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Invention

Illustration : 발명에 대한 설명 ( 그림 위주로 1~2 장 . PRB 발표로도 쓰일 예정 ). Invention. Current. Opened Area. Better Stand off height. PPG or ABF. Buried Pattern Bump + OSP(Surface finish). POST Structure. PPG or ABF. Buried Pattern Trace + OSP(Surface finish). PPG or ABF. PPG or ABF.

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Invention

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  1. Illustration : 발명에 대한 설명 (그림 위주로 1~2장. PRB발표로도 쓰일 예정) Invention Current Opened Area Better Stand off height PPG or ABF Buried Pattern Bump + OSP(Surface finish) POST Structure PPG or ABF Buried Pattern Trace + OSP(Surface finish) PPG or ABF PPG or ABF Flat Structure Pattern + OSP(surface finish) PPG or ABF Dimple Structure Main Claim :기존 기술과 구별되는 차이점에 대해 2~3줄(14폰트) 내외로 간단히 요약해 주세요. (중요!!) Claim1 : Buried pattern substrate를 이용한 Mass Reflow(CUBOL)용 Cu pillar interconnection package 구조

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