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Semiconductor E&M & Manufacturing in Europe – Quo Vadis?

Semiconductor E&M & Manufacturing in Europe – Quo Vadis?. Georg Kelm European Commission, DG INFSO, Nanoelectronics.

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Semiconductor E&M & Manufacturing in Europe – Quo Vadis?

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  1. Semiconductor E&M & Manufacturing in Europe – Quo Vadis? Georg Kelm European Commission, DG INFSO, Nanoelectronics Intel Supplier Forum, IMEC Sept 2010

  2. 1. SC Industry -What is the Situation Now?2. Dialogue Between Industry and Policy3. What Can and Will Policy Do? After Lisbon: EU2020 and Digital Agenda5. SC E&M & Manufacturing in Current R&D Programmes 6. Last WordsDisclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission Outline Intel Supplier Forum, IMEC Sept 2010

  3. Pessimists (realists?) say:- European semiconductor manufacturing capacity dropped 25% from 2005-2008- 95% of global investments in semiconductor manufacturing now outside EuropeWhy?- Unfair competition for European semiconductor ecosystemBut:- Is this the main reason why Qimonda went bankrupt?- Why is R&D efficiency so much lower than in the US?- Also: there are still investments–e.g. Crolles or Dresden What is the Situation in Europe now? Intel Supplier Forum, IMEC Sept 2010

  4. Optimists (idealists?) say:-We still have IDMs, more foundries, world leading institutes, well developed E&M industry in selected areas-Imposed paradigm shift has advantages:Why?Healthier mix MM and MtM, better use of technologyShift to MtM: emphasis of European strengths But:- Existing base needs support, private and public- Triangle of Education-R&D-Innovation decisive - Synergy of policies mandatory, national and EU What is the Situation in Europe now? Intel Supplier Forum, IMEC Sept 2010

  5. Past 5 years–intensive interaction between Industry, Research and EC:-e.g.ESIA reports and TF, SEMI White Paper issuedCommon understanding at all levels:-No Knowledge Society w/o R&D and Innovation- Semiconductor devices are a driving force for innovation in Europe's key industries- SC technology addresses societal issues as climate change, renewable energy, security or health careActions at European level – Result of Dialogue:- 2008: Strategic Initiatives Eniac and Artemis launched- 2009: Communication on Key Enabling Technologies- 2009: European 450 mm E&M initiative (EEMI450) Dialogue EU2020 and Digital Agenda Intel Supplier Forum, IMEC Sept 2010

  6. e-Society Communication Energy & Environment Security & Safety Transport & Mobility Health & Wellness 7. Design Methods & Tools 8. Equipment & Materials ENIAC Joint Undertaking as Public-Private Partnership Executive Dir. and secretariat Industry and R&D actors Commission and Public Authorities Intel Supplier Forum, IMEC Sept 2010

  7. Identified Key Enabling Technologies (KET) Nanotechnologyholds the promise of leading to – among others - the development of smart nano and micro devices and systems; Micro- and Nanoelectronics, including semiconductors, are essential for all goods and services which need intelligence and functionality; Photonicsprovides the technological basis for the conversion of sunlight to electricity which is important for the production of renewable energy and for a variety of electronic components and equipment such as photodiodes, LEDs and lasers. Advanced Materialssuch as lightweight materials facilitate lowering the carbon footprint and energy demand as well as limiting the need for raw materials; Biotechnologybrings cleaner and sustainable process alternatives for industrial and agrifood operations Intel Supplier Forum, IMEC Sept 2010

  8. EEMI450 Initiative: Long-term Objectives • To improve the competitiveness of the European semiconductor E&M industry, increase their chances to be selected by the tier 1 semiconductor companies in their future 450mm operations. • To stimulate a European infrastructure that is leading in 450mm E&M development and as a result will induce tier 1 companies to cooperation programs and possibly to equip 450mm fabs in Europe. Intel Supplier Forum, IMEC Sept 2010

  9. EEMI450 Project • The EEMI450 ENIAC project represents the start of 450mm E&M efforts in Europe • The project has 26 participants out of 7 countries: Austria, Belgium, France, Germany, Hungary, Ireland, Netherlands and United Kingdom • The project targets 450mm proof-of-concept of wafer manufacturing, waferhandling plus automation, process plus litho modules and metrology Intel Supplier Forum, IMEC Sept 2010

  10. 1. SC Industry -What is the Situation Now?2. Dialogue Between Industry and Policy3. What Can and Will Policy Do? After Lisbon: EU2020 and Digital Agenda5. SC E&M & Manufacturing in Current R&D Programmes 6. Last WordsDisclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission Outline Intel Supplier Forum, IMEC Sept 2010

  11. Lessons from Lisbon Strategy Strong convergence on direction of reforms ... - Concrete results before crisis - employment grew moderately - « Lisbonisation » of structural funds ... But a delivery gap has built up: - Uneven progress between Member States - Key targets - R&D + employment - not reached - Lack of ownership; weak communication - Regions not sufficiently involved -Too EU-inward looking • UPDATE VISION TO POST-CRISIS WORLD • IMPROVE DELIVERY Intel Supplier Forum, IMEC Sept 2010

  12. From 10 years Lisbon Strategy to EUROPE 2020 • UPDATE VISION TO POST-CRISIS WORLD • IMPROVE DELIVERY 3 priorities: • Smart Growth:knowledge and innovation economy • Sustainable growth:greener and competitive economy • Inclusive growth:high employment, knowledge people and social and territorial cohesion EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth 5 EU Targets – translated into national ones 7 Flagship initiatives – EU & national action COMMUNICATION FROM THE COMMISSION COM(2010) 2020 http://ec.europa.eu/eu2020/pdf/COMPLET%20EN%20BARROSO%20%20%20007%20-%20Europe%202020%20-%20EN%20version.pdf Intel Supplier Forum, IMEC Sept 2010

  13. Europe 2020: Five EU Headline Targets By 2020: 75 % (now 69) employment rate (% of population aged 20-64 years) 3% (now 1,8%) Investment in R&D (% of EU’s GDP) “20/20/20” climate/energy targets met (incl. 30% emissions reduction if conditions are right) < 10% (now 15) early school leavers & min. 40% (now 31) hold tertiary degree 20 million less people (now 80) should be atrisk of poverty Intel Supplier Forum, IMEC Sept 2010

  14. And the Private Sector? Private expenditure on all R&D as % of GDP – average annual growth 2000-2007 (source: EC, DG Entr) Intel Supplier Forum, IMEC Sept 2010

  15. Europe 2020: 7 Flagship Initiatives underpin the Targets Intel Supplier Forum, IMEC Sept 2010

  16. Europe 2020: Role of Cohesion Policy Cohesion Policy is largest source of multi-sector EU funding - much larger than R&D budget: Use it also for R&D&I objectives Need to demonstrate that EU instruments work together, not against each other Europe cannot achieve ‘2020’ goals unless regions achieve them Intel Supplier Forum, IMEC Sept 2010

  17. Digital Agenda for Europe Fast Internet Digital Single Market Digital Citizenship ICT Research and Innovationneed greater priority Trust & Security Interoperability Intel Supplier Forum, IMEC Sept 2010

  18. Driving force of the development of future goods and services Being at the forefront of competitiveness, innovation, knowledge-based economy Modernisation of the industrial base and in the further strengthening of the research base Creating related eco-systems of SMEs. Knowledge intensive (high R&D and capital expenditure) Associated with highly-skilled employment Multi-disciplinary, cutting across many technology areas, converging Create multiplier effects Enabling process, good and service innovation and are of systemic relevance. Key Enabling Technologies (KETs) Importance of KETs Defining KETs Source: European Commission Intel Supplier Forum, IMEC Sept 2010

  19. The Way Forward-Support of Key Enabling Technologies- Short Term Shared long term vision • Better application of existing state aid rules • Trade: Ensure level playing field • Improve access to finance • Reinforce existing initiatives on KETs & link KETs with EU2020 • Need to create a shared long term vision and partnership between Commission and Member states and industry and Key stakeholders. • Invite Member States to agree on importance of KETs and support the orientation included in the Communication. Long Term • Establish a high level expert group (HLG) • - Assess competitiveness situation • of KETs focusing on deployment • - Analyse R&D capacity - Policy recommendations Intel Supplier Forum, IMEC Sept 2010

  20. R&D is the basic element for the Innovation process R&D is an integral part of high end manufacturing Investor’s decision for a production site is influenced by comparison of incentives on a global scale Riskof losing the production lines AND also the R&D Conclusions: 1. Where Europe Invested in R&D, State Aid Should be Allowed for Subsequent Investments 2. European Clusters show: Win-Win Possible for Industry and Society State Aid for Large Investments – An Element for the Post-Lisbon Process? Intel Supplier Forum, IMEC Sept 2010

  21. The Supply Chain Today Data Processing Communications Industrial and Medical Consumer Automotive Military, Civil Aerospace, Security Intel Supplier Forum, IMEC Sept 2010

  22. Equipment and Material suppliers Few specialized players 80% of the Equipment Suppliers are SMEs Semiconductor equipment sales by region • ***: various European players well positioned • **: 1 or 2 major European players and several small • *: very few European players Source: Datamonitor, Global SC Equipment, March ‘09 Intel Supplier Forum, IMEC Sept 2010

  23. 1. SC Industry -What is the Situation Now?2. Dialogue Between Industry and Policy3. What Can and Will Policy Do? After Lisbon: EU2020 and Digital Agenda5. SC E&M & Manufacturing in Current R&D Programmes 6. Last WordsDisclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission Outline Intel Supplier Forum, IMEC Sept 2010

  24. FP7 Nanoelectronics E&M and Manufacturing Targets 2007-10 • New semiconductor manufacturing approaches, processes and tools • Joint assessments of novel process/metrology equipment and materials • Supporting 200/300mm wafer integration platforms • Preparatory work for 450mm wafer processing Funding schemes: STREPs IP Intel Supplier Forum, IMEC Sept 2010

  25. Thematic Coverage FP7 R&D Nanoelectronics 2007-10 Design Funding:34 M€ 23 % Processes Funding: 35 M€ 24 % Devices Funding: 35M€ 24 % E&M and Mfg (incl. Europractice) Funding:35 M€ 21 % Intel Supplier Forum, IMEC Sept 2010

  26. Project SEAL: SEA-Leveraging Innovation Users: Global Foundries, Infineon, Intel, LFoundry, MEMC, Numonyx, Siltronic, Soitec, STMicroelectronics Crolles Equipment Suppliers: Hamatech, Alcatel Vacuum, Jenoptik Automatisierungs-technik, SUSS MicroOptics, Reinhardt Microtech, SUSS Microtech Lithography, MAPPER, Toppan Photomasks, HQ-Dielectrics, SUSS Microtec, Ion Beam Services, Lam Research, Nanda, Semilab, Fries R&T, Applied Materials, Integrated Circuit Testing, Oxford Instruments, Metryx, PVA TePla, KLA-Tencor, ProTec Research Institutes: CEA/LETI, Fraunhofer IISB, imec, UALB, ICN, FHWN Budget/Funding: 14,3 Mio EUR / 9,1 Mio EUR Duration:June 2010 – May 2013 35% of suppliers are SMEs Intel Supplier Forum, IMEC Sept 2010

  27. SP8-PLASMA-TRANS -Plasma Immersion II Tool for Defect Engineering & CMOS imager application • Short description: • Extension of application field by tool modification (process control, pressure, temperature) • Assessment of modified tool • Advances proposed Plasma Immersion Ion Implant • Adaptation and evaluation of the IBS PULSION platform for defect engineering/gettering • Application to: • CMOS imagers • trench doping • shallow trench isolation (STI) • deep trench doping for power applications • shallow junctions with low thermal budget activation for backside doping. • Modifications for improved throughput PULSION-nano® tool installed in LETI Partners: Ion Beam Services, CEA/LETI, STMicroelectronics Crolles Coordinator: Frank TORREGROSA/ IBS Duration: 24 Months Intel Supplier Forum, IMEC Sept 2010

  28. SP15 - M4More Mass Metrology for Monitoring • Short description: • Assessment of fab ready 300mm tool for mass metrology • Evaluation of new applications like Ion Implantation, Gate Stack, barrier seed layers for BEoL and 3D integration • Advances proposed in M4 • Assessment of the next generation of mass metrology tools incorporating a high-resolution mass metrology measurement module • Resolution improvement of a factor of 100 to 0.1 micrograms, and a repeatability improvement of a factor of 10 to 8 micrograms. • Allow the introduction of mass metrology into new applications, structures and materials being introduced at the 22nm dimension. • The advanced modular construction of the tool will also provide the capability of adding multiple mass modules with mixed measurement capability, an extendable platform to cope with ever increasing volumes, and the capability of mixed technologies for custom metrology solutions Partners: Metryx, Intel, imec Coordinator:Mark Berry / Metryx Duration: 30 Months Intel Supplier Forum, IMEC Sept 2010

  29. Project leader (1) (2) (3) DP EBPC & PI & Tool Tool devlpt devlpt simulation Technology assessment FHV FUJI MAGIC: The European Initiative on Multibeam Lithography • Push the insertion of ML2 technology for semiconductor manufacturing • Demonstrate technology interest and capability • Resolution • Throughput • Develop first 300mm multi beam platforms • Build infrastructure for a fast and secure start-up • Fields of development : process, data preparation, proximity effect controls… • Highlight CMOS process integration compatibility Intel Supplier Forum, IMEC Sept 2010

  30. 32nm hp 25nm hp SRAM test case High energy multibeam demonstration capability programmableAperturePlateSystem(APS) • Project driver : IMS Nanofabrication (Vienna) • Throughput potential • Multi axis : 76 columns • Each beam covering 1 die area • 256k beam per axis – 1µA per axis • 5-6wph per exposure module Intel Supplier Forum, IMEC Sept 2010

  31. 32nm hp resolution 40nm hp Contact hole HSQ CD=26nm-D=673µC/cm² Positive CAR CD=37nm -D=42µC/cm² Positive CAR CD=40nm-D=200µC/cm² Low energy multibeam demonstration capability • Project driver : MAPPER Lithography (Netherlands) • Throughput potential • 10wph per module • 1 module : 1m² • 13000 beams per module Intel Supplier Forum, IMEC Sept 2010

  32. One of the Challenges: Integration on Silicon and the heteroepitaxy problem DUALLOGIC approach: Use standard Si STI Compatibility with standard CMOS cost effectiveness IP re-use Ge in Si STI IMEC results in DUALLOGIC: G. Wang et al., APL 96, 111903 (2010) Problem : Narrow trenches ! InP buffer in Si STI IMEC results in DUALLOGIC : G.Wang et al., ECS Trans. 27, p. 959 (2009) 200 nm 150 nm 110 nm InGaAs channel will be grown here InP Aixtron as equipment partner! STI Si Intel Supplier Forum, IMEC Sept 2010

  33. Smart Factories ICT VirtualFactories DigitalFactories Fab of the Future (FoF)Smart Factories - 2009 “Smart Factories” expected impact: • Higher level of intelligence & environmental consciousness on the shop floor • Introduction of advanced automation into mainstream manufacturing • Higher productivity of customised manufacturing paired with reduced emissions & waste More to come in 2011, 2012, 2013 Intel Supplier Forum, IMEC Sept 2010

  34. Thematic Coverage FoF - Smart Factories 2009 - Energy & Mat Monitoring Integrated Process Automation Laser Applications in Mfg Robotics Enabled Mfg. Result: 8 proposals with 35 M€ funding Intel Supplier Forum, IMEC Sept 2010

  35. Very Advanced NanoE Components 2011-12 Topics and Targets: • - Very advanced Si and non-Si switches, memories and interconnects (perf/ee) • - Co-integration of non-Si, charge, spin, photon based devices on Si • - Combined modelling, technology+ design work at circuit, device, material level for monolith and 3D integr of BeyondC+very adv. MtM on Si backbone • - Mfg solutions for integration/interfacing of Beyond CMOS+MtM with NanoCMOS • - E&M solutions to manufacture and measure 1D + 3D Si, including E&M assessment • - CSAs to support 450 mm cordination, develop strategies, attract young ones and link up globally to support IP creation and manufacture in Europe 2011 60M€ STREPs, IPs, CSAs Intel Supplier Forum, IMEC Sept 2010

  36. ENIACThemes covered - 1st call - 2008 Proposals selected for funding (EC + MS)per sub-programme Transport and Mobility Energy and Environment 33 M€ 10 M€ E3Car SE2A SmartPM Electric car Car safety & efficiency Power management E&M and Manufacturing Design Methods and Tools JEMSIP_3D LENS MODERN Heterogeneity Lithography Reliability NEPTUNE IMPROVE 12 M€ 43 M€ Heterogeneity Productivity Intel Supplier Forum, IMEC Sept 2010

  37. ENIACThemes covered - 2nd call - 2009 Proposals selected for funding (EC + MS) per sub-programme 16 M€ 33 M€ 8.5 M€ 11.6 M€ Communications Health and Wellness Security and Safety Energy & eSociety MAS CAJAL4EU MIRANDELA SMART CSSL Remote monitoring & therapy CSI Biosensors for diagnostics mm-wave & RF integration Solid state lighting Secure storage 3D imaging E&M and Manufacturing MERCURE Design Methods and Tools Wide bandgap & RF MEMS Last Power EEMI 450 ESiP END Wide bandgap materials 450mm preparation Multi-chip integration Energy-aware design 31 M€ 6.3 M€ Intel Supplier Forum, IMEC Sept 2010

  38. Eniac - Annual WP 2010 Target R&D Activities E&M + Manufg: • - EUV sub-22 + complementary 1x nm patterning • - 450 mm supply chain • - Metrology Innovation • - Green & flexible Manufacturing • - Photomask innovation • - 3D IC Manufacturing • - Disruptive BEOL Technology + WL-Packaging • - Large Area Organic Substrates Call 3: Projects being selected at present ! 2010 25-30 M€ 3 year projects Intel Supplier Forum, IMEC Sept 2010

  39. NanoE E&M and Mfg in FP and Eniac2007-10 First half of FP7 (2007-10): • More than 50 different European SC E&M suppliers participating in R&D and assessment projects, more than 40% of them being SMEs • More than 150 M€ invested in SC E&M and Mfg Second half of FP7 (2011-13): • R&D funding will increase by 30%. Intel Supplier Forum, IMEC Sept 2010

  40. Last Words New European Commission with Emphasis on R&D&I – basis for sustainable growth in Knowledge Society The European R&D&I Programmes are investing in key technologies as nanoE - a basis for innovation and growth In the long run no SC ecosystem w/o SC E&M & Mfg Opportunity if: The Europeans keep IP and silicon together Industry sees recent paradigm shifts as a chance not a threat Policy and industry adapt a holistic approach to face global challenges It Seems There is a Common Will to Act Jointly! Intel Supplier Forum, IMEC Sept 2010

  41. THANK YOU Georg.Kelm@ec.europa.eu Intel Supplier Forum, IMEC Sept 2010

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