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Reflowlöten

Preheating. Reflowlöten. Bottom Preheater. High performance density for effective preheating of the board Inertia-less Control Four time windows to control the temperature profiles Adaptation of the heated length to the format of the assembly

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Reflowlöten

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  1. Preheating Reflowlöten

  2. BottomPreheater • High performance density for effective preheating of the board • Inertia-less Control • Four time windows to control the temperature profiles • Adaptation of the heated length to the format of the assembly • Chronological control depending on the time required for soldering • Max. two modules prior to solder module 1 • Post heating cycles after process disruptions

  3. Segmented Heater Cassettes • Allows to use the full length of the preheater to heat up two separate assemblies • Doubling the time available to preheat assemblies without additional preheater module

  4. Top Side Preheater • Combines IR and convection technology • Effectively preheats assemblies requiring large amounts of heat • Suitable for installation in the preheat as well as in the solder module

  5. T - - - ∆T  T +++ PreheatingMultilayer Boards – Telecommunication (24 Layers) If, for multi-layer assemblies, thermal energy is supplied only from one side (lower side), then the heat has to travel, layer by layer, from the bottom up through the board. Since each layer absorbs energy, a temperature gradient exists from bottom to top of the board. Therefore, to achieve a uniform and homogeneous heating of the board, a correspondingly long time has to be accepted.

  6. Preheating: Multi-layer Boards with IR from bottom ΔT 30K LP Bottom Side – Surface Temperature Critical! 160°C IR Preheateronlyfrombottomside, withmaximum power (100%) ! Long Preheat Time 140s LP Top Side Temperature

  7. Preheating: Multi-layer Boards with IR from bottom ΔT 20K LP Bottom Side – Surface Temperature High! 150°C IR Preheateronlyfrombottomside, withreduced power (66%) ! Very Long Preheat Time 190s LP Top Side Temperature

  8. T +++ ∆T  T +++ Preheating Multilayer Boards - Telecommunication (24 Layers) If multi-layer boards are supplied with thermal energy from both sides, the heat penetrates the board simultaneously from top and from bottom. As a result, the temperature gradient is very small, and the board warms up uniformly and homogeneously at a much faster rate. At the same time, the stress experienced by the lower side is reduced, and the danger that the flux is damaged during the preheat process is minimized.

  9. Preheating: Multi-layer Board with IR from bottom + convection from top ΔT 10K LP Bottom Side – Surface Temperature Not Critical! 140°C Preheating from bottom and from top, with reduced power (65%) ! LP Top Side Temperature Short Preheat Time 110s

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