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NEWATLASPIX: Development of new pixel detectors for the ATLAS experiment upgrade

NEWATLASPIX: Development of new pixel detectors for the ATLAS experiment upgrade. Giulio Pellegrini. Clean Room 1.500 m2 Class 10 to 10.000 50 staff members Suitable for VLSI Laboratories Packaging Test and Characterization Reverse Engineering Silicon Micromachining Simulation CAD

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NEWATLASPIX: Development of new pixel detectors for the ATLAS experiment upgrade

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  1. NEWATLASPIX:Development of new pixel detectors for the ATLAS experiment upgrade Giulio Pellegrini

  2. Clean Room 1.500 m2 Class 10 to 10.000 50 staff members Suitable for VLSI Laboratories Packaging Test and Characterization Reverse Engineering Silicon Micromachining Simulation CAD Nanotechnology Belongs to CSIC Devoted to microelectronics 175 staff members Departments: Micro and Nano systems Electronic System Design Clean room for full microelectronics fabrication CNM-IMB Overview Instituto de Microelectrónica de Barcelona – IMBCentro Nacional de Microelectrónica – CNM

  3. Personnel at CNM-IMB • Dr. Giulio Pellegrini (IP) • Dr. Celeste Fleta Corral • Daniela Bassignana, PhD student • JuanPablo Balbuena Valenzuela, PhD student • Total EDP= 4 • Radiation Detector Group at CNM-IMB. • Clean room staff will support the fabrication of silicon devices.

  4. Objectives • Contribute to various aspects of the development of pixel sensors for the upgraded ATLAS Inner Detector • • 3D sensors • • 3D thin sensors • Planar sensors (active edges or slim edges) • • Planar thin sensors

  5. Background on 3D Detector Structure Nucl. Instr. Meth. A, vol. 395, 328, 1997 • Invented in 1997 - S. Parker, C. Kenney, J. Segal • - First produced in 1999 - Stanford Nanofabrication facility • Recent development: R&D towards experimental use • -Improvements in micromachining make larger-scale, reliable production more feasible • -Simplified structure:Double Sided, G. Pellegrini et al. • CNM-IMB was the second Institute in the world succeeding to fabricate 3D detectors IEEE Trans. Nucl. Sci, vol. 54, no. 4, Aug. 2007 • N- and p-type columns etched from opposite sides of substrate • Columns do not pass through full substrate thickness • 250μm deep in 300μm substrate.

  6. Production • Objectives: In this project we propose the fabrication of 3D pixel detectors in the CNM-IMB clean room facilities for the Atlas collaboration. The pixel detectors will be bump bonded to the FI3 and the new FI4 read out electronics. • The successful fabrication will open the possibility for CNM-IMB together with IFAE to participate in the supply of the detectors and complete modules for the atlas b-layer.

  7. Thin and edgeless detectors • Thin detectors fabricated in SOI wafers. • Development of the bump bonding for thin pixel detectors. • New active edge detectors, pixel and strip configuration. • New trenched detectors.

  8. Other applications • CNM-IMB in the framework of CERN RD50 collaboration has fabricated the first 3D detectors coupled to Medipix2 read out electronics. • In collaboration with University of Glasgow and Diamond light source we have obtained the first images using the synchrotron test beam facilitiesavailable at Diamond. • Future applications for 3D detectors: • Medipix3 for medical imaging. • Other experiments: FP420, TOTEM, CMS and future accelerators.

  9. Work Plan • The fabrication of 3D detectors and planar detectors with active edges is longer that standard planar ones. This means that one year is insufficient to fabricate, bump bond, irradiate and test the devices.

  10. CNM collaborations • CNM-IMB is participating in 3 collaborations for the Atlas upgrade: • ATLAS 3D Sensor collaboration • Rd50- 3D group • Planar Pixel Sensor collaboration, Atlas • CNM-IMB is also collaborating with different institutes: • University of Liverpool – UK • Detector development and characterization • Radiation hardness studies • University of Glasgow – UK • 3D detectors • Diamond light source • Test beam with X-rays, active edges • Brookhaven National Laboratory – USA • Stripixel, 3D • Helsinki Institute of Physics • Thin 3D detectors

  11. CNM-IMB budget • Execution costs = 126.000 € • Wafers = 11.000€ • Fabrication in the clean room= 55.000€ • Mask sets= 50.000€ • Others= 10.000€ • Travels and conferences = 42.000 € • Small equipments (Keithley, etc.)= 20.000 € • Other costs= 3.500 € • Total=191.500€ • Personnel (1 engineer x 2 years) 73.500 €.

  12. Thanks for your attention Giulio Pellegrini

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