Jims
PRESENTED BY
4 SLIDES
193 VUES
100 LIKES

Inner Layer Circuit Board Preparation Process Overview

DESCRIPTION

Learn about the step-by-step process for preparing inner layer circuit boards, from initial role film placement to final solder mask coating. Includes details on lamination, drilling, plating, and curing conditions.

1 / 4

Télécharger la présentation

Inner Layer Circuit Board Preparation Process Overview

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. ABF介紹_前言

  2. ABF介紹_構造

  3. Preparation of innerlayer circuit board Preparation of role film Temp: Cold -> R.T. Predrying of boards (Remove water absorption) o 130 C x30min. Opening role Lamination (temporal) (place films onto patterns) Using auto-cut laminator for DFR Using vacuum applicator Vacuum Lamination (Nichigo-Morton 、 MEIKI) o Mechanical d rilling or laser Via formation 100-110 C , 30s Vacuum, 30s Press, +(0.5-0.7) MPa Hot press o to flatten surface 100-110 C , 60s Press, 2-6kgf/cm2 Desmear Treatment with permanganate Removing of PET film Remove when cooled down to room temperature after lamination Electroless copper plating Copper plating Electo copper plating Hot air oven SH , G ; 170degCx30min GX：(90-120degCx30min)+(150-170degCx30min) SH-9K：170degCx30min C ure Subtractive method Pattern formation Semi-additive method RCC;120degCx30min+170degCx30min Repeat for multilayered types Annealing Hot air oven (Post-cure) For RCC, Two step cure is necessary for resin curing without voids or wrinkles. o 170 C x 30-60min. Coating solder mask ABF介紹_製程

  4. ABF介紹_數據 Curing condition; 170degCx90min : SH-9K, GX, GX-10, GX-11, 180degCx90min : GX-35, GX-13, GX-TH3

More Related