Diamond Wire Wafer Slicing Machine Market - Size, Share, Outlook, and Opportunity Analysis, 2018-2026

1. Diamond Wire Wafer Slicing Machine Market - Global Industry Insight, Trends, Outlook, and Opportunity Analysis 2018-2026 © Coherent market Insights. All Rights Reserved

2. REPORT DESCRIPTION Diamond Wire Wafer Slicing Machine Market Overview Diamond wire wafer slicing machine is used to cut silicon wafer by using a high-speed spindle, which is fit with a diamond blade. A dicing saw is equipped with the machine which cuts these wafers into individual chips. Materials that are sliced from these machine are silicon, silicon carbide, gallium nitride, gallium arsenide, and ceramic, among others. These wafers are used for production of semiconductors, which in turn, are used in the manufacturing of electronic components. Shortcomings of conventional slicing machine is one of the major factors driving growth of the market One of the major factors attributed to growth of the market is restraints in using conventional slicing machines including high volume of wastage while cutting the wafer, low speed of slicing the wafer, and low quality of dices. These factors are driving manufacturers to develop advanced wafer slicing machines, to overcome the challenges associated with conventional machine. For instance, in July 2017, Meyer Burger launched ‘DW288’ diamond wire wafer slicing machine. This machine ensures maximum material utilization while cutting and it requires low electricity while production and this machine also not produces any slurry, which is made of polyethylenglycol (PEG) and silicon carbide (SiC), which further helps in reducing the challenges associated with the recycling of silicon wafer. © Coherent market Insights. All Rights Reserved

3. REPORT DESCRIPTION Global Diamond Wire Wafer Slicing Machine Market: Taxonomy By Cutting Technologies Single Wire Slicing Multi Wire Slicing By Application Mono-crystalline rod Poly-crystalline rod Quartz material By Region North America Europe Download PDF brochure @ https://www.coherentmarketinsights.com/insight/request-pdf/1864 © Coherent market Insights. All Rights Reserved

4. REPORT DESCRIPTION Global Diamond Wire Wafer Slicing Machine Market: Key Trends Increasing use of large size of wafer is a key trend that is being witnessed in the market. For instance, according to a press release of SEMI, a leading semiconductor manufacturing company, in 2014, Samsung, Intel, and IBM, among others were previously using 300mm diameter wafers, are now switching to 450mm diameter wafer. As the size of wafer increases, it will further increase the number of dies cut from it, which in turn helps in reduction of production cost as well as product wastage while slicing process. Therefore, as the size of wafer increase, it need more efficient machine to provide accurate cuts, and produce more dies from a single wafer. High cost of machine is one of the major factor restraining growth of the market High cost of diamond wire wafer slicing machines is a major restraining factor for growth of the market. For instance, according to Coherent Market Insights’ analysis, the cost of 40HP Diamond Wire Machine is US$ 5088.75 per unit and cost of the 60HP Diamond Wire Machine is US$ 6563.75 per unit. Moreover, maintenance cost of these machines is also very high, which is another factor hampering growth of the market. To Get Discount on this Report: https://www.coherentmarketinsights.com/insight/request-discount/1864 © Coherent market Insights. All Rights Reserved

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