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THEMIS INSTRUMENT SUITE FM2/FM3 PRE-SHIP REVIEW FM4/FM5 PRE-ENVIRONMENTAL REVIEW ESA Dr. Chuck Carlson University of California - Berkeley. Outline. Summary of ESA Status at FM2/3 PSR and FM4/5 PER Final Test and Cal Results vs. Requirement Fulfillment PFRs Open Items. ESA Status.
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THEMIS INSTRUMENT SUITE • FM2/FM3 PRE-SHIP REVIEW • FM4/FM5 PRE-ENVIRONMENTAL REVIEW • ESA • Dr. Chuck Carlson • University of California - Berkeley
Outline • Summary of ESA Status at FM2/3 PSR and FM4/5 PER • Final Test and Cal Results vs. Requirement Fulfillment • PFRs • Open Items
ESA Status • Requirements and Design: • No major changes to Requirements or Design since M-CDR • No RFAs from previous reviews outstanding • Procurement: • All procurement is complete. • Assembly and Test: • 5 ESA mechanical assemblies complete • 6 sets of High Voltage power supplies complete and tested • 6 HV mother boards assembled and tested with HV supplies • 12 anodes (6 sets) assembled and tested with MCPs • 5 Preamp boards complete; 3 tested in complete units • 5 HV Interface boards complete; 3 tested in complete units • FM1-FM5 assembled • FM1-FM2 calibrated • 6 LVPS built and tested
ESA Requirements • ESA Mission Requirements Fulfillment: • MRD fulfillment noted in THEMIS Verification Matrix (see MSE Presentation) • Integrated ESA and component parts compliant with mission requirements
Results of FM2 ESA Calibration • Energy/Angle response confirmed • MCP Gain characteristics tested and successful • MCP Noise – working on fixing low level noise issue • Anode response tested and confirmed • End-to-end performance has been verified
PFR Status • ESA PFR List: • All ESA PFRs have been Closed except PFR 071 (spare) and PFR 106 • PFR 106 – currently testing modified grounding scheme to eliminate noise pick-up
Open Items • ESA Calibration check still to be done • ESA calibration confirmation after Environmental Testing
Back-up: EIDP Electrical • THEMIS ESA (BINDER #25): • Includes THEMIS Coat and Stake Log, Mixing Records, Assembly Instructions, Schematics, Board Layouts, Repair/Rework Instructions, Inspection Reports, Bill of Materials and Magnetics Test Procedures (LVPS and HVPS only) for: • Mother Board • Sweep I/F Board • Pre-Amp Board • HVPS and HVNS Boards • LVPS Board (assembled and tested at SWRI) • Anodes THAN and TLAN
Back-up: EIDP Mechanical • THEMIS ESA (BINDER #26): • List of Mechanical Assembly Procedures • Assembly Records • Assembly Report Sheet • Vibration Test Procedure and Report • Mechanical Drawing Tree • Master As-Built Mechanical Drawings