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NeSSI * - Generation II “Revolution or Evolution?”

NeSSI * - Generation II “Revolution or Evolution?”. *New Sampling/Sensor Initiative. CPAC - November 5-8, 2001 Rob Dubois - Peter van Vuuren - Jim Tatera. Tatera and Associates. “the best way to predict the future is to create it”. The Recent History of.

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NeSSI * - Generation II “Revolution or Evolution?”

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  1. NeSSI* - Generation II “Revolution or Evolution?” *New Sampling/Sensor Initiative CPAC - November 5-8, 2001 Rob Dubois - Peter van Vuuren - Jim Tatera . Tatera and Associates “the best way to predict the future is to create it”

  2. The Recent History of • ISA2001 Meeting (Joint ISA/CPAC Session) • NeSSI Tutorial Standing Room Only Interest Public Introduction of Generation II Specification • Open Discussion Session (Sept 11 Impact) Main Issue - Area Classification Requirements Identified X-Team to address • Ad-hoc Sensor Connectivity Session CAN-based protocols (e.g. SDS, DeviceNet) best candidates A C-team will clarify benefits of CAN and propose as preferred NeSSI sensor communications standard • MiscellaneousEfforts afoot to extend SP76 to IEC standard NeSSI Tutorial at INTERMAC Meeting in Japan (Nov 8) - Rob DuboisNeSSI Marketing Survey Underway

  3. Legacy NeSSI Hot Off The Press

  4. Major Goals of • Facilitate the acceptance/implementation of... • modular, miniature & smart sample system technology • based on ISA SP76 standardization work • Promote the concept of... • field-mounted smart sampling/analytical systems • integration of sample systems with physical/chemical sensors • Lay the groundwork for... • open connectivityarchitecture for sensor communications (e.g. Ethernet, DeviceNet, etc.) • industry standard communicationprotocols (e.g. OPC, DeviceNet, CAN etc.) • web enabled technologies (e.g. Browser based HMI) • Provide a technology bridge to the process for... • “sensor/lab-on-a-chip” micro-analytical devices

  5. NeSSI Generations • NeSSI Generation I (circa 2000-2002) • mechanical, passive components are on a SP76 substrate • NeSSI Generation II (circa 2002-2004) • “electrified” passive & active components are on a SP76 substrate • integral heating and temperature control of the substrate • all electrical components are integrated with SAM • sensors and actuators communicate via sensor bus • smart (self-diagnostic) sample systems • NeSSI Generation III (circa 2003+) • many analytical sensors and micro-analytical systems • wireless sensors

  6. 1. Heated Substrate 2. Physical Sensors 3. Actuators 4. SAM  5. HMI (Graphical) 6. Wired Bus 7. Wireless Bus 8. X Mini Power Bus 9. Packaging 10. Analytical Sensor Generation II Dimensionscovered in the Specification….

  7. Heating Fluids (alternative) Furn. by substrate mfg. 1. Heated Substrate Div/Zone 1 GP. A-D Div/Zone 1 or 2 GP. A-D Conduction Heating - cartridge heater(s) - over-temperature cut-off AC Power AC Power

  8. 2. Physical Sensors for System Diagnostics • Doing analytical is just not good enough! • Miniature Flow, Pressure, Temperature • Gas and/or liquid service • Rugged construction • Encapsulated (IEC Ex m) • Intrinsically Safe (IEC Ex ib) • Div/Zone 1 Gp A-D; T4 (135 C) FLOW:  P, coriollis, thermal, other? COM A/D Substrate

  9. 2. Conceptual Sensor for NeSSI “Top Hat” Comm. Chip Parallel Ports - standard size/pin - daisy chain A B Body - encapsulated Comm. Digital “Smart” Sensor - engineering units - memory µP BARRIER - Process Seal - Electrical Isolation - Thermal Memory A/D Process Cavity - no unswept voids - low volume Insulation Skirt - engineered 1.50” Base - 316 SS - pressure rated Sensor

  10. 3a. Electrical Actuators on the Substrate - COMBO COMBO Valve /w integral solenoid • Miniature substrate mount • Gas and/or liquid service • Wide P & T service • Rugged, encapsulated (IEC Ex m) • Intrinsically Safe (IEC Ex ib) • Div/Zone 1 Gp A-D; T4 (135 C) Comm. SV AIR On/Off and Proportional Act.

  11. 3b. Conceptual “Combo” Valve Parallel Ports - standard size/pin - daisy chain “TopHat” Comm. Chip B A Comm. D/A 3-way “pilot” solenoid valve - Intrinsically Safe Vent Solenoid Instrument Air Digital On-Board Actuator Actuator - NO or NC Vent Conventional pneumatic valve Valve Engineered Insulation Skirt Thermal Barrier

  12. 4a. SAM explained... Gateway to an Ethernet LAN - OPC perhaps HMI Interface - Field - Graphical - Wireless - e.g. Bluetooth™, 802.11 Software Applets for Sample System Repetitive Tasks (Industry Common) Host to a Sensor/Actuator Bus

  13. 4b. SAMApplets for Common Tasks • Zero & span validation • Pressure regulation • Stream switching • Maintenance diagnostics • Temperature control • Interoperability • talk to all analytical systems Enabling Technology for quick introduction of microAnalytical to Industry SAM

  14. 5. Human Machine Interface PDA     Hello? PC F Vv T Vv P F A Vv=automatic valve; P=pressure sensor; F=Flow Sensor; A=Analytical Sensor;T=Temp. Sensor

  15. ? Analyzer Controller P V A T V T P A Legend: Pressure Sensor Temp Sensor Valve/Actuator Analytical Sensor 6a. Standalone “SAM” with Wired Sensor/Actuator Bus Analyzer System Ethernet LAN • Target Ex ib intrinsically safe • Plug & Play • CAN based connectivity SensorAnalyticalManager(SAM) 

  16. ? P V A T V T P A Legend: Pressure Sensor Temp Sensor Valve/Actuator Analytical Sensor 6b. Embedded SAM With Wired Sensor/Actuator Bus • Target Ex ib intrinsically safe • Plug & Play • CAN based connectivity Analyzer System Ethernet LAN  Analyzer Controller w/ Embedded SAM Functionality

  17. V T P A SensorAnalyticalManager(SAM)  7. Wireless Signal (Gen III…?) Analyzer System Ethernet LAN • Signal: Bluetooth , 802.11, other? • Plug and Play! • Power • X-proof miniature power bus P.S.

  18. 8. What the world needs is... Sensors (typ) • ..a miniature wiring method • “plug & socket” • Division/Zone 1 • e.g. MTL (England) Mini-Power Bus AC Power AC/DC

  19. 9. Enclosure/Package Convection Heater X-Proof (OPTIONAL) Div/Zone 1 GP. A-D Div/Zone 1 or 2 GP. A-D Temp. Sensor Intrinsic Safe AC Power No Purge or Pressurization NEMA or IP Rated Enclosure - insulated

  20. 10. Analytical Sensors (Gen III…?) Fiber Optic SAM  One sensor per component “lab on a chip” AT One Sensor and Multiple Analytes “laser scanning device” A F Vv T A

  21. What would a Gen II prototype look like? • Programmable, heated substrate • Digital, serial sensors/actuators: F, P, T • Zone 1 enclosure interior • SAM; control algorithms • Wireless - graphical HMI • Packaged for outdoor installation

  22. Summary • Generation II NeSSI • Evolution as opposed to revolution • Release of Generation II Spec • 1st quarter 2002 • To NeSSI Distribution List & IFPAC

  23. Dow Danny Quevillon Reg Hartwig Walt Henslee Bac Vu (SP76) Syncrude Ian Verhappen ExxonMobil Chemical Dan Podkulski (SP76) Jeff Gunnell John Cumbus Rajko Puzic CPAC Mel Koch Lloyd Burgess Brian Marquardt Acknowledgements I

  24. Doug Mitchell - Panametrics John Wawrowski - Swagelok Rick Ales - Swagelok Yoav Barshad - Applied Analytics Nick van Bruggen - Porter Carl Jones - Rosemount Analytical CD Feng - Rosemount Analytical Bob Nickels - Honeywell Chris Towle - MTL Acknowledgements II

  25. Technology Teams A-Team – Define Applications for SAM C-Team – Communications for SAM to Sensors + X-Team – Hazardous Electrical Area Issues NeSSI Partners A group of users and vendors to help invest in, develop, and evaluate NeSSI technology. CPAC Web Site Listing NeSSI/SP76 Compatible Components Help Wanted/Needed

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