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Lecture 0. Course Introduction

ECM583 Special Topics in Computer Systems. Lecture 0. Course Introduction. Prof. Taeweon Suh Computer Science Education Korea University. Course Information. Instructor Prof. Taeweon Suh Prerequisite Computer Architecture, Operating Systems, Java and C-programming Textbook

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Lecture 0. Course Introduction

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  1. ECM583 Special Topics in Computer Systems Lecture 0. Course Introduction Prof. Taeweon Suh Computer Science Education Korea University

  2. Course Information • Instructor • Prof. Taeweon Suh • Prerequisite • Computer Architecture, Operating Systems, Java and C-programming • Textbook • Beginning Android ADK with Arduino by Mario Bohmer, Apress, 2012 • Office hours • After class as needed • By appointment at Lyceum 307 • Class web • http://esca.korea.ac.kr/ • Contact Information • suhtw@korea.ac.kr • 02-3290-2397

  3. Objectives • Understand computer systems with hands-on experience with Android system and accessory board • Utilize a computer system to play with real-world electronic components • Discuss and devise lab materials for educating Computer Science to K-12 students Android Mega ADK IOIO for Android

  4. Lab Environment • Android tablet (or phone) + ADK (Android Open Accessory Development Kit) Board USB Cable

  5. Lab Environment (Cont.) • Hardware • Nexus 7 Tablet or Personal Phone • Arduino Mega ADK board • Software • GUI-based Arduino development tool • Android Developer Tools with Eclipse for app programming

  6. Computer Systems • General-purpose computer systems • Embedded Systems

  7. A Computer System (till 2008) CPU Main Memory (DDR2) FSB (Front-Side Bus) North Bridge Graphics card DMI (Direct Media I/F) Peripheral devices South Bridge Hard disk USB PCIe card But, don’t forget the big picture!

  8. Past, Present and More… • Core i7 (Ivy Bridge) – based Systems • Core 2 Duo – based Systems Main Memory (DDR2) CPU FSB (Front-Side Bus) North Bridge South Bridge DMI (Direct Media I/F) Keep in mind that CPU and computer systems are evolving at a fast pace! • FDI: Flexible Display Interface • SPI: Serial Peripheral Interface • SMBus: System Management Bus

  9. iPhone Generations Original iPhone (iPhone 2G) iPhone 3GS iPhone 4 iPhone 3G June 2010 June 2007 June 2008 June 2009 iPhone 5 iPhone 4S Sep. 2012 Oct. 2011 http://apple.wikia.com/wiki/IPhone_3G http://en.wikipedia.org/wiki/History_of_the_iPhone

  10. Smartphone War http://www.sleetherz.com/2011/10/smartphone-war-in-fatal-three-way-iphone-4s-vs-droid-razr-vs-galaxy-nexus/

  11. iPhone 4 Teardown http://www.ifixit.com/Teardown/iPhone-4-Teardown/3130/1 http://news.cnet.com/8301-13924_3-20006904-64.html GSM (Global System for Mobile communications): 2G, 3G, 4G .. UMTS (Universal Mobile Telecommunications Systems): one of 3G technologies being developed into 4G

  12. iPhone 4 Teardown 512MB Mobile DDR Audio Codec (Cirrus Logic) Samsung flash memory (32GB): K9PFG08 A4 Processor (ARM Cortex A8) designed by Apple manufactured by Samsung GSM and more GSM (Global System for Mobile communications): 3G

  13. iPhone 4 Teardown • Accelerometer detects when the user has rotated the device from portrait to landscape, then automatically changes the contents of the display accordingly • Proximity sensor detects when you lift iPhone to your ear and immediately turns off the display to save power and prevent inadvertent touches until iPhone is moved away • Ambient light sensor automatically adjusts the display’s brightness to the appropriate level for the current ambient light, enhancing the user experience and saving power at the same time

  14. iPhone 5 Teardown Accelerometer Touchscreen controller • A6 application processor, based off the ARMv7 ISA • 1GB Elpida LP (Low Power) DDR2 integrated according to Chipworks LTE modem 16GB NAND Flash from Hynix Wi-Fi module 3-axis gyroscope http://www.ifixit.com/Teardown/iPhone+5+Teardown/10525/2

  15. Galaxy S3 Teardown Samsung 16GB eMMC (MultiMediCard) + 64MB NAND Flash Intel Wireless Processor Exynos 4412: Quad-core A9 with 1GB DDR2 http://www.samsung.com/ http://www.ifixit.com/Teardown/Samsung-Galaxy-S-III-Teardown/

  16. Exynos 4412 Block Diagram PoP: Package-on-Package

  17. Galaxy Note Teardown Flip-chip DRAM on App. Processor • K3PE7E700B-XXC1 low power 1GB DDR2 • S5PC210 Exynos 4210 : ARM Cortex A9 (Dual-core) 1.4GHz with Mali-400 MP GPU

  18. Galaxy Note Teardown Yamaha Audio Codec Audio Processor LCD Driver STMicroelectronics’ Gyroscope

  19. Atmega2560 Overview Timer/Counter 8-bit CPU Internal memories • 4KB EEPROM • 256KB Flash • 8KB SRAM

  20. Grading Policy • K-12 Education Proposal & Project: 60% • Class Presentations: 40%

  21. Backup Slides

  22. Atmega328 Overview Internal memories • 32KB Flash • 1KB EEPROM • 2KB SRAM 8-bit CPU Timer/Counter Serial Peripheral Interface Universal Synchronous and Asynchronous serial Receiver and Transmitter (Serial) GPIO 2-wire Serial Interface

  23. Present, Near Future and More… • Core 2 Duo – based Systems • Core i7– based Systems Main Memory (DDR3) Main Memory (DDR2) CPU CPU Quickpath (Intel) or Hypertransport (AMD) FSB (Front-Side Bus) North Bridge North Bridge South Bridge South Bridge DMI (Direct Media I/F) DMI (Direct Media I/F) Keep in mind that CPU and computer systems are evolving at a fast pace

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