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AIDA Workpackage 9.4 Silicon Tracking

AIDA Workpackage 9.4 Silicon Tracking. AIDA Kick-Off meeting. Agenda. Work Package 9. Advanced infrastructure for detector R&D Scope: AIDA work package 9 provides advanced infrastructure to enable detector R&D for high energy physics experiments. [….]

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AIDA Workpackage 9.4 Silicon Tracking

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  1. AIDA Workpackage 9.4Silicon Tracking Thomas Bergauer (HEPHY Vienna) AIDA Kick-Off meeting

  2. Agenda Thomas Bergauer (HEPHY Vienna)

  3. Work Package 9 Advanced infrastructure for detector R&D • Scope: AIDA work package 9 provides advanced infrastructure to enable detector R&D for high energy physics experiments. • [….] • Each of these tasks is to provide common infrastructure that allows to evaluate and characterize detector prototypes developed either in the participating institutes or by users that do not belong to AIDA. AIDA Annex I - "Description of Work"- 2011-01-18 Thomas Bergauer (HEPHY Vienna)

  4. WP9.4 Silicon Tracking • Creation of a multi-layer micro-strip detector coverage for the calorimeter infrastructure of Task 9.5 to provide a precise entry point of charged particle • The calorimeter infrastructure of task 9.5 will be preceded by several layers of Silicon micro-strip detectors to provide a precise entry point over a largearea. Thomas Bergauer (HEPHY Vienna)

  5. WP9.4 Silicon Tracking • Finelysegmented and thin Silicon micro-strip detectors will be designed and procured by the participating institutes [OEAW; IPASCR (CUNI)]. • In the baseline design the system will be read out by electronicsdeveloped for the LHC experiments with established performance. [CSIC (IFCA, IFIC, UB)] • For optimal read-out of long ladders a custom IC with longer shaping time will be developed and validated. • Part of the ladders will be equipped with realistic services, including cooling, powering, alignment, structural and environmental monitoring. Thomas Bergauer (HEPHY Vienna)

  6. WP9.4 Deliverables and Milestones After 1st year: • MS39: Design of Silicon micro-strip ladders (Milestone; Report) [month 13: March 2012] After 4th year: • D9.5) Silicon micro-strip ladders: The Silicon micro-strip ladders are installed in front of the Calorimeter stack delivered by WP9.5. The pointing precision and timing performance are characterized. The devices remain available for the study of the calorimeter performance in case of overlapping showers. [month 39: May 2014] Thomas Bergauer (HEPHY Vienna)

  7. Questions • Where do we get the sensors to cover a “large area” and “several layers”? • Funding? • What does “large area” actually mean? • Input from Calorimetry needed (covered area, resolution needs) • Answer from Felix Sefkow: Size of the beam and 0.5 mm resolution • What does Multi-layer mean? • How many layers? • What is the energy/particle type of the beam test? (multiple scattering effects) • Double sided sensors vs. stacked single sided? Poly-Si 2D Sensors? Thomas Bergauer (HEPHY Vienna)

  8. Questions (cont.) • What readout chip is the best “electronics developed for the LHC experiments” ? • APV (CMS) or Beetle chip-based (Alibava) • Advantage/Disadvantages of CMS or Alibava readout (scalability,…) • What can be used from the SiLC readout chip developments? • Who continues with this? • Costs and funding? Thomas Bergauer (HEPHY Vienna)

  9. My ideas To concentrate in three things: • Sensor design and production • Module/Ladders with short strips and APV/Beetle readout • Module/Ladders with long strips and new/other readout chip Thomas Bergauer (HEPHY Vienna)

  10. Work to distribute • Sensor design (HEPHY, CNM?) • Procurement/Production of sensors (IPASCR, CNM) • Sensor characterization (HEPHY, CSIC) • Module/Ladder design (?) • Module/Ladder assembly (HEPHY + ?) • New readout chip developments (CSIC) • DAQ hardware for LHC Chip? • APV case (HEPHY) • Beetle case (CSIC) • DAQ Software -> CUNI? • Integration in common DAQ -> CUNI? • Testbeams (all) Thomas Bergauer (HEPHY Vienna)

  11. End. Thomas Bergauer (HEPHY Vienna)

  12. HEPHY Vienna: Status and Plans Thomas Bergauer (HEPHY Vienna) AIDA Kick-Off meeting

  13. Institute of High Energy Physics (HEPHY) Strong hardware groups (~1/3 of HEPHY): • Semiconductor Detectors • 8.25 FTE • Electronics • 10.15 FTE • Machine Shop • 2 FTE • Close collaboration among these groups Thomas Bergauer (HEPHY Vienna)

  14. Skills (1) Moduleconstruction Sensor Design Irradiation (n, g) Analysis Wire bonding Electrical characterization Thomas Bergauer (HEPHY Vienna)

  15. Skills (2) Schematics design, PCB layout Testing Assembly Machining Software development FPGA programming& simulation Beam tests Thomas Bergauer (HEPHY Vienna)

  16. Some of the Present Activities Belle II – Silicon Sensor Belle II – Origami Module CMS – Trigger upgrade ILC – TPC Envelope Module CMS – Track Trigger Module CMS – Pixel-FED Upgrade Thomas Bergauer (HEPHY Vienna)

  17. Design Flow Example 2010: Full cycle from design to test results completed within one year! New sensor design for Belle II New modules Electrical characterisation Inter-strip isolation layout must be improved Beam test Thomas Bergauer (HEPHY Vienna)

  18. Skills & Activities Summary • In principle we can do everything but chip design • However, we are limited in terms of money • Sensor procurement is not funded • DAQ/electronics is not funded Thomas Bergauer (HEPHY Vienna)

  19. AIDA interests: Sensors • Sensor and test structures design • Possible partners: • ONSemi (Vaclav) • CNM (Manolo) • Electrical characterization • Strip-by-strip tests • Process quality monitoring on test structures Thomas Bergauer (HEPHY Vienna)

  20. Our interests: Modules • Module assembly • support structures (simple sensor carrier) • Wire bonding • Metrology Thomas Bergauer (HEPHY Vienna)

  21. Our interests: DAQ and Software • APVDAQ system successfully used in several beam-tests together with EUDET telescope • TLU already integrated • Easy scalability by using more VME and DOCK boards • Currently standalone software using LabWindows/CVI only Thomas Bergauer (HEPHY Vienna)

  22. Summary • We have a well established software framework for sensor design • Funding for commercial sensor procurement not available • Module assembly/mechanics expertise • no alignment except geometrical metrology • No cooling other than using commercial chiller for chips • APVDAQ system used for several beam-tests • Software needed for integration into common DAQ Thomas Bergauer (HEPHY Vienna)

  23. End. Thomas Bergauer (HEPHY Vienna)

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