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Survey of Existing Memory Devices

Survey of Existing Memory Devices. Renee Gayle M. Chua. Introduction. Dynamic RAM (DRAM) Most commonly used type of system memory Requires refreshing every few milliseconds Holds data for a very short time Less expensive than static RAM. Introduction.

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Survey of Existing Memory Devices

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  1. Survey of Existing Memory Devices Renee Gayle M. Chua

  2. Introduction • Dynamic RAM (DRAM) • Most commonly used type of system memory • Requires refreshing every few milliseconds • Holds data for a very short time • Less expensive than static RAM

  3. Introduction • These are the steps in order to access a cell in DRAM: A row command to latch in Row address A column command to latch in Column address A necessary delay between the two commands as well as a delay after the column command for the I/O circuit to drive valid data.

  4. Introduction • Fast Page Mode (FPM) DRAM • Sending the row address just once for many accesses to memory in locations near each other, improving access time • takes advantage of the fact that when cells within the same row are accessed, the row command doesn’t need to be repeated. • Page mode - operation mode where multiple column commands follow a single row command • Burst mode access - memory is not read one byte at a time (32 or 64 bits at a time), but in several consecutive chunks of memory

  5. FPM/EDO Memory • Read Timing & Memory Access Diagrams

  6. Synchronous DRAM • SDRAM is designed to synchronize itself with the timing of the CPU • take advantage of interleaving and burst mode functions, which make memory retrieval even faster. • SDRAM modules come in several different speeds so as to synchronize to the clock speeds of the systems they'll be used in. • E.g. PC66 SDRAM runs at 66MHz; PC100 SDRAM runs at 100MHz

  7. Burst Mode Feature • Burst Mode • Bursting is a rapid data-transfer technique that automatically generates a block of data (a series of consecutive addresses) every time the processor requests a single address. • The assumption is that the next data-address the processor will request will be sequential to the previous one.

  8. Important Timing Terms • tRP - The time required to switch internal memory banks. (RAS Precharge) • tRCD - The time required between /RAS (Row Address Select) and /CAS (Column Address Select) access. • tAC - The amount of time necessary to "prepare" for the next output in burst mode. • tCAC - The Column Access Time. • tCL - (or CL) CAS Latency. • tCLK - The Length of a Clock Cycle. • RAS - Row Address Strobe or Row Address Select. • CAS - Column Address Strobe or Column Address Select. • Read Cycle Time - The time required to make data ready by the next clock cycle in burst mode. • Note #1: tRAC (Random Access Time) is calculated as tRCD + tCAC = tRACNote #2:RAS and CAS normally appear in technical manuals with an over-line as in RAS or  CAS.

  9. SDRAM Read Cycle Clock 1: ACTIVATE the row by turning on /CS and /RAS. (place the proper row address on the address bus – chip will know which row you want to ACTIVATE. Clock 3: READ the column you want from the row you've ACTIVATED by turning on /CAS while placing the column's address on the address bus. Clocks 5-10: The data from the row and column that you gave the chip goes out onto the Data Bus, followed by a BURST of other columns, the order of which depends on which BURST MODE you've set. (More on BURST in a second). tCAC - The Column Access Time tRAC (Random Access Time)

  10. Double Data Rate DRAM • the next generation SDRAM. • DDR reads data on both the rising and falling edges of the clock signal (SDRAM only carries information on the rising edge of a signal) • Data transfer is then twice as fast: i.e. instead of a data rate of 133MHz, DDR memory transfers data at 266MHz. • DDR is not backward compatible with SDRAM-designed motherboards

  11. DDR DRAM • Added circuitry: produces a data output strobe (DQS) • syncs data output to the external clock • allows DDR to transfer the results of a read on both clock edges. • Writes: DQS signal generated by the chipset's memory interface to sync the write data to both edges of the clock

  12. Rambus DRAM • A revolutionary step from SDRAM • Has changes to the bus structure and how signals are carried • Rambus memory sends less information on the data bus (which is 18 bits wide as opposed to the standard 32 or 64 bits) but it sends data more frequently. • It also reads data on both the rising and falling edges of the clock signal, as DDR does. As a result, Rambus memory is able to achieve effective data transfer speeds of 800MHz and higher.

  13. Rambus DRAM • Each RAMBUS chip has only 16 data pins on it, just like an SDRAM chip, which is enough to spit out only two bytes at a time. • How, then, does an RDRAM provide full system bandwidth with only 16 data pins? • Multiplexing is the key to RAMBUS' excellent granularity and low pin count

  14. Multiplexor: sits in between the DRAM core's 16-byte internal data bus and the two, single-byte Data A and Data B buses that make up the two-byte wide RAMBUS data channel. • These muxes take data in 8-byte wide chunks off of the two internal buses and stream them a byte at a time down the 1-byte wide Data A and Data B buses.

  15. RDRAM RDRAM READ: The data from the banks travels over the two, 8-byte core buses, is multiplexed onto the Data A and Data B buses, and then travels out the 16 data pins and onto the 16-bit data bus towards the CPU.

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