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V5.15

Hello from Mike Deal at Stanford University - Senior Research Scientist at the Stanford Nanofabrication Facility. V5.15. Nanotechnology. “ Nano ” – From the Greek word for “dwarf” and means 10 -9 , or one-billionth. Here it refers to one-billionth of a meter, or 1 nanometer (nm).

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V5.15

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  1. Hello from Mike Deal at Stanford University - Senior Research Scientist at the Stanford Nanofabrication Facility V5.15

  2. Nanotechnology “Nano” – From the Greek word for “dwarf” and means 10-9, or one-billionth. Here it refers to one-billionth of a meter, or 1 nanometer (nm). 1 nanometer is about 3 atoms long. “Nanotechnology” – Building and using materials, devices and machines at the nanometer (atomic/molecular) scale.

  3. Nanostructures Carbon nanotube Gold/Silver nanoparticle (U. Notre Dame) Intel’s transistors used in their integrated circuits (computer chips)

  4. How do you build something so small? “Top-down” – building something by starting with a larger piece and carving away material (like a sculpture). “Bottom-up” – building something by putting together smaller pieces (like building a car engine). Chemistry is important in both top-down and bottom-up processes

  5. Bottom-up fabrication • Adding atoms to atoms, molecules to molecules • “Self-assembly” of atoms and molecules • Use of chemical and biological processes • Current day examples: Self-assemble of organic monolayers for molecular transistors, etc. (Yale) Carbon Nanotubes Vertical growth of nanowires for electronic devices (Stanford) More extreme example: Self-replicating robots.

  6. Top-down fabrication Method used by integrated circuit industry to fabricate computer chips down to ~ 15 nm size • Makes use of depositing thin films, then “photolithography” and plasma etching to make films into desired patterns on a silicon wafer.

  7. “Top-Down” nanofabrication Silicon wafer

  8. Deposition equipment Silicon wafer

  9. Deposition equipment Gas phase reactants Silicon wafer

  10. Deposition equipment Gas phase reactants SiN film Silicon wafer

  11. SiN film Silicon wafer

  12. Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  13. Photolithography equipment Light source “mask” Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  14. Photolithography equipment Light source Ultraviolet light “mask” Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  15. Photolithography equipment Light source Ultraviolet light “mask” Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  16. Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  17. Chemical developer Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  18. Chemical developer Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  19. Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  20. Etching equipment Plasma gas (etches film) Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  21. Etching equipment Plasma gas (etches film) Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  22. SiN film Silicon wafer SiN thin film patterned correctly!

  23. With contamination present Starting at photoresist step: Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  24. With contamination present Dust particle Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  25. With contamination present Light source Ultraviolet light “mask” Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  26. With contamination present Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  27. With contamination present Another dust particle Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  28. With contamination present Plasma gas (etches film) Photo-sensitive layer (“photoresist”) SiN film Silicon wafer

  29. With contamination present Photo-sensitive layer (“photoresist”) SiN film Silicon wafer SiN thin film patterned incorrectly!

  30. How do you build something so small? • Requires very clean environment: “clean room” Magnified image of contaminant on wafer surface, which can cause defects and failures in nanostructures Relative size of clean room contaminants

  31. How do you build something so small? • Requires very clean environment: “clean room” • People wear clean room suits (also called “gowns” or “bunny-suits) • Huge fans circulate filtered air throughout the facility • Wafers are cleaned in liquid solutions between every processing step A lab user “gowning-up” in SNF

  32. Gregory Book and Swaminathan Rajaraman (Swami) at Georgia Tech University Greg Haugstad at University of Minnesota

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