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Discussion with HPK

Discussion with HPK. 14 Jan 2008 Toru Tsuboyama (KEK). Phone call to HPK. Discussion with Mr. Inutsuka, the sales manager of HPK semiconductor division. They are now carefully checking the market (HEP, Space, Cosmic ray, Medical …) and it is not yet a time to discuss on technology detail.

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Discussion with HPK

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  1. Discussion with HPK 14 Jan 2008 Toru Tsuboyama (KEK)

  2. Phone call to HPK • Discussion with Mr. Inutsuka, the sales manager of HPK semiconductor division. • They are now carefully checking the market (HEP, Space, Cosmic ray, Medical …) and it is not yet a time to discuss on technology detail. • I told we prefer sensors from 6 inch wafers. • They know roughly the amount of sensors we need. • I told that I requested budget to buy sensors in fiscal year 2009.

  3. APV25 purchase • KEK administration people are preparing a contract document to be exchanged between KEK and CERN. • It takes a long time since last year end. • Already 8 wafers for thinning has arrived to Vienna.

  4. SVD construction schedule 7 Jan 2008 T. Tsuboyama (KEK)

  5. SVD production • Thomas’s chart • It is not possible to procure all sensors in 1 year. • I guess it takes 3 years to complete all sensors. • Final ladder production will be done in 2013.

  6. SVD production • Thomas’s chart (modified) • 3 years for sensor production with some spares. • Final ladder production will be done in 2013. • 0.5-1 year system test before installation. • SVD and DEPFET installation should be done after we understand background conditions, e.g., 0.5 years. system test

  7. Production speed • 100-150 DSSD per year * 3 years. • 24 ladders per year * 3 years. • 72 ladders installation in the last year. • DSSD production hopefully starts at end of 2009.

  8. Discussions in the meeting • Thomas: The production speed in a company is faster than 100 sensors per year. • Tsuboyama: We need DSSDs of several types. If we start from the mask design, one type of sensor requires >0.5 years. • Ushiroda: We should set a mile stone when we do evaluation and when we decide the company for the mass production and update the construction schedule. • Kawasaki: 3 years ago, HPK people gave us several reasons why they can not continue DSSD production. 4” wafers are not popular now. We should confirm if the situation changed or not. • Hans-Jurgen: We need to specify the test items and confirm if the test is done satisfactory. • Tsuboyama/Ushiroda: In case of SVD1 and SVD2 leak current, bias resistor and ac-coupling capacitance were examined in HPK. We did ladder assembly without test. After wire bonding, we checked the bias leakage current and bad channels (noisy or pin-holes). Usually HPK test is satisfactory.

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