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Substitute beer and pizza?

Substitute beer and pizza?. Basic Silicon Solar Cell as fabricated in Cameron. With Schematic. A detailed traveler is used to define the process steps. The process begins with a silicon wafer, 100mm in diameter, (100) orientation, PRIME grade, p-type boron doped, 1-10 ohm-cm resistivity.

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Substitute beer and pizza?

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  1. Substitute beer and pizza?

  2. Basic Silicon Solar Cellas fabricated in Cameron With Schematic

  3. A detailed traveler is used to define the process steps

  4. The process begins with a silicon wafer, 100mm in diameter, (100) orientation, PRIME grade, p-type boron doped, 1-10 ohm-cm resistivity

  5. The process begins with a silicon wafer, 100mm diameter, (100) orientation, PRIME grade, p-type boron doped, 1-10 ohm-cm resistivity Shown in cross section of wafer

  6. The wafer is cleaned using the sulfuric acid/hydrogen peroxide clean

  7. Using PECVD (plasma enhanced chemical vapor deposition) the back side is coated with SiO2 to prevent doping of the backside

  8. Using POCl3 as the source for phosphorus doping an n-region will be created in the p-type silicon wafer POCl3 bubbler – nitrogen is bubbled through the liquid POCl3 and carries phosphorus into the tube

  9. With the POCl3 running into the tube, phophorus is diffused into the silicon wafer at 950C

  10. A n-region is now diffused into the silicon wafer at 950C

  11. A metal film (aluminum) is sputtered on the top surface and a photolithographic mask creates a conductive grid in the metal

  12. A metal film (Aluminum) is sputtered on the top surface and a photolithographic mask creates a conductive grid in the metal

  13. Positive photoresist is spun on the metal coated wafer

  14. A transparency mask of the top side grid is placed on top of the photoresist coated wafer and exposed to UV

  15. The image is developed which leaves the metal conductor pattern

  16. With photoresist protecting the metal, the unprotected metal is etched away leaving the top side grid pattern in metal

  17. A metal film is evaporated on the top surface and a photolithographic mask creates a conductive grid in the metal

  18. A second metal film (aluminum) is deposited on the back for backside contact

  19. A second metal film is deposited on the back for backside contact

  20. Using PECVD (plasma enhanced chemical vapor deposition) an anti-reflective coating of SiO2 is deposited on the top surface

  21. Using PECVD (plasma enhanced chemical vapor deposition) a anti-relective coating of SiO2 is deposited on the top surface

  22. Individual cells are diamond saw cut from the wafer

  23. Individual cells are diamond saw cut from the wafer

  24. Electrical testing (I-V trace) of the cell is performed under a solar light simulator Calibration cell determines the intensity of sunlight

  25. Electrical testing (I-V trace) of the cell is performed under a solar light simulator

  26. Electrical testing (I-V trace) of the cell is performed under a solar light simulator Blue trace is without sun light, red trace is with sunlight at 1.0 sun

  27. Completed Solar Cell

  28. Assignment • Lecture 4 assignment from web site

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