1 / 19

Data Concentrator Board Implementation Concept Rev 2 Update

Data Concentrator Board Implementation Concept Rev 2 Update. Tom O’Bannon University of Maryland 7/16/2013—Updated on 7/19/2013. Objectives. These charts are not intended to imply any decisions. T he goal here is to stimulate some dialog: Ensure understanding of key requirements

tarik-chandler
Télécharger la présentation

Data Concentrator Board Implementation Concept Rev 2 Update

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Data Concentrator Board Implementation ConceptRev 2 Update Tom O’Bannon University of Maryland 7/16/2013—Updated on 7/19/2013

  2. Objectives • These charts are not intended to imply any decisions. • The goal here is to stimulate some dialog: • Ensure understanding of key requirements • Offer some general conceptual talking points of the UT electronics implementation details

  3. Operating Environment for Data Concentrator Electronics1 1 Per ‘Mechanical Requirements Document for the LHCb UT Upgrade Tracker” Rev 5/3/2013---WIP • Physical Environment • Ambient temperature: 20 ± 2°C • Ambient pressure: Normal Atmospheric • Ambient relative humidity: 40% (typ) • Radiation: 10 Krad • 10-year accumulated exposure • Includes a 2x radiation safety factor • Magnetic Field: 2,500 Gauss • Electrical Stresses • 1000V (ie ±500 VDC) worse case detector bias potentially routed thru detector electronics assemblies

  4. UT Physical Location Definitions 1539 mm (Upper Balcony Area) 4.5 cm 27 cm 4.5 cm UT Detector is electrically divided between top and bottom Quadrant: Upper-Left Quadrant: Upper-Right 1349.4 mm Quadrant: Lower-Right Quadrant: Lower-Left Station 1, Layer B Station 1, Layer A Station 0, Layer B Station 0, Layer A (Lower Balcony Area) UT Detector is split apart Left-from-right for maintenance access Physical Configuration: 8 Edge Interfaces x2 for Flex Tails to Data Concentrator Boards (x2 facilitates mechanical right-left separation)

  5. UT ASIC Access via Flextails1:Station 0: UTaX and UTaU Station 0, Layer B, Upper= 496 Station 0, Layer A, Upper= 496 Station 0 has 1984 FE ASICs Station 0, Layer B, Lower= 496 Station 0, Layer A, Lower= 496 1 This analysis based upon JC Wang presentation on 6/17/13

  6. UT ASIC Access via Flextails1:Station 1: UTbXand UTbU Station 1, Layer B, Upper= 552 Station 1, Layer A, Upper= 552 Station 1 has 2208 FE ASICs Station 1, Layer B, Lower= 552 Station 1, Layer A, Lower= 552 1 This analysis based upon JC Wang presentation on 6/17/13

  7. UT ASIC E-Link Distribution1:Station 0: UTaX and UTaU Station 0 has 2754 E-Links Per Quadrant via 8 Flex Tails:  56 Hybrids  ~ 350 E-Links 1 This analysis based upon JC Wang presentation on 6/17/13

  8. UT ASIC E-Link Distribution1:Station 1: UTbVand UTbX Station 1 has 3254 E-Links Per Quadrant via 9 Flex Tails:  63 Hybrids  ~ 410 E-Links 1 This analysis based upon JC Wang presentation on 6/17/13

  9. UT Data Interface Summary Station 0 Per Quadrant via 8 Flex Tails:  56 Hybrids  ~ 345 E-Links  ~ 35 GBTx’s 1984 FE ASICs 2754 E-Links 276 GBTx’s Station 1 Per Quadrant via 9 Flex Tails:  63 Hybrids  ~ 407 E-Links  ~ 41 GBTx’s 2208 FE ASICs 3254 E-Links 326 GBTx’s UT Total Raw Data Rate1  1,945.6 Gbps 4,192 FE ASICs 952 Hybrids 6,008 E-Links 608 GBTx’s 1 ( ie without data link overhead)

  10. Initial Electronics Concept-Annotated GBTX-Master DCB DC-DC Power Backplane

  11. Board-Level System Partition Options 1 Note--System board-level partitioning will increase this quantity slightly • Assume standard EDAC (80 bits/frame) for GBTx operation • Total of 6008 Data E-Links (initial estimate only) • Requires 601 GBTx’s1 dedicated for data transmission • Example Partitions: • 12 GBTXs per board requires 51 DCBs • 8 GBTXs per board requires 75 DCBs • What are the mechanical interface options along the left and right of the topand bottom detector plane edges? • Option: one backplane per detector plane quadrant • Yields 16 smaller backplanes • Facilitates right-left mechanical split • Would be helpful if the 4 quadrants of each detector plane are made symmetrical

  12. Some More Questions • Environment, Health, and status sensors? • Type, quantity, update rates • Failsafes and interlock approach? • FE ASIC control interfaces via GBT-SCA: • Interface port type? • I2C, JTAG, parallel port, SPI • Data update rates? • Number of FE ASICs per GBT-SCA? • Initial prototype effort/support? • DC-DC power distribution and regulation • FE ASICS • DCBs • Control Board • Test Equipment plan? • Any dedicated handshake signal interfaces required between FE ASICs and GBTs? • Data Valid / txRdy / rx_Rdy

  13. Digital Control Interface Signal Details/Options Preferred Choice • GBT-SCA—Control via one 80 Mbps E-Port • SPI (Serial Peripheral Interface) • Serial Clock • Serial Data out • Serial Data in • 1 select line per slave • I2C (Inter-Integrated Circuit) • Serial clock • Serial Data (bidir) • Signals are open drain to allow multiple bus masters • JTAG • Memory interface • Parallel Port • Interrupts • GBTx (Master)– 32 ports available at 80 Mbps • Provides FE ASIC TFC interface • E-Ports (AKA E-Links) • Data In (to GBTx) • Data Out (from GBTx) • Clock Out (from GBTx)

  14. GBT-SCA Analog Interface Signal Details1 Need to identify sensor specifics and any associated signal conditioning circuitry requirements to accommodate the GBT-SCA defined analog interface. 1 Per Dec 15, 2011 Kostas.Kloukinas@cern.ch summary charts • 12-bit ADC • Input range: GND < Vin < 1 V • Max. conversion rate ≈ 3.5 KHz • 32 Multiplexed Input channels • 31 general user input channels • 1 channel dedicated to on-chip temperature sensor

  15. DCBFE ASIC Interconnect Concept…

  16. DC Power Conversion, Regulation, and Filtering Split the FE ASIC and DCBs DC power rails • What are the preferred distributed DC power rail voltages • Input = 9V (11.5V at counting room)? • Backplane rails: ____? • GBTx=1.5V, FE ASIC= ___?, VL= 2.5V • Select a standard (ie w/ CERN Heritage) rad-tolerant LDO to facilitate local power regulation and switching noise filtering

  17. Board Function Summary Initial concepts and functional placeholders to be refined by on-going system definition development as well as cost and schedule constraints • GBTx-Master • Bi-direction control interface via GBTx and versatile link ASICs • FPGA-Based Local Manager allows for local support functions • DC-DC converter power segmented control (isolation/sequencing) • switch mode frequency synchronization/coordination • Autonomous failsafes and interlocks to protect hardware • Local low drop out regulators • Data Concentrator Board • E-link to GBTx to VL • Local low drop out regulators • DC-DC Converter Board • High voltage EMI filtering + local isolation switch controls • Low voltage DC-DC conversion + EMI filtering • Low drop out regulators for FE ASICS • Backplane • Fully Passive • EMI filtering for EMI isolation and suppression • Interconnect signal routing to match flex tail E-Links to DCBs

  18. An Alternate ‘Back Burner’ Approach Above excerpt from CMS ngCCM(Terry Shaw) Potentially useful in the initial prototype detector slice proof-of-concept build • Alternate prototype approach using intermediate FPGAs between FE ASICs and GBTx. • Flexibility since it can be remotely re-programmed • Potential GBT SERDES alternate via SF2 SOC effort if GBTs not readily available • Potential to reduce risks by accommodating unexpected ‘design features’ between FE ASICs and GBTs

  19. Near Term Path Forward • Discuss support needs for prototype development • Continue system partition efforts • Signal tabulations at all interfaces • Power rollups • Estimate board areas • Define mechanical interfaces

More Related