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АСЕМБЛИРАНЕ НА ЕЛЕКТРОННА АПАРАТУРА

АСЕМБЛИРАНЕ НА ЕЛЕКТРОННА АПАРАТУРА. доц. д-р инж. Валентин Видеков. 1. Видове монтаж - механичен - електрически - ниво кристал - ниво елемент - ниво модул - планарен монтаж - обемен монтаж - тримерен монтаж. *. 2. Монтаж на ниво чип/кристал - присъединяване на чип към основа

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АСЕМБЛИРАНЕ НА ЕЛЕКТРОННА АПАРАТУРА

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  1. АСЕМБЛИРАНЕ НА ЕЛЕКТРОННА АПАРАТУРА доц. д-р инж. Валентин Видеков

  2. 1. Видове монтаж- механичен- електрически- ниво кристал- ниво елемент- ниво модул- планарен монтаж- обемен монтаж- тримерен монтаж

  3. * • 2. Монтаж на ниво чип/кристал • - присъединяване на чип към основа • - външни връзки чрез бондиране • Странично бондиране • Челно бондиране • Еднобондово свързване • Двубондово свързване • Трибондово свързване • Многослойно бондиране • Лентово бондиране • -тримерен монтаж на ниво чип

  4. Странично бондиране

  5. странично бондиране

  6. . *

  7. Челно бондиране

  8. Двубондово свързване *

  9. -тримерен монтаж на ниво чип

  10. В презентацията са използвани материали от следните източници: • Ichimitsu Itabashi, Gold Use in Electronics: Bonding WireThe LBMA Precious Metals Conference 2004, Shanghai pp 77 – 80 • http://www.lbma.org.uk/conf2004/3C.c.itabashi_ LBMAConf 2004 .pdf • Diane Kolos, Bruno Munoz, Exam of GLAST LAT MCM SN 775 Failed Bond Wires • http://wwwglast.slac.stanford.edu/TrackerHardware/ART/MCM&Cables/DPA_MCM_SN-775.pdf • http://www.icknowledge.com/ • G. E. Servais and S.D. Brandenburg Wire Bonding – A Closer Look ISTFA'91: The 17th International Symposium for Testing & Failure Analysis, Los Angeles, California, USA / 11-15 November 1991 525-529 • http://www.aecouncil.com/Papers/aec3.pdf • YAIR ALCOBI, Stacked Die & Multi-tier Application, Advanced Packaging october 2005 • http://www.kns.com/library/ap_stacked_die_oct05.pdf • Peter R. Harper, Thermoplastic Die Attach For Hermetic Packaging, The International Journal of Microelectronics and Electronic Packaging, Volume 17, Number 4, Fourth Quarter 1994 (ISSN 1063-1674) • http://www.cooksonsemi.com/tech_art/pdfs/ Application%204_T-Plast%20Die%20Attach_Hermetic%20Pkg.pdf

  11. 12. J. Seuntjens, Z. P. Lu, R. Emily, C. W. Tok, F. Wulff, San Sanda Aung, and S. Kumar Development of New Ultra-high Stiffness Gold Bonding Wire 13. http://www.utilisegold.com/pdf/ AW99_paper.PDF 14. F. WULFF, C. D. BREACH, K. DITTMER Crystallographic texture of drawn gold bonding wiresusing electron backscattered diffraction (EBSD), JOURNAL OF MATERIALS SCIENCE LETTERS 22, 2003, рр. 1373 – 1376 http://160.94.16.161/UserStorage/Users/Thurn/Wulff%20JMSLett.pdf 15. A. Harris, Wire Bonding Notes, http://www.astro.umd.edu/~harris/docs/Bonding _notes.pdf 16. Ivy Wei Qin, Advances in Bonding Technology, Advanced Packaging July, 2005,http://ap.pennnet.com/Articles/Article_Display.cfm?Section=Articles&Subsection=Display&ARTICLE_ID=231845 17. Bonding Wire & Ribbon http://www.williams-adv.com/packagingMaterials/ bonding-wire-ribbon.php8/2006 18. Vivek Dixit   Heidi Davis   Mel Clark, Wire Bonding Considerations Design Tips for Performance and Reliability, Advanced Packaging July, 2006 http://ap.pennnet.com/Articles/Article_Display.cfm?Section=ARTCL&ARTICLE_ID=260447&VERSION_NUM=2&p=36 19. Mike McKeown and Gerard O'Brien Large Diameter Wire Bonding to Organic Boards http://circuitsassembly.com/cms/content/view/3696/95/ http://wps2a.semi.org/wps/portal/_pagr/135/_pa.135/745?&dFormat=application/msword&docName=P001230 20. http://www.wtec.org/loyola/ep/c4s8.htm ТАВ

  12. 21. Zonghe Lai and Johan Liu, EFFECT OF THE MICROSTRUCTURE OF Ni/Au METALLIZATION ON BONDABILITY OF FR-4 SUBSTRATE http://extra.ivf.se/ngl/documents/ChapterA/cobpaper.pdf • 22. http://www.kns.com/knsnew/pdfs/copperwire.pdf • 23. Shivesh Suman, Michael Gaitan*, Yogendra Joshi, George Harman,Wire Bond Temperature Sensor, http://www.me.gatech.edu/METTL/publications/2001/IMAPS_ Shivesh.PDF • 24.KER-CHANG HSIEH , THEO MARTENS Ag and Cu Migration Phenomena on Wire-Bonding Jougrnal of ECLECTRONIC MATERIALS, Vol. 29, No. 10 , 2000 рр 1229-1232 http://doc.tms.org/ezMerchant/prodtms.nsf/ProductLookupItemID/JEM-00101229/ $FILE/ JEM-0010-1229F.pdf?OpenElement • 25. http://extra.ivf.se/ngl/A-WireBonding/ChapterA1.htm • 26. http://www.national.com/appinfo/die/0,1826,857,00.html • 27. А.И.Мазур, В.П.Алехин, М.Х.Шоршоров, Процесы сварки и пайки в производстве полупроводниковых приборов Москва „Радио и связь” 1981 • 28. http://www.captcenter.org/new/wirebonding.htm8/2006 • 29. Ivy Wei Qin, Kulicke & Soffa, Willow Grove, Pahttp://www.chipscalereview.com /issues/1102/f5_01.php8/2006 • 30. http://www.kns.com/Templates/showpage.asp?TMID=84&FID=5788/2006 • 31.http://www.pb.izm.fhg.de/p2sa/020_Technologies/Kontaktierung/Dl_Drahtbonden,IMG2_DEFAULT.html8/2006 • Eric Bogatin Roadmaps of Packaging Technology Integrated Circuit Engineering Corporation 1997 ISBN 1-877750-61-1 pp. 9-1 – 9-38 • http:// smithsonianchips.si.edu/ice/cd/PKG_BK/TITLE.PDF8/2006

  13. 34.Tiao Zhou, Mark Gerber, Stacked DiePackage Design Guidelines http://www.amkor.com/products/notes_papers/StackedDie_Package_Design_Guidelines_IMAPS2004.pdf#search=%22wire%20bonding%228/2006 35. Randy Sampan, Raymond Kuang, Aluminum Wedge Bonding on RTAX-S Devices Actel January 18, 2006 36. Die Products Consortium http://www.dieproducts.org/tutorials/quality/wirebond/ quality2d_ultra.php8/2006 37. Материали предоставени от фирма „Нано Тулс Шоп” Ботевград 38. Ilan Hadar, Hun Teak Lee, Asaf Hashmonai, Jong Kook Kim, 35µm Bond Pad Pitch Wire Bonding Process Productivity Performance tests SEMICON Singapore 2004 39.Small Precision Tools http://www.smallprecisiontools.com/8/2006 40. Luis Cupido Wire Bonding (For Microwave and Millimeter –Wave, on a low budget) 41. BOB CHYLAK, STEPHEN BABINETZ, AND LEE LEVINE Ultra-low-loop Wire Bonds Advanced Packaging January, 2006 42.http://ap.pennnet.com/articles/article_display.cfm? article_id=245399 43.Zonghe Lai and Johan Liu, EFFECT OF THE MICROSTRUCTURE OF Ni/Au METALLIZATION ON BONDABILITY OF FR-4 SUBSTRATE 48. http://www.freepatentsonline.com/EP0691414.html 49. http://findarticles.com/p/articles/mi_qa3776/is_200311/ai_n9327659 50. Michael Topper, Herbert Reichl , From Wafer Level Packaging to System Size Packaging, Flip Chip Bumping and Wafer Level Packaging pp. 18-19 SECAP 51. S.N. Song*, H.H Tan, P.L. Ong Die Attach Film Application in Multi Die Stack Package 2005 Electronics Packaging Technology Conference pp. 848- 852 http://extra.ivf.se/ngl/documents/ChapterA/cobpaper.pdf

  14. ТУ – София на Монблан (Алпи) * Не присъствалите на лекции не получават подпис в зала, а някъде там

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