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C osmic dust R eflectron for I sotopic A nalysis

C osmic dust R eflectron for I sotopic A nalysis. LAMA. (A cria is a baby llama). CRIA. Dust in Space!. Space dust provides important clues on the formation and composition of our solar system as well as other stars.

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C osmic dust R eflectron for I sotopic A nalysis

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  1. Cosmic dust Reflectron for Isotopic Analysis LAMA (A cria is a baby llama) CRIA

  2. Dust in Space! Space dust provides important clues on the formation and composition of our solar system as well as other stars. Several instruments have been launched on past missions to analyze the flux and composition of space dust in-situ.

  3. Time-Of-Flight (TOF) Mass Spectrometers • Dust is ionized against a target and accelerated through an electric field to a detector. • Ion mass is inferred from Time-Of-Flight. CDA CIDA

  4. Time-Of-Flight (TOF) Mass Spectrometers • Large target area • Low mass resolution • High mass resolution • Small target area CDA CIDA

  5. Large Area Mass Analyzer

  6. Large Area Mass Analyzer • TOF Mass Spectrometer • Large target area comparable to CDA. • High mass resolution comparable to CIDA. • Lab prototype constructed and tested.

  7. LAMA: What is still needed for dust astronomy? Several tasks have yet to be completed: • Create a dust triggering system • Create a decontamination system • Show instrument can survive in space DTS

  8. How does a TOF mass spec work?

  9. CRIA: Mass Analyzer Primary Subsystems IONIZER Target

  10. CRIA: Mass Analyzer Primary Subsystems ANALYZER (Ion Optics) Annular Grid Electrodes Ring Electrodes Grounded Grid Target

  11. CRIA: Mass Analyzer Primary Subsystems DETECTOR Detector

  12. Example Spectrum CRIA Concept: Operation incoming dust particle Example Dust Composition Key Species-1 Species-2 Species-3 Target Increasing mass

  13. Example Spectrum CRIA Concept: Operation negative ions and electrons accelerated to target target material also ionizes dust impacts target and ionizes (triggert0) t0

  14. Example Spectrum CRIA Concept: Operation positive ions accelerated towards grounded grid (triggert1) Ions of Species-1, Species-2, Species-3, and Target Material t0 t0 t1 t1

  15. Example Spectrum CRIA Concept: Operation Positively charged particles focused towards detector t0 t1

  16. Example Spectrum CRIA Concept: Operation Species-1 ions arrive at detector Ions of the same species arrive at the detector at the same time with some spread Species-1 arrives at detector t0 t1 t2

  17. Example Spectrum CRIA Concept: Operation Species-2 ions arrive at detector Species-2 arrives at detector t3 t0 t1 t2

  18. Example Spectrum CRIA Concept: Operation Species-3 ions arrive at detector Species-3 arrives at detector t3 t4 t0 t1 t2

  19. Example Spectrum CRIA Concept: Operation Target material ions arrive at detector m/Δm: mass resolution Target material has characteristic peak t3 t4 t5 t0 t1 t2

  20. CRIA Project Phases 1 Design Build, Assembly, & Integration 2 3 Testing

  21. Analyzer Thermal Structures Detector Ionizer Electronics/CDH CRIA Design Design is complete for all subsystems. However, certain design elements will need to be revisited during the build/assembly/integration phase.

  22. Dan Baker (~6ft tall man) LAMA (struc support) CRIA models Project Motivation Scale down LAMA to a size better suited for inclusion on missions of opportunity. Improve the Technological Readiness Level (TRL) of the LAMA concept from TRL 4 to TRL 5. CRIA LAMA

  23. Structure: Main Assembly Main Housing Assembly Detector Assembly Target Assembly Annular Electrode Assembly

  24. Annular Electrode Support Annular Electrode Mount Annular Electrodes Ring Electrodes Target Electrodes Ring Electrode Standoffs Grounded Grid Target Hexagonal Base Detector Structure: Parts Summary

  25. Structure: Main Housing Assembly

  26. CRIA Build, Assembly, & Integration • Machining: • All ring electrodes • All of Detector Assembly • Electronics boxes • All Insulator pieces • Adapter plate for testing • Mechanical Assembly: • Test Plan for assembly testing • Wire harnessing • Solder connection from electronics assembly to electrodes • Pre-test cleanliness requirements met • Electronics work: • Component testing • Voltage divider assembly • CSA and VD testing

  27. High Voltage – Ion Optics Heater/CSA Cable Layout

  28. Cable Layout: Solder Access

  29. Mechanical Ground Support Equipment Interfaces • Remove-before-flight cover • Thermal Vacuum/Vibration Adapter Plate

  30. CRIA Testing • Two test will be performed by December: • Vacuum Chamber • Thermal Vacuum Chamber (TVAC) • Vibration Testing (potentially done by LASP) • Pre-Test Work: • Test Plan for TVAC includes setup of laser in chamber • Potentially use Bakeout chamber at LASP • Acquire necessary hardware • Data acquisition / data reduction • Testing Work: • Man hours testing in both Vac and TVAC tests • Acquire data • Write report

  31. Schedule Machining Testing Test Plan / Documentation Assembly

  32. Organizational Structure Customer Z. Sternovsky Administration System Engineer Project Manager L. Brower Student Lead D. Turner CU AdvisorsX. Li S. Palo ProfessionalM. Lankton (LASP) ProfessionalP. Graf Manufacturing Structures Thermal Electronics Student LeadD. Turner Student LeadL. Brower Student LeadW. Tu Professional M. Rhode (CU) Professional S. Steg (LASP) Professional B. Lamprecht (LASP) Professional V. Hoxie (LASP) Materials Ion Optics Detector Student LeadD. Lee Student LeadL. Chang Student LeadD. Turner Professional G. Drake (LASP) Experienced Graduate K. Amyx (CU) Professional G. Drake (LASP)

  33. Let’s sign up for interviews!

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