Hermetic packaging market Share, Size and Demand

1. Hermetic Packaging Market Hermetic Packaging Market to 2027 - Global Analysis and Forecasts by Product (Passivation Glass, Transponder Glass, Reed Glass, Glass-to-Metal Sealing, Ceramic-to-Metal Sealing); Application (Transistors, MEMS, Sensors, Lasers, Photo Diodes, Airbag Ignitors, Others); Industry Vertical (Aerospace, Medical, Telecommunications, Consumer Electronics, Military and Defense, Automotive, Others)

2. Hermetic Packaging Market The global hermetic packaging market accounted to US$ 3.51 Bn in 2018 and is expected to grow at a CAGR of 6.6% during the forecast period 2019 – 2027, to account to US$ 6.19 Bn by 2027. Hermetic packaging market is led by the Asia Pacific region in 2018. Asia Pacific led the global hermetic packaging market with more than 35% share, followed by North America and Europe. APAC is also expected to be the fastest-growing region in the global hermetic packaging market during the forecast period. The fast growth of hermetic packaging market in APAC is attributed to the large presence of electronics manufactures in China, Japan and South Korea. The global aerospace and defense industry is experiencing a strong growth owing to factors such as growing passenger travel demand and increasing military expenditure in countries such as China and the US. With rising geopolitical tensions in various regions, the aerospace and defense industry is expected to continue its growth trajectory during the forecast period of 2019 to 2027. Hence, factors such as increasing commercial and military aircraft production and rising spending on defense/military equipment are anticipated to drive the demand of hermetically protected electronic components in the global aerospace and defense industry.

3. Hermetic Packaging Market Market Insights The trend of increasing miniaturization of electronic components has become a major concern for packaging solution providers worldwide. The constant technology advancements in various industries are pushing manufacturers to implement miniaturization in order to cope up with rising demands of industries such as aerospace, electronics, automotive, and healthcare. Hence, it has become a necessity for hermetic packaging providers to bring solutions which can support such miniaturized electronic components. Thus, this factor is expected to trigger the growth of the hermetic packaging market in the coming years. The hermetic packaging market on the basis of product is segmented into passivation glass, transponder glass, reed glass, glass-to-metal sealing (GTMS), and ceramic-to-metal sealing (CerTMS). The glass-to-metal sealing product is the leading segments with the highest market share. Further, ceramic-to-metal sealing is anticipated to witness immense growth in the hermetic packaging market during the forecast period. The hermetic packaging market on the basis of industry vertical is segmented into aerospace, medical, telecommunications, consumer electronics, military & defense, automotive, and others.

4. Hermetic Packaging Market LeadingPlayers • The leading players in Hermetic Packaging Market are: • Ametek, Inc. • Egide SA • Kyocera Corporation • Legacy Technologies Inc. • Materion Corporation • Micross Components • Renesas Electronics Corporation • Schott AG • Teledyne Technologies Incorporated • Texas Instruments Inc. • Get sample PDF copy @: https://www.theinsightpartners.com/sample/TIPRE00005583/

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6. Hermetic Packaging Market Access Full Research Report at: https://www.theinsightpartners.com/reports/hermetic-packaging-market Thank You!