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IC Fabrication Overview 10 and 12 February 2014 Silicon Wafer Production

IC Fabrication Overview 10 and 12 February 2014 Silicon Wafer Production. Raw material ― Polysilicon nuggets purified from sand. Si crystal ingot. Crystal pulling. Slicing into Si wafers using a diamond saw. A silicon wafer fabricated with microelectronic circuits.

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IC Fabrication Overview 10 and 12 February 2014 Silicon Wafer Production

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  1. IC Fabrication Overview 10 and 12 February 2014 Silicon Wafer Production Raw material ― Polysilicon nuggets purified from sand Si crystal ingot Crystal pulling Slicing into Si wafers using a diamond saw A silicon wafer fabricated with microelectronic circuits Final wafer product after polishing, cleaning and inspection 1

  2. TOPICS • What is a Monolithic Integrated Circuit (IC)? • Dimensions • State-of-the-art in size and density • Materials • Basic process sequence • Photolithography • Define some key terms • Typical Device Cross-Sections • Packaging

  3. BASIC PROCESSING STEPSDesign ThenRepeated Application Of: Oxidation and/orNitridation Photolithography Wet Etching (Chemical) Dry Etching (Plasma) Ion Implantation and/or Diffusion Evaporation Sputtering Plasma Assisted Deposition Epitaxy Many Processing Steps are at temperatures to 1200°C

  4. OTHER DEVICES AND TECHNOLOGIES Thin-Film Transistors (TFT) Displays-Liquid Crystal Displays (LCD), Plasma, LED Backlit, etc. Photonic-Light Emitting Diodes (LED), Organic Light Emitting Diodes (OLED), LASERS, Optical Chips, etc.) Photovoltaics-Conventional Crystalline and Flexible Thin-Film Devices and Systems on Flexible Substrates Micro-Electro-Mechanical Systems (MEMS) integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. Electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes) Micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.

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