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Diamond Inner Region for Thermal Modeling

Diamond Inner Region for Thermal Modeling. Brian Maynard April 30, 2010. Assumed Material Properties. Power dissipation for irradiated silicon (input to ANSYS). Power dissipation at 1e16 n eq /cm 2 ~122 mW/cm 2 (from T. Affolder ). For annealed silicon, we simply multiply

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Diamond Inner Region for Thermal Modeling