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Team #55 Reflow Oven

Team #55 Reflow Oven. Project Manager: Patrick Selzer (ME) Team Members: Michael Ladd (ME), Patrick Mooney (EE), Corey Seidel (EE). Executive Summary Problem Statement. Small scale solder ovens sacrifice quality and precision for cost. Executive Summary Deliverables. Completed oven

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Team #55 Reflow Oven

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  1. Team #55 Reflow Oven Project Manager: Patrick Selzer (ME) Team Members: Michael Ladd (ME), Patrick Mooney (EE), Corey Seidel (EE)

  2. Executive SummaryProblem Statement • Small scale solder ovens sacrifice quality and precision for cost.

  3. Executive SummaryDeliverables • Completed oven • Maximum temperature of 300 degree Celsius • Uniform thermal transfer rate • >0.45 reflow space • Profile library • Testing data

  4. Executive SummaryTeam Responsibilities • Control System (CS) • User Interface (PM) • Heating System (PS/ML) • Cooling System (PS/ML)

  5. Executive SummaryResources • $200.00 • Oven by Mar. 14th • Profiles and Testing Data by Apr. 28th

  6. Market OutlookProfessionalModels • Expensive • Precise performance data • Accurate temperature control • Higher reliability • Faster cycle times

  7. Market OutlookDo-It-Yourself (DIY) Ovens • Cheap • No performance data • Untested reliability • Higher cycle times

  8. Market OutlookTarget Markets • Small Business • Reliable • High Performance • Tighter constraints • Low cost • Lower cycle times • Home Hobbyist • Versatile • Ease of use • Low cost

  9. Specifications • Oven Requirements: • Maximum temperature of 300 degree Celsius • Uniform thermal transfer rate • Low Maintenance/Low Budget • >0.45 reflow space • Solder • Lead-Free • Bias against reflow defects • Flux Methods • Relies on solder choice • NoCleanflux if oven and defects permit • User Interface • <$50 CPU • Digital Display • Profile Library • Control System • 2% overshoot • Thermal Profile • Base profile of low ramp-up rate, low peak, high ramp-down rate • Calibrated with respect to solder, flux, oven

  10. Block Diagram

  11. Temperature Profiles • Profile Types • Ramp to Spike • Ramp, Soak, Spike • Low Void Profile • Eliminating Defects • Heating Rate 3°C/s • Cooling Rate of -4°C/s • Time above liquidus 30-60 sec

  12. Heating and Cooling Systems • Resistive heating element • Max oven temperature of 300°C • Internal Convection Fan • 79 ft3/min • 120 mm • Aluminum • External Vents • Solenoid controlled • In-line with convection fan.

  13. Control System • Arduino • Temperature= User Input – Actual Temperature • Applies corrections to within 2% • Output pulse width modulated signal • MOSFET bridge • Act as solid state relay • High-current switching operation • Expandability • Modular to accommodate future expansion

  14. User Interface • Arduino TFT digital display • Standard 4 buttons • Arrange buttons to proximity of text • Up to 12 buttons available • Stop button integrated

  15. Action Item List (AIL)

  16. Resources

  17. Conclusion • Modify Standard Convection Oven • Arduino Board • External Vents • Internal Fan • User Interface • Objectives • Reach 300°C • Heating Rate 3°C/s • Cooling Rate of -4°C/s • Questions?

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