'Chip size' diaporamas de présentation

ITRS Table Definitions/Guidelines, Proposal Rev1, 7/11/00

584 views • 42 slides

ORTC 2012/13 ITRS Work IRC and CTSG Plenary

CORRECTED/ UPDATED 04/23/12 FOR 2012 IRC & CTSG WORK to prepare for 2013 ITRS. ORTC 2012/13 ITRS Work IRC and CTSG Plenary. Alan Allan 04/23/2012 Based on [WAS] ORTC Final Rev 1a, 12/13/11 [plus backup].

580 views • 37 slides

Design Flow Enhancements for DNA Arrays

Design Flow Enhancements for DNA Arrays. Andrew B. Kahng 1 Ion I. Mandoiu 2 Sherief Reda 1 Xu Xu 1 Alex Zelikovsky 3. (1) CSE Department, University of California at San Diego. (2) CSE Department, University of Connecticut. (3) CS Department, Georgia State University. Outline.

375 views • 37 slides

Overall Roadmap Technology Characteristics (ORTC) 2012

Overall Roadmap Technology Characteristics (ORTC) 2012. Alan Allan Winter Hsinchu Public Conference Rev 4, 12/05/12. 20 Years Of Technology Roadmap. 1991. First NTRS workshop 1992. 11 TWGs established. First edition of NTRS 1994, 1997. Second and third NTRS editions

583 views • 34 slides

2009 ITRS ORTC

2009 ITRS ORTC. Public Presentation 07/15/2009 A. Allan - Rev 9, 07/14/09. 7/15 2009 ITRS ORTC Pre-Summary. ORTC Model Completed and delivered to TWGs for San Francisco TWG Interdependency Preparation MPU Model completed based upon Design TWG model proposals

513 views • 31 slides

P hase 2 pixel electronics

P hase 2 pixel electronics. Jorgen Christiansen, CERN. This meeting. Serial powering: Fernando, Stella, Giacomo Material estimate and improvements: Stella Thermal estimates (shunt LDO): Yadira Pixel cable services : Charles CHIPIX65 demonstrator: Lino RD53A: Flavio

316 views • 31 slides

ITRS Conference, December 6, 2000

Copper Conductors (8 Levels). Low-k Dielectric. Copper Plugs. THE DEVICE. 100 nm High End MPU & ASIC Device. ITRS Conference, December 6, 2000. Updates to the 1999 ITRS, and Previews of International FEP TWG Plans for the 2001 ITRS. 1% of the thickness with 60% of the issues.

527 views • 30 slides

Pulping and Bleaching PSE 476

Pulping and Bleaching PSE 476. Lecture #1 Introduction. Introduction to Pulping: History of Papermaking. 3000 BC: Papyrus Exterior of reed is laminated and pressed to form sheet Developed by Egyptians Word paper derived from papyrus Making of papyrus.

541 views • 26 slides

International Technology Roadmap for Semiconductors 2006 ITRS Update/ORTC Product Models Status

International Technology Roadmap for Semiconductors 2006 ITRS Update/ORTC Product Models Status [Including 1Q06 SIA/SICAS* Industry Technology Capacity Demand Analysis] For Public 07/12/06 Conference SEMICON / San Francisco, CA (Draft Rev 0, 06/30/06).

542 views • 26 slides

????

????. Using Multi-Bit Flip-Flops for Clock Power Saving. CAD contest 2010 Problem B1. ???? : ??? ??? : ??? ???. Introduction. Multi-bit flip-flop. Area and power consumption of multi-bit flip-flops. ???? 2010CAD ?????. Problem Descriptions. Timing Slack Constraint

380 views • 26 slides

07/24/02 Alan Allan / Intel Corporation

The International Technology Roadmap for Semiconductors Overall Roadmap Technology Characteristics (ORTC) Overview. 07/24/02 Alan Allan / Intel Corporation. Key Messages.

353 views • 23 slides

2009 ITRS ORTC

2009 ITRS ORTC. Public Presentation 12/16/2009 Allan - Rev 1, 12/16/09. 7/15 2009 ITRS ORTC Pre-Summary. ORTC Model Completed and delivered to TWGs for San Francisco TWG Interdependency Preparation MPU Model completed based upon Design TWG model proposals

388 views • 20 slides

International Technology Roadmap for Semiconductors 2006 ITRS Update/ORTC Product Models Status

469 views • 20 slides

Design TWG

Design TWG. 2000 Update Plans for 2001 Hsinchu, Taiwan December 2000. Role of Design in ITRS. Before 1999 Focused on hardware design and test: tool issues and technologies Detached from rest of Roadmap 1999 Highlighted SOC trends and requirements

314 views • 19 slides

Computers

Computers. Presented to you by Cory Collard. What is a computer?. Definitely not a cup holder!. How they work. Many different components put together. Motherboard CPU BIOS CMOS RAM ROM Peripheral. Motherboard. CPU. BIOS. Usually accessed before boot up.

263 views • 14 slides

Nitride-Based LEDs With Phosphoric Acid Etched Undercut Sidewalls

Nitride-Based LEDs With Phosphoric Acid Etched Undercut Sidewalls. P.K Lin. 1. Outline. Introduction Experiments Results and Discussion Conclusion References. 2. Introduction.

156 views • 4 slides

Introduction

Introduction. The con?guration of InGaN / GaN MQWs plays a key role in the internal quantum ef?ciency(IQE ) of LEDs. In the MQW, the carriers must effectively increase the concentration and uniformly spread across all quantum wells to improve the IQE.

138 views • 2 slides