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HP Thermal Bubble Jet Printer

HP Thermal Bubble Jet Printer. Maran Ma Yuan Fang Ramneet Singh. Outline. History of Printer Technologies HP Bubble Jet Printer HP Print Head Fabrication Print Head Packaging & Circuitry Performance Analysis Conclusions. History. 1878 – Lord Rayleigh – droplet breakup

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HP Thermal Bubble Jet Printer

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  1. HP Thermal Bubble Jet Printer Maran Ma Yuan Fang Ramneet Singh

  2. Outline History of Printer Technologies HP Bubble Jet Printer HP Print Head Fabrication Print Head Packaging & Circuitry Performance Analysis Conclusions

  3. History • 1878 – Lord Rayleigh – droplet breakup • 1960 – Continuous ink-jet - stream broken into droplets via pressure wave pattern

  4. History (cont’d) • 1979 – Canon develops drop-on-demand thermal bubble-jet • 1984 – HP produces first commercial bubble-jet called ThinkJet

  5. HP’s Bubble-jet Advantage • HP’s print head is disposable – doesn’t sacrifice quality • Better quality due to frequent replacement • Allows for up to 4800x1200 dpi @ 24 ppm • Allows the use of pigmented ink for increased precision and superior fade performance

  6. Video clip on HP Cartridge

  7. Print Head Functional Requirements Store ink for each nozzle Heat ink drop via heater resistor Release ink at desired quantity & position

  8. HP Print Head Fabrication Reusable substrate: silicon or glass, with photoresist islands Orifice plate: nickel, via electroforming Orifice plate Photoresist island Reusable substrate • Integrated fabrication process, facilitates critical alignment of: • Ink reservoir • Heater resistor • Orifice plate

  9. HP Print Head Fabrication (cont’d) First insulating barrier: prevent shorting of resistor/conductor with orifice plate Heater resistors: narrow region of conductor R = Rs (L/A) Heater resistors – plan view Lead-in conductor Heater resistor Lead-in conductor Insulating barrier layer C-shaped heater resistor

  10. HP Print Head Fabrication (cont’d) Second insulating barrier: prevent corrosion of resistor/conductor by ink Seed layer: sputtered metal, etched to C shape Ink reservoir wall: nickel, via electroplating Substrate removal: peeling to unplug orifices Wall Seed pad hole Second insulatinglayer Insulating layer

  11. HP Print Head Fabrication (cont’d) Table 1. HP Bubble Jet print head fabrication procedure summary [8]

  12. HP Print Head Fabrication (cont’d) Lead-in conductor Heater resistor Lead-in conductor Ink reservoir Wall Second insulatingbarrier layer Seed pad C-shaped heater resistor First Insulating barrier layer Orifice (nozzle) Orifice plate C-shaped reservoir wall Hole • Print head structure – plan view: ink flow channels along A • MEMS fabricated print head structure prior to assembly with cartridge

  13. Print Head Packaging & Circuitry Packaging Ink supply chamber Electrical lead for circuit interfacing Electrical contact with lead-in conductor Lead-in conductor Ink supply chamber wall Dome of C-shaped ink reservoir wall • Print head soldered to ink supply chamber wall • Electrical contact bonded to exposed conductors

  14. Print Head Packaging & Circuitry (cont’d) • Circuitry

  15. Print Head Packaging & Circuitry (cont’d)

  16. Performance Analysis • Piezoelectric printers are susceptible to nozzle-clogging • TIJ use pigmented ink and pressure nozzle ejection Piezoelectric vs TIJ vs Laser print on plain paper TIJ vs Piezoelectric dots

  17. Colour Printing • dpi is not the best measure of performance • Rapid ejection of small dots is the key to quality printing (dps) • HP’s TIJ has a higher throughput • Smaller drop fluid chamber – more nozzles and higher firing frequency Epson PM750 1440 dpi, 65microns HP 2000C 600 dpi, 45microns

  18. Colour Printing (cont’d) Piezoelectric versus TIJ drops-per-second comparison

  19. Conclusions The Bubble jet print head is fabricated using MEMS technology Fabrication processes include: PECVD, LPCVD, photolithography, etching and sputtering Integrated design of the print head can increase reliability and reduce cost

  20. References [1] “Progress and Trends in Ink-jet Printing Technology”, Journal of Imaging Science and Technology, volume 42, Number 1, Janurary/Feburary 1998 [2] Vince Cabill, “Introduction to Digital Printing Technology”: http://www.techexchange.com/thelibrary/tchnlgy.pdf [March 7 2005] [3] “HP Business Inkjet 2800 Printer Series, Technical Specifications”, Hewlett-Packard Development Company [August 2005] [4] “Piezoelectric Process”, PDS Consulting: http://www.pdsconsulting.co.uk/Images/Process/Piezelectric%20Process.jpg [May 8, 2006]. [5] David B. Wallace, Donald J. Hayes and Christopher J. Fredrickson, "Ink-Jet Based Fluid Microdispensing for High Throughput Drug Discovery," March 2008, http://www.microfab.com/about/papers/chibook/chi_book.htm [6] Inkjet Workshop, “Tutorials – Definitions,” March 2008, http://www.inkjetworkshop.com/definitions.html [7] Stephen D. Senturia, Microsystem Design. New York: Springer, 2001. [8] Eldurkar V. Bhaskar and Marzio A. Leban, “Integrated Thermal Ink Jet Printhead and Method of Manufacture” US Patent 4847630, July 11, 1989 [9] C. S. Chan and Robert R. Hay, “Barrier Layer and Orifice Plate for Thermal Ink Jet Printhead Assembly” US Patent 4694308, September 15, 1987 [10] Richard A. Murray, “Printer Ink Cartridge with Drive Logic Integrated Circuit” US Patent 5646660, July 8, 1997

  21. Questions?

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