0 likes | 1 Vues
High-speed PCB layout trends in the US for 2025 focus on signal integrity, power efficiency, and miniaturization. Best practices include controlled impedance routing, HDI technology, optimized stack-ups, and advanced simulation tools like OrCAD and Allegro. Designers prioritize EMI/EMC compliance, thermal management, and high-speed differential pair routing. With AI-driven automation and faster materials, the industry is evolving to meet 5G, IoT, and high-performance computing demands.
E N D