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Warm Electronics: Components/Subsystems Test Results

Warm Electronics: Components/Subsystems Test Results. PACS SVR. B. Voss. BOLC FM. errors occurred during thermal vacuum acceptance tests three housekeeping channels found unstable during cold start up test (-30°C) failure seems to be temperature dependent (possibly a week soldering)

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Warm Electronics: Components/Subsystems Test Results

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  1. Warm Electronics: Components/Subsystems Test Results PACS SVR B. Voss Warm Electronics

  2. BOLC FM • errors occurred during thermal vacuum acceptance tests • three housekeeping channels found unstable during cold start up test (-30°C) • failure seems to be temperature dependent (possibly a week soldering) • tests are stopped and BOLC is sent back for repair • tests will be resumed and partly repeated (vibration in at least one axis) Warm Electronics

  3. DEC/MEC QM • equipped with complete nominal section • currently running at MPE • long duration tests • digital interfaces without errors or malfunctions • analogue interfaces OK except: • SPU current housekeeping, known problem with wrong gain setting in DEC/MEC. Corrected for FM • CRE interfaces tested OK during acceptance test, but no long term tests available. Warm Electronics

  4. DEC/MEC FM • in production • schedule delayed by two main problems: • FPGA swap on both DEC Base boards • repair envisaged due week 29 • rearranging test order because of availability of test facilities • erroneous SPU boards • FM will be temporary equipped with erroneous SPU boards thus EMC and environmental test can be performed in time • only small likelihood of malfunction during tests • later exchange of the SPU boards and delta acceptance Warm Electronics

  5. DEC/MEC FM • new schedule by CSL: • repair due week 29 • functional test and vibration due week 32 • thermal vacuum due week 33 • functional retest due week 34 • EMC test at ESTEC due week 35 • delivery to MPE begin of September Warm Electronics

  6. DPU PFM • functional Tests at CGS OK • thermal Tests OK • EMC Test OK (minor NCRs, solved/accepted) • possible problems: • CFM2 showed corrupted memory after some hours of operation at MPE • AVM2 in same configuration is running stable • possible reasons currently under investigation (HW or SW problem?) • errors not reproducible at CGS • PFM now at MPE for comparative tests Warm Electronics

  7. SPU PFM • thermal tests OK • EMC test OK (minor deviations already accepted) • functional test failed under special conditions • during acceptance test campaign 15.05.06 malfunction occurred (CRISA FPL-NC-1214-077-CRS) • start-up SW reports error during application upload command • error affects read from DSP program memory (PRAM) with special bit patterns (all 1’s to all but one bit 0’s) • error is systematic and affects all DSP boards (PACS SPU, PACS DECMEC and LFI REBA) Warm Electronics

  8. SPU PFM • reason of error • not clearly understood yet, but most likely a ground bouncing problem when switching output stages in the PRAMs • repair • repair of EBB with additional ground wires on the board improved the situation • modification of flight spare currently under progress Warm Electronics

  9. Harnesses • Warm Interconnect Harness • QM at MPE • QM showed different weaknesses (bad bonding, wrong back shells, swapped wires in cable bundles) • FM production will take care of these • Cryo Harness • complete and tested • differences in resistance measurements compared to MPE test harness • reason under investigation but most likely due to different measurement systems Warm Electronics

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