1 / 32

Eon Silicon Solution Inc.

Eon Silicon Solution Inc. Company Profile Updated on Nov. 15th, 2006. Company Information. Core Business NOR Type Flash Memory Headquarter Location 6F-2, No.30, Tai-Yuan Street, Chupei, Hsinchu, Taiwan Capital NT$569,306,570.- (≒US$17.8M) Chairman & CEO Mr. K. S. Chiu Employees

odina
Télécharger la présentation

Eon Silicon Solution Inc.

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Eon Silicon Solution Inc. Company Profile Updated on Nov. 15th, 2006

  2. Company Information • Core Business • NOR Type Flash Memory • Headquarter Location • 6F-2, No.30, Tai-Yuan Street, Chupei, Hsinchu, Taiwan • Capital • NT$569,306,570.- (≒US$17.8M) • Chairman & CEO • Mr. K. S. Chiu • Employees • 78 persons (Designers & Engineers over 50%)

  3. Milestone • 1996 Q1: Incorporated in California • 1996 Q4: Developed EPROM with TSMC • 2000 Q1: 0.35um Flash Production in UMC • 2002 Q4: Headquarter moved to Taiwan • 2003 Q1: 0.23um Flash Production in UMC • 2004 Q3: 0.23um Flash Production in SMIC • 2004 Q4: 0.18um Flash Production in DBE • 2005 Q2: 1st 100M units Sales out • 2006 Q1: 1.8V Product Production in March ‘06 • 2006 Q2: 0.18um Flash Production in SMIC • 2006 Q2: 2nd 100M units Sales out

  4. Organization

  5. Sales Result & Forecast

  6. Eon’s Patent Position • Eon owns • Core Cell Erase Operation patent (USA/TWN) • No Power erase, suitable for 3V, 1.8V mobile system & portable devices. • No need for Additional Source Imp. • More scalable, achieve smaller core cell size • Faster Erase • Better Erase Distribution => Double density • 11 Circuit Logic Design patents Issued

  7. Technical Capability & Performance • High P/E Endurance • Industrial Proven Stack Gate Core Technology • Mature & Reliable Technology • High Speed • Low Voltage Product • Specific Product

  8. ISO Certificate • ISO Certificate • ISO9001:2000 • Certification in March 2004 • ISO14001:2004 • Certification in April 2006 • The certificates are on our website: www.eonssi.com

  9. Product Grade & Package • Product Grade • Commercial (0℃~+70℃) grade • Industrial (-40℃ ~+85℃) grade • Lead-free (Pb-free) with RoHS Compliant • Green packages • Known Good Die (KGD) • Product Package Type • Parallel Flash Products • BGA, PLCC, PDIP, STSOP, TSOP • Serial Flash Products • PDIP-8, SOP-8, SOP-16, VDFN-8

  10. Subcontractor • Wafer Testing • KYEC, Ardentek • Assembly House • Amkor, CWTi, Greatek, OSE, SiTec, SPIL • Testing House • KYEC, TLC, SiTec

  11. Process Technology Update • 0.23um Technology (in Production) • Foundry: UMC, SMIC • Product: 512Kb ~ 16Mb • 0.18um Technology (in Production) • Foundry: DBE, SMIC • Product: 512Kb ~ 64Mb • 0.13um Technology (under Developing) • Foundry: DBE, SMIC, UMC • Product: 16Mb ~ 256Mb • 90nm Technology (under Developing) • Foundry: DBE • Product: 64Mb ~ 1Gb

  12. Process Technology v.s. Product

  13. Product Roadmap Parallel Flash – 5V ES MP 4Mb X8bit, 5V 0.23um 2Mb X8bit, 5V 0.23um 1Mb X8bit, 5V 0.23um 512Kb X8bit, 5V 0.23um

  14. Product Roadmap Parallel Flash – 3V ES MP 4Mb 3V, x8/16bit 0.18um 4Mb 3V, X8bit 0.18um 1Mb 3V, x8bit 0.23um 512Kb 3V, x8bit 0.23um

  15. Product Roadmap Parallel Flash – 3V ES MP 64Mb, X8/16bit 3V, 0.13um 64Mb, X16bit 3V, 0.18um 32Mb, x8/16bit 3V, 0.13um 32Mb, X8/16bit 3V, 0.18um 16Mb, X8/16bit 3V, 0.18um 8Mb, X8/16bit 3V, 0.18um

  16. Product Roadmap Parallel Flash – 1.8V ES MP 16Mb, x8/16bit 1.8V, 0.18um 8Mb, x8/16bit 1.8V, 0.18um 4Mb, x8/16bit 1.8V, 0.18um

  17. Product Roadmap SPI/Serial Flash ES MP 128Mb 90nm 64Mb 0.13um 32Mb 0.13um 16Mb 0.13um 16Mb 0.18um 8Mb 0.18um 4Mb 0.18um 2Mb 0.18um 1Mb 0.18um 512Kb 0.18um

  18. Product Roadmap SO/Simultaneous Operation Flash ES MP 256Mb, 1.8V Burst 90nm 128Mb, 1.8V Burst 90nm 128Mb, 1.8V Burst 0.13um 64Mb, 1.8V Burst 90nm 64Mb, 1.8V Burst 0.13um 32Mb, 1.8V Burst 0.13um 32Mb, 3V Page/Burst 0.13um

  19. Product Roadmap MCP/Multiple Chips Package Family ES MP 256Mb 1.8V NOR + 64Mb SDRAM 128Mb 1.8V NOR + 32Mb Pseudo SRAM 64Mb 1.8V NOR + 16Mb Pseudo SRAM 32Mb 3V NOR + 4Mb Pseudo SRAM

  20. Product Roadmap Data Flash Memory ES MP 1Gb 1.8V, 90nm 512Mb 1.8V, 90nm 256Mb 1.8V, 90nm

  21. Product List - I

  22. Product List - II

  23. Product List - III

  24. Product List - IV

  25. Product List - IV

  26. Product List - V

  27. Applications • 512Kb/ 1Mb • Card Reader, CD ROM, DVD ROM, LCD Monitor, MP3, Thermal Printer, VGA card,…. • 2Mb • DVD ROM, Game Box, Fax, IPC, MB, Modem, POS, VCD Player,…. • 4Mb • Audio Device, Bluetooth, CD-RW, DSC, DVD Player, DVD RW, HDD Drive, FAX, GPS, IPC, Desktop PC, Mobile PC, MP3, Printer, Router, Scanner, Server, STB…. • 8Mb • ADSL, Cable modem, Combo Drive, DVD Player, DVD RW, LCD Monitor, LCD TV, Mobile PC, Bluetooth, Printer, Router, STB, Switch HUB, Video Device, WLAN AP… • 16/32Mb • ADSL, Cable modem, Cellular Phone, Digital Camcorder, DVD Drive, DVD Recorder, Game Consoles, GPS, IP Phone, LCD/PDP TV, MFP, PDA, Palm PC, POS, Router, STB, Switch HUB, VoIP… • 64/128Mb • Car navigation, Cellular Phone, DSC, DTV, DVD Recorder, IP Phone, LCD/PDP TV, MFP, Router, STB…

  28. Customers • Japan • Brother • Denon & Marantz • EPSON • JVC • Matsushita • Mitsubishi • Mitsumi • NEC • OKI • ONKYO • Sharp • TEAC • Toshiba • Tottori Star Denki • Toyota Industrial • Yupiteru • Zoom • Worldwide • BBK • Betty TV • Centillium • Creative • Daewoo • EZURIO • Flextronics • LASAT • LG PDP • Nemerix • Philips • Samsung • SCHMIDT TELECOM • SCI • Siemens • TCL • TDK • Technisat • Thomson • TomTom • TYCO • Vestel • Taiwan • AMIT • AOC • ASUS • BCom • BenQ/Philips • Cameo (GST) • Cellvision • Compal • D-Link (Alpha) • ECS • Foxconn/ Sony • Gemtek • Gigabyte • IAC • Lite-on • MSI • QSI • Sercomm • Tatung • Uniwill/ Fujitsu-Siemens • USI/HP • Zyxel…

  29. Computer & Peripherals Card reader IPC LCD Monitor MB NB ODD PDA Thermal Printer VGA Consumer DSC DVD Player Game Box HDTV LCD TV MFP MP3 PDP TV POS STB/ DVB VCD Player Customer’s Application • Communication • Bluetooth • GPS • IP Phone • ISDN • Mobile Phone • Modem • Router • Switch HUB • VoIP • WLAN • xDSL • Others • Car PC • Car Audio • Car DVD • Car TV • Navigation • Radar Detector • Remote control

  30. Commitment • Provide High Quality Flash memory devices that matches world class IDM companies • Professional FAE and QA engineering fully support customer’s requirement • Long term commitment to meet customer required product life cycle • Guarantee of on time delivery

  31. Sales Channel • China: • Distributor: Synnex, Road well, Challenge, Hi Level • Europe: • Rep.: Utrilla, Avantage, eCount, EssePiRep, More • Distributor: Future, Focus, Rutronic, MSC, eCount, BNE, Computer Control • Taiwan: • Distributor: FOHO, Prohubs, Promate, Sertek, Siltron, Yosun • Japan: • Distributor: 3S, Jepico, Kaga, Kanematsu, Komatsu, Marubun, Mikasa, Mitsumine, MSK, Yosun • Korea: • Agent/Distributor: Allied Chips, ASCA, Bescom, CEC, Gencore, Gentech, Semigate, Techin, Tekro, Twin, Woosung, Zemiitz • Southeast Asia: • Distributor: Future, INC, Ingram Micro, Kanematsu, Komatsu, Marubun, Kaga, Yosun, Empire Tech. • North America: • Rep.: ADM, Core Sales, JMA, Luscombe, Permier, QVS, Ram, U.S. Uni Electronics, Semtronic Associates, Inc., Tritech Electronics • Distributor: Future, Premier, U.S. Uni Electronics, QVS

  32. Eon Silicon Solution Inc. Welcome to visit our website: www.eonssi.com

More Related