • SPS test beam in August & October • 1 single-chip pCVD module • Irradiated to 2x1015 p/cm2 • Electronics heavily damaged C-sensor in carrier Pattern with In bumps scCVD diamond scCVD module

  12. Diamond pCVD Pixel Module – Results • pCVD full module • Tests show no change of threshold and noise from bare chip to module – low sensor C & I • Noise 137 e, Threshold: mean 1450 e, spread 25 e, reproduced in test beams • Many properties (e.g. resolution, time-walk) scale with S/N and S/T • Data from DESY test beam plagued by multiple scattering • Silicon telescope resolution 7 mm (CERN) → 37 mm (DESY) • Efficiency of 97.5 % a strict lower limit because of scattered tracks • Data from last year’s CERN SPS test beam not fully analyzed yet • Preliminary residual 18 mm, unfolding telescope contribution of 11 mm yields 14 mm, consistent with digital 50/√12 = 14.4 • Efforts to port the analysis code from Bonn • Push towards complete analysis of SPS data of un-irradiated and irradiated module Bare chip Noise = 137 e Thr = 1450 e Full module CERN preliminary DESY s = 18 mm Eff = 97.5 %

  13. Track distribution Diamond scCVD Pixel Module – Results • scCVD single chip module • Preliminary analysis (M. Mathes, Bonn) of SPS test beam data exhibits excellent performance of the module • Cluster signal nice Landau • Preliminary efficiency 99.98 %, excluding 6/800 problematic electronic channels • Residuals show pixel edge with s≈ 7 mm • Charge sharing shows most of charge collected on single pixel – optimal for performance after (heavy) irradiation • Looking forward to data of irradiated module ! Cluster signal Eff = 99.98 % sedge = 7 mm

  14. Pixel BCM-stations Beam pipe Diamonds in ATLAS • BCM – 16 1x1 cm2 diamond pad detectors, TOT readout • Test beam performance at end of readout chain exhibits median/noise ~ 11:1 Noise rate vs. thr2 Eff vs. thr

  15. Diamond Sensors for Pixel sLHC Upgrade • Move forward on two fronts • Better understanding of sensor material – ongoing in RD-42 • Radiation hardness – statistics, pions, neutrons, NIEL, trapping characterization etc. • Material growth and processing optimization • Search for suppliers alternative to Diamond Detectors Limited • scCVD enlargement (larger samples ?, fusion ?) • Build up experience with (irradiated) modules – ATLAS upgrade proposal (Carleton, CERN, Bonn, JSI, OSU, Toronto) • Paramount to any upgrade proposal is to demonstrate experience with complete modules under realistic conditions, not bits and pieces • Solve production issues – bump bonding on wafer level • Get interest of material supplier(s) • Gain experience with modules after irradiations • Engineer a light(er) mass support structure of diamond detector layer(s) • ? x 1016 represents a quantum leap in challenge • Current electronics not suitable for tests much above 1015

  16. Backup – going edgeless • scCVD single-chip module is edgeless – patterning right up to the edge • Data exist on performance – needs to be analyzed scCVD module pattern

More Related