'Solder bumps' diaporamas de présentation

Low-cost bump bonding activities at CERN

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Performance of a high throughput multichannel detector for life science applications

368 views • 24 slides

Flip Chip/Bumping Process at VTT

Flip Chip/Bumping Process at VTT. By Jaakko Salonen (jaakko.salonen@vtt.fi). Last modified March 16, 2007. VTT's Flip Chip Process: Overview. Flip Chip Bonding With Solder Bumps. Area array type interconnecting technology is ideal for hybridizing pixel sensors with readout chips.

752 views • 23 slides

Flip Chip/Bumping Process at VTT

Flip Chip/Bumping Process at VTT. By Jaakko Salonen (jaakko.salonen@vtt.fi). Last modified March 16, 2007. VTT's Flip Chip Process: Overview. Flip Chip Bonding With Solder Bumps. Area array type interconnecting technology is ideal for hybridizing pixel sensors with readout chips.

1.2k views • 23 slides

Thermal Cycling Tests of Dummy Modules

Thermal Cycling Tests of Dummy Modules Setup Pre-cycling resistance measurements IZM module results Alenia module underway Setup Modules built with CERN Flex V.2 and bare dummy module. Used Ecobond glue under MCC, pigtail bonding field, and 4 corners.

427 views • 7 slides

Package types

Package types. Livello 1 : Connecting die to package. Wire Bonding Backside of the die is attached to the substrate. Pads are individually connected to pins with Al or Au wires. Solder bump bonding

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Low mass carbon based support structures for the HL-LHC ATLAS pixel forward disks

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