Particles and Fields Package Monthly Status Review (MSR) Quarterly Status Review (QSR)

1. Particles and Fields Package Monthly Status Review (MSR) Quarterly Status Review (QSR) April 22, 2010 Dave Curtis, PFP PM

2. SSL Contracting Status Phase RR contract mod funding provided should carry us through April. Phase B/C/D Contract negotiations in progress Delivered IT Security, H&S, OCI plans

3. Scheduler Status Scheduler now working MAVEN full time PF schedule delivered Schedule status being tracked

4. Tasks to complete before PDR PRT List to LM (w/Shields) 6/15/10 SSL EEE Parts Selected 4/15/10 Deliver SWEA Digital Parts List  Deliver SWEA LVPC Parts List  SWIA Preamp Parts List Deliver  SWIA HVPS and DIGITAL  and LVPC Parts List Delivery  STATIC Deliver Anode, Preamp, TDC, TOF HVPS, Sweep HVPS, Digital, LVPS Parts list  SEP DAP Parts List Delivered Deliver REG Parts List  SEP LVPS Requirements Delivery 4/23/10 SEP FM Detectors Ordered  4/23/10 Deliver SWEA EM Change List to SSL 6/14/10

5. Pre-PDR CDRLs CDRLs FSW-01, SDP, Final @ IPDR-30 MA-01, MAIP, Final, IPDR-30 SE-04, Fault Protection Design, @PDR SE-09, Instrument Specifications, Preliminary, @IPDR SE-16, Verification Plan [preliminary] @ PDR SE-17, Gold Rule Compliance, @IPDR IT-01, I&T Plan, Prelim @ IPDR IT-06, Environmental Test Plan, prelim, IPDR-10d PM-14, IPDR Package, IPDR-10d MAIP CDRLs (Rev A) 3-2, Prelim. Safety Requirements Compliance Checklist @IPDR 3-5, Prelim. Safety Assessment Report, @ IPDR 4-1, Reliability Program Plan (Part of MAIP: Final @IPDR) 4-3, Prelim. FMEA, CIL, @IPDR 4-7, Prelim. Reliability Assessment and Predictions @IPDR 4-9, Prelim. Limited Life List, @IPDR 11-2, Prelim. Mat & Proc List, @IPDR 11-10 Prelim. Life Test Plan for Lubricated Mechanisms 12-3, Prelim. Parts Identification List, @IPDR

6. Manpower • Ramping up nearly complete • SEP EE, Power Converter support, Scheduler hired • Closing in on final new hire • SWIA/STATIC additional ME support (reviewing applicants) • QA team is still short • Ron Jackson still out due to injuries • Return now no sooner than June • Meanwhile SSL QA team is stretched thin with current work • Jorg Fischer is taking the lead for now • A QA Audit of SSL complete • Still looking for help • Thermal Engineering Situation Improved • SSL engineer has delivered preliminary instrument thermal models • GSFC provided thermal engineer working on a detailed SWEA model

7. Accomplishments Provided MICD inputs (SWEA, SWIA, STATIC) Worked with LM to relocate LPW to avoid thruster heating Provided preliminary thermal models Provided the Rev B MAIP for review Delivered PFP FTA Completed PFP/SC ICD tabletop review Flight Software Requirements complete SWEA/CESR PCB More in instrument sections…

8. Ongoing Work Supporting Project planning process Supporting EMC, Payload, SDT working groups Parts selection near completion Completing pre-PDR design work Preparing for peer reviews Working on pre-PDR deliverables

9. Ongoing Trades Magnetics Current sensor location on solar array probably does not work Too close to solar array strings AC magnetics too high Working with Project on alternatives

10. Issues SWEA Surface Treatment Need to modify thermal characteristics of surfaces in SWEA aperture to avoid excessive heating - candidate solutions in work Candidate solutions need to be evaluated for Atomic Oxygen effects, charging effects, thermal properties, and robustness Current candidates: DAG213, Ebanol-C, Z307 SWIA and STATIC also interested SEP detector Atomic Oxygen effects Heritage instruments survives AO, but we would like to test a MAVEN detector if possible.

11. Top Risks • Several risks lowered or retired (9, 11, 12) by time or mitigation • MAG risk worse

12. Risks List

13. PFP Mass NTE reallocated from STATIC to SWIA per CCR147 No other change

14. Mass Tracking Chart

15. PFP Power Added EUV op heater estimate CCR157 submitted would bring Nominal margin back to 20% Added MAG power increase due to STEREO parts obsolescence ~0.8W, resulting in negative MAG power margin Added SWIA MCP power increase per CCR 150 Liens: Expect to need operational heat during eclipse None allocated for most instruments; amount needed pending thermal analysis Preliminary estimates included for MAG and EUV

16. PFP Power Trend

17. PFP Data Rate Per 2009-6-9 allocations from Bruce

18. MAVEN Magnetometer Status April, 2010 Connerney, Schnurr, Sheppard, etc.

19. GSFC/MAG - Accomplishments Last Month MAG instrument definition continues – draft Rev 1 & 2 to SSL. MAG instrument block diagram, logic block diagram, digital interface completed (Rev 2). Instrument command and telemetry formats defined (Rev 2). Finalized Peer Review plans – May 25 1:00 pm GSFC 34. Steve Battel, Ken Wagner, Dave Sohl (Curtis, Jedrich, etc.) Preliminary parts selection & placement on electronics card. Provided preliminary sensor thermal model to UCB/SSL/LM. Provided B/C/D schedule draft input to UCB/SSL. Supported continuing Spacecraft Magnetics Control Board discussions. Received outline SIP from Payload Office.

20. Near Term Plans & Open Issues MAG Peer Review preparation. May 25 date selected for tabletop peer review Deliver mechanical drawings of sensor assembly, attachment bracket to SSL and LM. Draft SIP. PDR Preparation. MAG Sensor accommodation options under discussion. Extend the SA panel substrate (1.5 m from SA strings may be possible). Addition of a third hinged panel (may provide ~2 m extension). Other boom proposals (STEREO-like, Astromast-type extensible boom, etc.) mentioned in this context.

21. MAVEN PFP SWIA Status April 2010 Jasper Halekas, SWIA Lead

22. SWIA Progress • No major design issues outstanding • Staffing finally up to speed • Dalton and Elliott both spending time on SWIA • Currents/voltages ready for low voltage power supply design • Still waiting on MCP selection for currents for MCP supply • Anode/MCP mechanical 75% complete • MICD complete • Stackup and interconnect scheme almost completely defined • Questions remaining on components on preamp/mcp board • Questions remaining on connector from preamp to digital • Completed analysis of MCP requirements • Higher current plates required to achieve dynamic range • CCR Approved for power for desired MCP • Preliminary thermal model complete • FPGA spec reviewed and complete

23. SWIA Issues • Staffing • Finally up to speed on staffing • MCP selection • Analyzed MCP requirements • Found that high current plates needed to avoid saturation in solar wind • CCR Approved for required power • MCP Spec in review

24. MAVEN PFP STATIC Status April 2010 Jim McFadden, STATIC Lead

25. STATIC Accomplishments MICD for STATIC completed. Internal electronics boards added to the STATIC mech model. Basic mechanical layout for STATIC external connectors and harnessing covers defined. Preliminary design spec for nitrogen purge given to Greg Dalton for mechanical implementation. Concept developed for carbon foil mounting. Proto-type carbon foil mounting frames were examined and modifications to their specification was completed. Kickoff meeting held to discuss implementation of new calibration chamber for room 320. Connector interface between Digital and TDC defined. VMI multiplier mech specs shown compatible with current 15 kV layout. VMI part should resolve any vibration concerns. FPGA mounting scheme for Digital board developed.

26. STATIC Open Issues Stability of the STATIC HV Sweep – testing still on hold due to RBSP conflicts with EE. No feed-back from Steve McBride on TDC part changes. STATIC FPGA still in development – waiting on new test setup using complete throughput test (anode-preamp-TDC-Digital). Mechanical Attenuator still in development – handed off from Bill Elliott to Greg Dalton. Waiting on prototype of VMI multiplier for 15 kV supply testing. Waiting on feedback from building maintenance with regard to changes in clean room (320) ventilation. New 15 kV / MCP board layout to proceed when EE is available. New board layouts to proceed when Tech is available.

27. MAVEN PFP SWEA Status April 2010 Dave Mitchell, SWEA Lead

28. SWEA Status • SWEA Design • Instrument Specification – draft complete, under revision • SSL/CESR ICD – done • Identify changes to STEREO SWEA – done • Software Requirements – draft complete, under revision • Harness Specification – done • Packaging/Interconnect Design – done • Preliminary Thermal Design – done • LVPC design/parts selection – done • SWEA Digital • Digital Design – done • Parts Selection and Digital Schematic – done • SWEA SSL Mechanical Design • Electronics box mechanical design – done

29. Slight Modification to Deflector Design: Simulations are underway to determine if a slight change in deflector design improves the angular response. Initial results show that higher deflection angles can be achieved within the voltage limits of the existing deflector supply by decreasing the radius of curvature. Now performing simulations to verify/refine the design symmetry for positive and negative deflections no impingement of the deflectors into electron paths Surface Coating for Deflectors and Toroidal Grids Thermal calculations show that a high emissivity coating for the deflectors and toroidal grids is needed. The coating should be robust, not altered by exposure to atomic oxygen, and not susceptible to low level charging in shadow Current candidates: DAG213, Ebanol-C, Z307, Black Chrome Planning laboratory tests for low temperature charging SWEA Work in Progress

30. MAVEN PFP SEP Status April 2010 Davin Larson, SEP Lead

31. SEP Accomplishments Delivered FPGA spec document: SEP-FPGA-SPEC)V2.0.doc Which includes Modifications from THEMIS DAP design: Reduction from 12 channels to 6 channels on each board (FPGA). Increase in number of ADC bins from 128 to 256. Addition of one extra ADC to DAP board to measure analog housekeeping values. FPGA is responsible for control and readout. CDI control is nearly the same but DATA readout is different. See new interface document: MAVEN_PF_SYS_004B_PFDPUtoInstrumentICD.doc Addition of FTO qualifier. Determine relative size of F and O pulses in an FTO event to determine propagation direction. Addition of “BURST MODE” to capture individual particle events. Possible removal of “blackout” logic on an as needed basis. Sector clock will change from 1/32 second to a programmable value (1 to 60 seconds (this may not affect FPGA at all but will affect overflow in the counters) Reconfiguration to 2 identical actels Baseline burst mode developed Learned that DAP board must measure it own analog housekeeping Mechanical changes from THEMIS: Use right angle MDM connectors on each DFE board. Change location of foil Designing push pin detector connection in progress. Modified Collimator to increase FOV. Defined Detector mask – Detectors ready for production. Electrical EE Position is filled and working. Circuit diagrams now being modified. CBE power supplied. Decision on Bias supply circuitry resolved: (will use cap/diode stack) - exploring use of different (but qualified diodes. – will bench test first. Exploring possible power savings in the test pulse circuitry. (eleiminate quad op amp supply on each board)

32. SEP Open issues FPGA SPEC sheet still needs a review. Better power estimate required. must include power for shaping chain. needs fine tuning and check from EE Parts list separated into DFE and DAP boards Board layouts

33. MAVEN PFP PFDPU/GSE Status April 2010 Dorothy Gordon, Peter Berg, Tim Quinn, Harvey

34. DCB Status (1) Processor Board Specification Released Memory Requirements reviewed by Flight Software Engineer Addition of 1MByte SRAM serving as Instrument Data Buffer Region (IBUS) CPU SRAM, EEPROM on MBUS FLASH Subsystem via dedicated I/O bus DMA for S/C Telemetry, Instruments Data-In and FLASH Transfers Dual Port Memory for S/C Commands FIFO for Instrument Commands Preliminary Parts List Submitted Component Fit Check OK Power Estimates Submitted Next Steps DPU Schematics Preparation for Peer Review

35. DCB Status (2) DPU Block Diagram

36. Flight Software Status • Communications • Project Website Access: Now Able to Read Files on MIS • Deliveries • MAVEN_PF_SYS_010_FSWRequirements.xls (3/30) (see summary p.3) • Bi-directional links, Boot and Operational FSW, Verification Matrix, Progress Tracking • Activities • Supported Telecons on S/C FSW Requirements • Open : Inter-Message gap definition • Open : EUV RAM-Direction Safing • Reviewed MAVEN SDP (MAVEN-SYS-PLAN-0020_Rev-_Released_3-4-2010) • PF Processor Info should be updated to “Coldfire” • Project “Signoff” of FSW Test Reports >> Assume this is “Final Test Reports” • Reviewed MAVEN Systems Review and Peer Review Plans • Reviewed Standards 7150, 2100, 8719, 8715, 8739, 1000 • Reviewed PF CMP, RMP, PF-to-SC ICD, DCB Specification • Reviewed/Updated FSW development schedule for SDP • Ordered Development Computer (32-bit system). Will Verify Code Warrior on it. • Created SubVersion Repository. Placed FSW documents under FSW CM • Issues • Determining whether PFDPU is considered “Safety System” • Schedule • UCB to Deliver SDP this week, Project to Review • Complete Memory Requirements, Code Size Estimates • Write Boot FSW Specification • Begin Writing Operational FSW Specification • Next FSW Telecon: May 4, 10am pacific [1.866.705.6300, Passcode: 3201807]

37. Requirements Boot FSW (L5a) Oper’l FSW (L5b)

38. Power Supply Status Power Converter Design Layout for testing two of the possible topologies for power converters completed Board is in house PFDPU Resident Boards Preliminary schematics and BOMs drawn for REG and IIB boards

39. GSE Status GSE (MISG) Actuator circuit refined and long-lead time parts (activator switches) have been ordered Mother Board Schematic completed (Base GSE Board) Layout has begun (part definitions complete) Next Steps Continue with Layout/Fabrication of Base GSE board MISG FPGA development