'Dram capacity' diaporamas de présentation

1 Carnegie Mellon University 2 Intel Corporation

An Experimental Study of Data Retention Behavior in Modern DRAM Devices Implications for Retention Time Profiling Mechanisms. Jamie Liu 1 Ben Jaiyen 1 Yoongu Kim 1 Chris Wilkerson 2 Onur Mutlu 1. 1 Carnegie Mellon University 2 Intel Corporation. Talk Agenda.

804 views • 61 slides

Introduction to Computer Engineering

Introduction to Computer Engineering. Stamatis Vassiliadis / Georgi N. Gaydadjiev Computer Engineering Laboratory EEMCS Delft University of Technology. Introduction. Code: ET4246 Docents: Stamatis Vassiliadis / Georgi N. Gaydadjiev

515 views • 27 slides

CSE 141 Exponential Growth

321 views • 21 slides

Chip Manufacturing Process

Blank wafers. Silicon ingot. Slicer. 20 to 30 processing steps. 8-12 in diameter 12-24 in long. < 0.1 in thick. Tested dies. Patterned wafer. Individual dies. Die Tester. Dicer. Packaged dies. Tested Packaged dies. Bond die to package. Part Tester. Ship to Customers.

131 views • 7 slides