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MAJOR FOL ASSEMBLY EQUIPMENT

WAFER MOUNT TOYO ADTECH FM-508 WAFER SAW ADT 7200 & DFD641 / DFD6361 Alignment precision: ± 1.0µm Alignment Chip size: 0.2mm or more 8 inch max wafer size DELVOTEC 6400 Max 3 mil Al wire DIE ATTACH: AD898 / 830 Placement accuracy ±1mil (±25.4um) Ø rotation ±0.5º @ 3 sigma

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MAJOR FOL ASSEMBLY EQUIPMENT

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  1. WAFER MOUNT TOYO ADTECH FM-508 WAFER SAW ADT 7200 & DFD641 / DFD6361 Alignment precision: ± 1.0µm Alignment Chip size: 0.2mm or more 8 inch max wafer size DELVOTEC 6400 Max 3 mil Al wire DIE ATTACH: AD898 / 830 Placement accuracy ±1mil (±25.4um) Ø rotation ±0.5º @ 3 sigma Die size: 0.040x0.040 – 1.0x1.0 inch Die thickness: 4 mils (100 um) min Wafer size: 8 inch (200 mm.) max Bonding accuracy ±0.12mil (±3um) Transducer Freq 138KHz BH X-Y Resolution 0.2um Z Resolution 0.4um PRS Accuracy +/- 0.37um Max Wire Length 8mm (315mils) Min Wire Length 0.5um (0.02mil) Min Loop Ht 100um (4mils) WIRE BOND: EAGLE 60 Max 2 mil Au wire Epoxy die attach machine with +/-1 mil placement accuracy MAJOR FOL ASSEMBLY EQUIPMENT

  2. PACKAGE SAW SINGULATION Disco DFD641 / 6361 Alignment precision: ± 1.0µm Alignment Chip size: 0.2mm or more • PICK and PLACE • ASM CS500 / STI268 • Programmable X-Y-θ multi-stage ejector table • Package dimensional / ball inspection Rotary • Alignment and Inspection module • Process speed : 5000 UPH • Alignment PRS DTFS: ISIT MAJOR EOL ASSEMBLY EQUIPMENT MOLD ASM IdealMOLD Clamp Force: 80 tons for 2 strips Soft-Close: 0.1mm with < 1 ton net force on mold surface Transfer Force: Max 3 tons Temp Control: ± 2ºC at mold surface with CPK of 1.67 Speed Control: 0–15 mm/s with 10 steps control Automatic Substrate Thickness Compensation

  3. SCREEN PRINT (SEMI-AUTO) • Machine: DEK 248 • Accuracy: 25um @ 3Sigma • Capability: 0.3mm pitch QFP; 0402 chips • Max Board Size: 500 mm x 450mm SOLDER PASTE SCREEN PRINTER • PICK AND PLACE • Machine: JUKI KE-750 • 14,400 UPH • Accuracy:  0.1mm • Mounting Angle: 0~359º (1º increment) CHIP ATTACH IN TNR INPUT • REFLOW SOLDERING • Machine: HELLER 1500W • 5-Zone Top and Bottom Independent • Heaters • Waterless Cooling System • Mesh Belt and Edge Hold Conveyors • Heater Temperature Rangeof 350º SOLDER PASTE REFLOW MAJOR SMT-COB ASSEMBLY EQUIPMENT INCOMING QUALITY ASSURANCE High and Low Power Microscope

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