ANSYS Multiphysics 8.0 Technology Overview & Benefits

ANSYS Multiphysics 8.0Technology Overview & Benefits Multiphysics 8.0 Customer 3.0- 1/30/04 Dr. Paul Lethbridge - Product Manager

Topics Covered • What is Multiphysics? • Multiphysics Benefits • Educational Products • Market Applications • Market segments by Technology • Market Segments by Industry • Multi Field (Coupled Physics) Capabilities • Direct physics coupling • Sequential physics coupling • Multi-field Solver (New feature at release 8.0) • Other New features • Enhanced non-linear Piezoelectric & piezoresistive element. • Fluid damping elements • Cyclic Symmetry for Magnetostatics • Low Frequency Electromagnetic Contact • Coupled E-B Particle Tracing • Re-meshing for FSI • Selected Multi-Physics Examples • Product Roadmap & Strategy • Transition to Workbench Environment • Product Websites Multiphysics 8.0 Customer 3.0- 1/30/04

The ANSYS Family of Products Extreme functionality The whole enchilada! ANSYSMultiphysics Educational/Non Commercial Use Products ANSYSUniversity High performance mechanical & Thermal ANSYSMechanical ANSYSFLOTRAN Powerful tools for the physics specialist ANSYSEmag ANSYSProfessional ANSYS Structural Ease of use & Entry level capability ANSYS MCAD & ECAD Connection products Multiphysics 8.0 Customer 3.0- 1/30/04

What is ANSYS Multiphysics? A general purpose analysis tool allowing a user to to combine the effects of two or more different, yet interrelated physics, within one, unified simulation environment. Electro- magnetic Magnetic Thermal Fluid Electrostatic Electrical Structural Multiphysics 8.0 Customer 3.0- 1/30/04

Benefits of Multiphysics • No other analysis tool provides as many physics under one roof! • Greatest breadth and technical depth of physics. • Fully parametric models across physics, geometry, materials, loads. • Perform Design Optimization across physics, geometry, materials and loads. • Seamless integration with ANSYS Probabilistic Design System (PDS). • Extremely sophisticated analysis capability. • Bottom line benefits: • Analysis closely match reality – bringing reality to the desktop • Reduced assumptions that question certainty and compromise accuracy. • Lower cost: Fewer analysis software tools to purchase,learn & manage. • Lower cost: R&D process compression Multiphysics 8.0 Customer 3.0- 1/30/04

Benefits of Multiphysics • “The use of Multiphysics allows us to return to the basics of engineering where a model and the predictive solution closely approximate reality; this allows the engineer to design with a high degree of confidence that the answers are correct.” Multiphysics 8.0 Customer 3.0- 1/30/04 Dr. Howard Crabb - Ford Motor Company

Educational Products – Problem Size Limits Multiphysics 8.0 Customer 3.0- 1/30/04

Market Applications by Technology Three “broad” Market segments uniquely identified as being inherently Multiphysics Sensors & Transducers Actuators Processes • Inertial • Pressure • Mass • Proximity • Thermal • Acoustic • Fluid systems • Hydraulic • Pneumatic • Fuel • Microfluidics • Electromagnetic machines • Pumps • Generators • Motors • Solenoids • Induction heating • RF Heating • Heat-exchangers • Electronics cooling • Automotive • A/C systems • SEMICON • Ion implanters • PVD / CVD Multiphysics 8.0 Customer 3.0- 1/30/04 Click mouse to progress

Market Applications by Industry Multiphysics is not limited to any specific industry. There are analysis applications and opportunity across the board. • Electronics • Automotive • Aerospace / Space • Marine • SEMICON • Government / Military • Medical / BioMed • Pharmaceutical • Appliances Multiphysics 8.0 Customer 3.0- 1/30/04

Coupled Physics Capabilities: Methods • There are two methods to couple physics, Direct & Sequential. • Direct - solves all DOF’s at the FEA coefficient matrix level. • Sequential - solves DOF’s for one physics then passes results as loads & boundary conditions to the second physics. At least two iterations, one for each physics, in sequence, are needed to achieve a coupled response. • There are many confusing terms for the two methods: Multiphysics 8.0 Customer 3.0- 1/30/04

Direct Coupled Physics Applications Multiphysics 8.0 Customer 3.0- 1/30/04

Sequential Coupled Physics Applications Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver - Pretext • Situation Prior to Release 8.0: • Significant number of multi-physics problems can be addressed with sequential coupling using core elements. • Our current tools for sequential coupling require advanced APDL and domain knowledge to process solution. • We have out-grown custom-command macros that perform sequential coupling e.g..: • FSSOLV • ESSOLV • Fluid Solid Interaction (FSI) was a first step towards automated sequential coupling technology Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver – Why? • There is Growing Market Requirement to: • Solve multi-physics problems from all industries. • Often need to incorporate more than two physics. • Couple more easily to external codes • Provide an easier to use Multiphysics environment for current analysts. • In Response: • ANSYS have developed a “multi-field” solver to automate sequential coupling, and be general enough in the design for most multi-field solution requirements” • The multi-field solver is an evolution of our successful FSI solver Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver – Implementation Model and mesh • Single model of physical parts. • Multiple, separate meshes for each “Field”, derived from base solid model. What is a FIELD ? • A FIELD is an Finite Element model set up to perform a single solution • It may solve for a single physics (e.g. a mechanical structure) • It may solve for directly coupled physics (e.g.. piezoelectrics) • A selection of element types is used to define a FIELD • Each FIELD has it’s own mesh • Loads, boundary conditions, solver selection are all part of the FIELD definition • A FIELD may be any analysis type (Static, Harmonic, Transient) • Each FIELD creates it’s own results file • A FIELD may be defined (imported) from an external code via a CDB file. Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver – Implementation Interfacing between Fields • Fields “talk” to one another through surface or volumetric interfaces • Field coupling is realized by mapping loads from one mesh to another • Support similar or dissimilar meshes • Supports 1st order and 2nd order elements or mixtures of both • Automated mesh “morphing” of non-structural domains is available for all non-structural element types. Multifield Solution • The solver loops through all fields • Supports static, transient and harmonic analysis • Convergence is monitored at the interfaces where loads are transferred. Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver – Implementation Time Loop Stagger Loop Field Loop ( i=1,n) Physics Field 1 Physics Field 2 Physics Field n End Field Loop End Stagger Loop End Time Loop Time loop: • For transient analysis, refers to solution in time • For static analysis, refers to each load step • For harmonic analysis, refers to harmonic analysis within time step Stagger loop: • Implicit coupling of various fields in time loop • Number of stagger iterations determined by convergence of load transfer or max stagger iterations Field loop: • Field solution with specific solution options • Load transfer to a particular field occurs before solution of the field • Dissimilar mesh across surface/ volume interface between fields Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- Physics Loads Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver – Multi-user deployment No need for a super user to handle all physics, separate physics can be processed by individual analysis experts in the company: CAD Model Intra-Company Resource Physics 4 Consultant Engineer e.g. HF electromagnetics Model pre processing (loads, boundary conditions & mesh) Physics 1 Engineer e.g. CFD Model pre processing (loads, boundary conditions & mesh) Physics 2 Engineer e.g. Electromagnetics Model pre processing (loads, boundary conditions & mesh) Physics 3 Engineer e.g. Structural Model pre processing (loads, boundary conditions & mesh) Multi-field Analysis Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver – Multi-user deployment Physics 4 e.g. HF electromagnetics Model pre processing (loads, boundary conditions & mesh) Physics 1 e.g. CFD Model pre processing (loads, boundary conditions & mesh) Physics 2 e.g. Electromagnetics Model pre processing (loads, boundary conditions & mesh) Physics 3 e.g. Structural Model pre processing (loads, boundary conditions & mesh) HF Emag CDB file Field4.RMG Results file Field1.RFL Results File CFD CDB File Electromagnetics CDB file Field2.RMG Results file Structural CDB file Field3.RST Results file Each physics has its own CDB and results (*.R*) file. Solid Model Multi-field Solver Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver - dissimilar mesh interface Example of dissimilar mesh between physics: Thermal-mechanical mesh: 15,000 elements CFD mesh: 600,000 elements (Fluid region not shown) Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- Summary • Physics is treated as a "field" with an independent model & mesh • Each field is defined by a group of element types • Load transfer regions are identified by surfaces and/or volumes • Sequential (Load vector) coupling between fields • Each field may have: • Different analysis types • Different solvers and analysis options • Different mesh descretization • Each field can be imported from an external solver (e.g. CFX) • Surface load transfer across fields • Volumetric load transfer across fields • Automated morphing of non-structural elements • Independent results files for each field Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- Physics & Applications Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- Benefits • Provides an easy to use framework to solve coupled field problems in ANSYS Multiphysics • Ability to sequentially couple any number of physics fields • Applicable across all physics available in ANSYS Multiphysics • Multiple field specification with different solution option for each field • Analysis type (Transient/Static/Harmonic) • Solver options • Material & geometric non-linearity • Automated surface and volume load transfer across dissimilar mesh • Automated Morphing of field elements • Unidirectional coupling between CFX and ANSYS Multiphysics • Unidirectional coupling between third party solvers and ANSYS Multiphysics • Provides analysis opportunities in many new market areas where there have previously been no solutions. Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- RF Attenuator Example Typical Packaged Device: Image from KDI data sheet. RF/microwave energy is attenuated through resistive losses in a Nichrome film attached to the microstripline waveguide. The energy is lost in the form of heat which is conducted both through the devices ceramic substrate and top insulating surface film. Solid Model: Nichrome film Ceramic substrate RF waveguide Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- RF Attenuator Example High-Frequency electromagnetic coupled to a steady-state thermal analysis: Thermal Physics Field 2 HF Emag Physics Field 1 Heat generation rate Thermal Mesh: 6,600 elements HF Emag mesh: 98,175 elements Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- RF Attenuator Example Analysis results: E-field H-field Resultant temperature Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- MEMS RF Switch Example Beam support post Beam electrode Ground electrode Substrate Transient response of MEMS RF Switch to a pulsed voltage excitation: Perforation holes to control fluid damping Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- MEMS RF Switch Example CAD Model Each physics model is prepared independently: • Physics 1: Mechanical Engineer • Mesh solid model of switch • Apply clamped BC’s • Perform squeeze-film damping analysis using FLUID136, FLUID138. • Prepare structural dynamics analysis run • Physics 2: Electronics Engineer • Create Air mesh around switch • Apply voltage BC’s • Prepare electrostatics analysis run • Write CDB file MFIMPORT Multi-field Analysis Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- MEMS RF Switch Example Transient, dynamic electrostatics coupled to mechanical analysis: Mechanical Physics Field 1 Electrostatics Physics Field 2 Displacement, Forces Electrostic mesh: 16,353 elements Structural mesh: 1894 elements Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver- MEMS RF Switch Example Analysis Results: Displacement of switch mid-plane Under pulse voltage excitation Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver Example: CFX Imported field Gas turbine with internal cooling example: • Unidirectional coupling between CFX and ANSYS • CFX performs conjugate heat transfer fluid solution. • CFX writes an ANSYS CDB file containing surface forces, volumetric temperatures; defining an “external field” for the multifield solver • ANSYS interpolates CFX results onto the ANSYS FE mesh • ANSYS solves the thermal-stress analysis • Makes use of Cyclic symmetry (113 blades!) Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver Example: CFX Imported field Details of field stagger loop: External Physics Field ANSYS Internal Physics Field Surface Forces Interpolated Surface Forces CFX Model Physics Field 1 Structural Physics Field 2 Volumetric Temperatures Interpolated Volumetric Temperature Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver Example: CFX Imported field • Imported field process: • Create CFD model in CFX-build, • Pre-process and Solve Conjugate HT problem in CFX-solve. • Use the export utility in CFX-Post create a ANSYS CDB file • CDB file has SUR152/154 elements with force loads and SOLID70 with temperatures • derived from CFX mesh. • Create solid region in ANSYS Multiphysics and mesh for thermal-stress analysis • Apply boundary conditions (Omega loading, cyclic symmetry) • Read in the cdb file from CFX via the MFIMport command • Create the fluid solid (FSIN) interfaces via SF command for the surface Forces • Create the solid-solid volumetric (FVIN) interface via BFE command for the temperatures • User defines solid region as "field2" and fluid (CFX) region as "field1" • ANSYS 8.0 multi-field stagger loop algorithm is used to transfer loads from "field2“ mesh to "field1 mesh and then solves the thermal-stress analysis." Multiphysics 8.0 Customer 3.0- 1/30/04

Pressure Streamlines Temperature Multi-field Solver Example: CFX Imported field Field 1: CFD Results Multiphysics 8.0 Customer 3.0- 1/30/04

Temperature Equivalent stress (SEQV) Multi-field Solver Example: CFX Imported field Field 2: Thermal Mechanical Results Displacement Multiphysics 8.0 Customer 3.0- 1/30/04

Multi-field Solver: CFX support • CFX can export the following to ANSYS Multiphysics • At surfaces • Nodal heat flux • Nodal forces • Within Solid volumes • Nodal temperatures • CFX loads can be read only with the ANSYS Multiphysics Multi-field Solver • CFX5 export • Stand-alone CFXExport executable available for CFX5.6 customers • ANSYS CDB file created from CFX results files • Works with ANSYS Multiphysics 8.0 and the Multifield solver Multiphysics 8.0 Customer 3.0- 1/30/04

Topics Covered • What is Multiphysics? • Multiphysics Benefits • Educational Products • Market Applications • Market segments by Technology • Market Segments by Industry • Multi Field (Coupled Physics) Capabilities • Direct physics coupling • Sequential physics coupling • Multi-field Solver (New feature at release 8.0) • Other New features • Enhanced non-linear Piezoelectric & piezoresistive elements. • Direct coupled piezoresistive elements • Fluid damping elements • Cyclic Symmetry for Magnetostatics • Low Frequency Electromagnetic Contact • Coupled E-B Particle Tracing • Re-meshing for FSI • Selected Multi-Physics Examples • Product Roadmap & Strategy • Transition to Workbench Environment • Product Websites Multiphysics 8.0 Customer 3.0- 1/30/04

Direct Coupled-Field Elements - Benefits Series 22X elements bring consistency and ease of use to our direct coupled physics: • Capabilities • New material models and coupled-field effects • More special features and loads • Consistency • Flexible setting of DOFs and reactions - controlled by KEYOPT(1) • Element shapes and orders - match our 18X solid structural elements • Load labels - CHRG vs AMPS • Large deflection capability - available for ALL analyses with structural DOFs • New code architecture • Use existing / enhanced ‘core’ legacy elements as building blocks • Inherit the functionality of ‘core’ elements - material models, loads, special features. • Calculate directly coupled-field effects inside the element. • Facilitates infrastructure to rapidly deploy additional directly coupled physics. Multiphysics 8.0 Customer 3.0- 1/30/04

Series 22X Coupled Field Elements R1 R4 R2 R3 Force • Higher order solid elements for • Piezoelectric analysis • Piezoresistive analysis • Applications • Pressure transducers • Sensors • Accelerometers • Microphones • Elements • PLANE223 2-D 8-Node Quad • SOLID226 3-D 20-Node Brick • SOLID227 3-D 10-Node Tetrahedral • Couples to CIRCU124 • Can build Wheatstone bridge etc Acceleration Images courtesy Endevco & Fujikura. Multiphysics 8.0 Customer 3.0- 1/30/04

Coupled Field Piezoresistive Element piezo-resistor color key normal R1 R1 R4 R2 R3 compression R1 Acceleration tension R1 Force R3 R4 R1 R2 Acceleration Force Strain gauge accelerometer principle of operation: Piezoresistors Support Frame R1 R2 R3 R4 Proof mass Multiphysics 8.0 Customer 3.0- 1/30/04

Coupled Field Piezoresistive Element Strain gauge accelerometer analysis example: • Accelerometer uses four piezoresistive sensors per beam in a Wheatstone Bridge configuration. • Objective is to compute Output voltage and sensitivity with 5 V DC excitation. • SOLID95 for mass, frame, and beam • SOLID226 for Piezoresistors • Voltage coupling used to create Wheatstone bridge. Detail of beam: Frame Beam Proof Mass Four Piezoresistor elements Multiphysics 8.0 Customer 3.0- 1/30/04

Coupled Field Piezoresistive Element • Analysis results for 1 G acceleration load: • Stress in beam: 1.6-2.9 MPa • Differential voltage in bridge: 2.79 mV • Sensitivity: 2.84e-4 Vsec2/m Axial stress contour plots: Multiphysics 8.0 Customer 3.0- 1/30/04

Damping Elements for Thin Film Applications FLUID 136 - 2D 4 or 8 node squeeze film fluid element FLUID 138 - 3D 2 node viscous fluid link element FLUID 139 - 2 or more node slide film damper • Applicable to MEMS or macro devices where damping attributed to thin films/ air gaps is required. • “KEYOPTS” control the flow regime: Continuum, High Knudsen numbers etc. • The fluid environment is defined by a set of real constants. • For FLUID136 & FLUID138: The elements are added to the structure and a static analysis is used to determine the damping effects at low frequencies, and a harmonic analysis is used to determine the stiffening and damping effects at high frequencies. • The DMPEXT command is used to extract frequency dependent damping parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in structural dynamics analysis with correct damping. • Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis. Multiphysics 8.0 Customer 3.0- 1/30/04

Damping Elements for Thin Film Applications FLUID 136: • Models viscous fluid flow behavior in small gaps between fixed surfaces and structures moving perpendicular to the fixed surfaces. • Used to determine the stiffening and damping effects that the fluid exerts on the moving structure. • Based on the Reynolds squeeze film theory and the theory of rarefied gases. • A static analysis is used to determine the damping effects at low frequencies. A harmonic analysis is used to determine the stiffening and damping effects at high frequencies. • The DMPEXT command is used to extract frequency dependent damping parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in structural dynamics analysis with correct damping. • Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis. Multiphysics 8.0 Customer 3.0- 1/30/04

Damping Elements for Thin Film Applications FLUID 138: • Models the viscous fluid flow behavior through short channels (i.e., holes) in microstructures moving perpendicular to fixed surfaces. • Can be used in conjunction with FLUID136 elements to determine the stiffening and damping effects that the fluid exerts on the moving perforated microstructure. • Assumes isothermal flow at low Reynolds numbers. • Accounts for gas rarefaction effects and fringe effects due to the short channel length. • Can be used to model either continuous or high Knudsen number flow regimes. • Applicable to static, harmonic, and transient analyses. FLUID 139: • 139 is a combination of Couette (low frequency) and Stokes flow (inertial effects at high frequency). • The viscous flow between surfaces is represented by a series connection of mass-damper elements whereby each node corresponds to a local fluid layer • Applicable to large deflection. Multiphysics 8.0 Customer 3.0- 1/30/04

ANSYS Multiphysics 8.0 Technology Overview & Benefits