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LTM contribution to SP3-WP6

LTM contribution to SP3-WP6

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LTM contribution to SP3-WP6

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  1. LTM contribution to SP3-WP6 • Two tasks: • Thermal characterization of ultra thin resist films (D 3.6.1.3.1) • Spin Coating and bake modeling for Ultra thin resist films (M 3.6.1.5) Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  2. Thermal characterization of ultra thin resist films (D 3.6.1.3.1) • Thermal expansion of thin films followed by ellipsometry • Simple homopolymer studied : • Polystyrene (PS) • PMMA • Poly Hydroxystyrene (soluble part of CAR) • Studies of Clariant resist : • MMC2 (copolymer) • MMC3 (CAR) • MMC4 (terpolymer) Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  3. Simple polymer 1 : PS(4000 g/mol, Tg ~ 80°C) • No variation of Tg • Increase of the coefficients of thermal expansion for thickness below 50 nm Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  4. Simple polymer 2 : PMMA(950 000 g/mol, Tg ~ 120°C) 47 nm • No variation of Tg •  Influence of the interface effects? • Si/PMMA interactions : • Tg variations and  are not significative • To be continued for thinnest films… Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  5. Simple polymer 3 : PHS (8000 g/mol, Tg ~ 170°C) Solvent evaporation Diminution of the thickness during successive cycles : Degradation or relaxation of PHS chains? Mechanism? • Kinetic measurements shows compaction even for long time • Degradation or chemical modification of PHS with light Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  6. Clariant Resist 1 : MMC2 copolymer hydroxystyrene – butoxystyrene(no PAG) Tg ~ 155°C • Diminution of Tg for thickness below 50 nm (significative?) • Diminution of the thermal expansion •  Contradictory results ? Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  7. Clariant Resist 2 : MMC3 2-methyl-2-adamantol methacrylate (MAdMA)/Mevalonic lactone methacrylate(contains PAG) Thermal compaction of the film above Tg • Presence of PAG : photo activation of the resist with the spot ligth above Tg Compaction Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  8. Clariant Resist 3 : MMC4Terpolymer hydroxystyrene – styrene-butylmethacrylate(no PAG) Tg ~ 160°C Diminution of the thickness of the films during successive cycles : Photo degradation Cycle 2 for 46 nm and 165 nm films : Tg is not detectable Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  9. Thermal properties of Ultra thin resists films • results: • No obvious Tg changes with thickness • Strong influence of the thickness on thermal expansion of the film • Thin layer properties for material if e<100 nm for all materials • Important recommendation • Ligth filtering to avoid photo degradation Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  10. Spin-Coating modeling • Four steps while Spin-coating: 1: Resist deposition Composition unchanged 2 : Film generation 3 : Matter ejection predominant for film thinning 4 : Solvant evaporation predominant Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  11. Film thinning Evaporation at the free surface  concentration gradient and diffusion Hypothesis: wall slows the intermolecular mobility, hence increases the friction parameter between macromolecules Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  12. Spin-Coating Simulation Exemple of the coating of a wafer with a resist Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  13. No wall influence On film homogeneity Post Applied Bake Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL

  14. Accuracy of the model • Without wall effects: the model predicts accurately the spin curves and film compaction while heating • With wall effects: No significant differences after Post Applied Bake on the film structure  Friction parameter accurate? • Conclusion: Further studies are needed to properly simulate wall effects Review Meeting More Moore_SP3-WP CONSORTIUM CONFIDENTIAL