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Template HTA General Assembly November 12 – 13, 2013

Template HTA General Assembly November 12 – 13, 2013. Contact : Fraunhofer ENAS dietmar.vogel@enas.fraunhofer.de Phone: +49-371-45001 412 / 220. Project Idea: Reliability Assessment with Qualified Material Data Sets EU Call: e.g. ICT Calls in LEIT ( e.g . ICT1-3), photonics KETs.

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Template HTA General Assembly November 12 – 13, 2013

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  1. Template HTA General Assembly November 12 – 13, 2013

  2. Contact:Fraunhofer ENAS dietmar.vogel@enas.fraunhofer.de Phone: +49-371-45001 412 / 220 Project Idea: Reliability Assessment with Qualified Material Data SetsEU Call: e.g. ICT Calls in LEIT (e.g. ICT1-3),photonicsKETs Project Idea short description: Reliabilityalignedtechnologydevelopmentfor highlyminiaturizedproducts (MEMS, ICs, photonics, ) • Short Description (ref. to the reliability part): • Challenging reliability assessment (manufacturing process & endurance) by physics of failure approaches (main obstacle for micro / nano scale components - used input data sets for FEA) • measurement of material properties from components as manufactured (new techniques, e.g. FIB based) • advanced validation strategies for complex material behavior and/or data sets of material property •  demonstration of improved failure avoidance strategies by accompanying process/product developm. IP situation and commercial viability: • Finite Element Analysis (FEA) is increasingly substantial part of process and device development • most limiting factor for FEA reliability assessment – quality of input data set (material properties, stress) • Potential Applications: • devices / systems with thin films / film stacks / micro&nano scale structures (e.g. BEoL stacked IC, • 3D integration systems, sensors, smart systems, photonics systems) • Potential Consortium/Competences needed: Firm 1: manufacturers of systems with dedicated need for accompanying failure avoidance analysis Firm 2: testing tool manufacturer RTO: material characterization (mechanical properties), device and system testing

  3. Ni layer BEoL stack region PI layer Underfill HMT solder gap Soldermask LJT solder Boardpad Berkevitchindenter Local residual stress measurement by FIB milling  Area influencedby the Si substrate Failure avoidance by appropriate design rules Local material properties

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