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GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7

Gamma-ray Large Area Space Telescope. GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7 Face-to-Face Nov 04 Mike Huffer/Gunther Haller mehsys@slac.stanford.edu haller@slac.stanford.edu. Test-Stand Summary. Finished TKR test-stands

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GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7

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  1. Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7 Face-to-Face Nov 04 Mike Huffer/Gunther Haller mehsys@slac.stanford.edu haller@slac.stanford.edu

  2. Test-Stand Summary • Finished TKR test-stands • ACD was already finished • Remaining: • 1 TPS + 3 TEM’s. In conformal coating, expected back end of this week. To be shipped next week • 1 PDU to I&T

  3. Test-Stand Summary (continued) • ACD • DAQ/I&T team travelled to GSFC to update LCB including code on ACD test-stands • Status: seems to work • CAL • DAQ/I&T team travelled to NRL to update 3 CAL test-stands • Status: works • Additional LCB’s to update remaining ones in progress • TKR • Need to decide when to update

  4. ACTEL’s • Exchanged all 32-1 and 72-series MEC fab-line ACTELS with UMC-fab-line • Programmed 4 TEM sets • Are in lead-forming, expected back this week • To be assembled on TEM Qual, TwrA, TwrB TEM (one spare set of FPGA’s) • 72-1 series (used on LCB) not received yet, but not needed yet

  5. TEM/TPS Production Status • TEM/TPS Assembly (at General Technology) • Surface-mount assembled both sides of 3 TEMs and 3 TPS’s • No FPGA’s since GT pointed out some pin-misalignment • Sent back to SLAC, decided that they can be used • GT agreed but we will be sending UMC line devices • Does not delay schedule, since FPGA’s will be put on using METCAL rework station • 3 TEM’s were dropped from about 3 feet by accident • NCR’s created, damage being investigated • Probably ok but needs action • Boards were again inspected • Proceed with thru-hole components • In parallel decide how to repair damage if needed • Find out why it happened to prevent it from happening again • Wait till function/performance test to close NCR’s • Very slow progress. GT received parts kit 9/23. As of today only SMD components loaded (no thru-hole, etc) • Test-stands arrived at General Technology • 3 engineers will travel Monday after Thanksgiving to Board test (assuming assembly proceeds as planned) • Getting assembled boxes back before Christmas is a challenge • Released production of balance of PCB’s, expected in 20 days. • Can’t wait anymore until GT has first board assembled • Low risk since SLAC had already assembled one flight boards and tested over T • Plan still to wait for programming of balance of FPGA’s until board test results are available

  6. GASU & GASU-PS & PDU • PDU • Flight PCB fabrication: Received at SLAC • One board will be loaded in-house • Internal cable assembly • SOW released • RFP package being assembled in purchasing • Enclosure in fabrication, expected early December • Overall assembly • SOW released • Drawings released • RFP being assembled in purchasing • Issue with one part: Omnirel regulator which was recalled: Delivery not before end of February • Tester defined • GASU, GASU-Power Supply • Flight PCB fabrication awarded: Expected to be received early December • Rest identical status as PDU • Tester being designed and built • Test coverage for AEM and CRU, and EBM strong, GEM is weak

  7. SIU/EPU • Crate enclosures in fabrication, expected to be received in December • RFP package for internal harness being worked on in purchasing • Boards • Finished hole size will be 32 mil +/-3 on PCI boards including back-plane • Did not get feed-back by GSFC or PCB (but had sent email that we will proceed unless there are concerns) • Proceed with flight board fabrication • SIB, LCB, CPS, Backplane • PCB packages in release cycle • Backplanes, LCB out for RFP • ERNI cPCI connectors still not approved, not sure about the screening plan. Issue with Sn plating? • Did some tests at SLAC material lab, report in progress • Need closure from PCB & GSFC • Assembly SOW not written yet • EEPROM on RAD750 issue • See FSW. Decided to use 4 images and check-sum. No PROM

  8. LAT Harness (Box-to-Box) • RFP package of most cables being finalized in purchasing • Drawings released • There will be second RFP for remaining drawings • E.g. PDU to miscellaneous internal LAT sensors

  9. ASIC • All GTCC1, GCCC1 TEM ASIC’s screened • Qualification testing at GSFC has started • Test-setup assembled at GSFC and is working • GLTC ASIC’s (for GASU) • Thermal cycled GLTC’s • Screening hardware debugged, working • Test software in progress (Leonid has taken over for Oren who is not at SLAC anymore)

  10. Testbed • Hardware construction complete • Minor testing of EPU’s from a system level remains… • Waiting on availability of FSW EPU bootstrap • Physics-to-Physics demonstration • GLEAM to (LATTE) Single Event Display • > 20 KEvents/sec (for hours) • All 16 towers (+ readout of ACD) • Normal muons • 1 GEV gammas • Working on incorporating ACD simulation • Shown to work stand-alone

  11. 17th “tower” • Constructing… • Full tower • 4 AFEE production-line flight board copies • 36 production line MCMs • flight design cables • Partial tower • 4 AFEE production-line flight board copies • Limited number of EM MCMs • Burn-in cables • Keystone for much of our testing… • FSW Calibration software • GASU production • TEM validation • I & T software commissioning and practices validation • Calorimeter worked right out the box • Issues with tracker (being worked)

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