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Ruggedized High-Speed Camera Module

Ruggedized High-Speed Camera Module. Project Description Design and develop a camera system that can capture, package, and transmit high-speed still image and video data in a compact ruggedized housing which may be subjected to extreme cold, heat, and moisture-laden environments.

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Ruggedized High-Speed Camera Module

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  1. Ruggedized High-Speed Camera Module Project Description Design and develop a camera system that can capture, package, and transmit high-speed still image and video data in a compact ruggedized housing which may be subjected to extreme cold, heat, and moisture-laden environments. • Specifications • Incorporate interchangeability between C-mount lenses, M12 Holder • w/ lenses, and M3F Focus Module w/ M12 lenses. • Shall be capable of transmitting full frame rate of 14 MP sensor. • Shall transmit data at a minimum of 2 Gbps over at least 10 feet of • cable. • Cable shall transmit power to camera. • Meets IP-64 Water Resistance, oil resistance and is ruggedized • Operating Temperatures: -40 F to 221 F • Max Dimensions: 1.2” X 1.2” X L P13571 Team Members: (from left to right) Jose Portugal (ME), Stephen Goss (CE), Peter Hood (CE), Cameron Staunch (ME), Andy Anthony (EE), and Stephen Brown (EE). [Faculty Guide: Adriana Becker-Gomez, Ph.D. (CE)] Mechanical Design • Fluorocarbon and Buna-N gaskets to ensure high temperature and • waterproof operation. • Copper cold finger, aluminum housing, and thermal foam to reduce • thermal resistance from FPGA circuit board to atmosphere. • FEA thermal analysis to ensure thermal reliability [S.F.=1.1] • Modal Analysis to ensure enclosure withstands vibrations from • high performance engines. • Anodized surface finish increased abrasion and corrosion • resistance, electrical resistance, while maintaining thermal heat • conductance. Software Circuit Board Design • Preliminary research led to the selection of CoaXPress, a • high speed serial communication standard for the • transmission of video and still images over coaxial cable. • An FPGA system design was created using Verilog to implement the • CoaXPress data transfer model. • Independent two stage design to capture and transmit data. • 32-bit CRC for data validation. 14 MP Image Sensor Board – Contains an OV14825 14.6 megapixel CMOS image sensor that can output raw pixel data in parallel format or MIPI-CSI-2 (a high-speed LVDS protocol in portable electronic devices). (Designed by D3) FPGA Board – Includes an Altera Cyclone IV GX FPGA that uses high-speed transceiver architecture to transmit data at speeds up to 2.5 Gbps. Also includes SPI Flash memory and 156.25 MHz LVDS oscillator. Power Distribution Board – Includes 2 switching power supplies (2.5V, 1.2V) and the M3F Focus module connector. Coax Board – Includes a 24V to 3.3V switcher and a data transmission circuit that adheres to the CoaXPress physical layer protocol. Sponsored by: Special thanks to: D3 Engineering (Scott Reardon (CEO), Jason Enslin, and Jim McGarvey), LightforceTechnology (Peter Hammond), Altera Corporation (Robert Spurr and Bill Jenkins), Coating Technology Inc., Dr. Antonio Mondragon, & the RIT Machine Shop Personnel.

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